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11. 发明授权

US06180874B2 High density heatsink attachment and method therefor 失效
标题翻译：高密度散热器附件及其方法
公开(公告)号：US06180874B2
公开(公告)日：2001-01-30
申请号：US09097891
申请日：1998-06-15
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
IPC分类号： H01L2326
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.
摘要翻译：将不同散热器的阵列安装到紧密堆叠的处理器阵列，高速缓存控制器设备以及在数据处理系统内使用的任何其他类型的数据处理元件的装置和方法。该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。金属框架具有允许访问下面的数据处理元件的顶部的多个孔。金属框架用作用于多个散热器的容纳车辆，并且还提供刚性，其特征在于在设备附接到印刷电路板的拐角特别脆弱的附近的印刷电路板。

12. 发明授权

US5808236A High density heatsink attachment 失效
标题翻译：高密度散热器附件
公开(公告)号：US5808236A
公开(公告)日：1998-09-15
申请号：US827745
申请日：1997-04-10
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
IPC分类号： H01L23/40 , H01L23/26
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.
摘要翻译：因此，装置和方法将不同散热器的阵列安装到在数据处理系统内使用的数据处理元件的紧密排列的阵列。该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。金属框架具有允许访问下面的数据处理元件的顶部的多个孔。金属框架用作用于多个散热器的容纳车辆，并且还将其中设备附接到印刷电路板的拐角的特别脆弱的附近的印刷电路板提供刚性。

13. 发明授权

US06911836B2 Apparatus for functional and stress testing of exposed chip land grid array devices 失效
标题翻译：暴露芯片阵列阵列器件的功能和应力测试仪器
公开(公告)号：US06911836B2
公开(公告)日：2005-06-28
申请号：US10645038
申请日：2003-08-21
申请人： Lonnie J. Cannon , John Saunders Corbin, Jr. , David Lewis Gardell , Jose Arturo Garza , Jeffrey Frank Kutner , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , John Joseph Salazar
发明人： Lonnie J. Cannon , John Saunders Corbin, Jr. , David Lewis Gardell , Jose Arturo Garza , Jeffrey Frank Kutner , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , John Joseph Salazar
IPC分类号： G01R31/26
CPC分类号： G01R31/2891
摘要： A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.
摘要翻译：具有改善热性能的芯片测试系统。在优选实施例中，芯片测试装置的嵌套组件包括工具球和用于改善冷板和芯片表面的对准的装配框架。在优选实施例中，冷板具有一体设计。通过使用可调节软管安装支架平衡施加在冷板上的力，也可以提高热性能。支架允许由软管施加在冷板上的力进行调节，从而平衡并消除冷板上的其他不必要的力。

14. 发明授权

US5738531A Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer 失效
标题翻译：用于通过树枝状插入器连接球栅阵列器件的自对准低剖面插座
公开(公告)号：US5738531A
公开(公告)日：1998-04-14
申请号：US709960
申请日：1996-09-09
申请人： Daniel Paul Beaman , John Saunders Corbin, Jr. , Danny Edward Massey
发明人： Daniel Paul Beaman , John Saunders Corbin, Jr. , Danny Edward Massey
IPC分类号： G01R1/04 , H01L23/40 , H01L23/498 , H01R12/51 , H05K1/14 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1061 , G01R1/0483 , H01L23/4093 , H01L23/49827 , H05K3/325 , H01L2224/16 , H01L2224/16225 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/15311 , H01L2924/3011 , H05K1/141
摘要： A self-aligning low profile socket for connecting a ball grid array type device through a dendritic interposer to a printed circuit board, the socket providing resources for attaching a heat sink to the electronic device with minimum thermal impedance. Compressive forces are evenly distributed over the pattern of the interposer array, and thermal conductivity is provided between the top of the electronic device and a heat sink, through the use of complementary concave and convex surfaces engaged by a flat screw mechanism. The socket exhibits a low profile while providing the flexibility of a dendritic interposer and effective heat sink attachment.
摘要翻译：一种用于将球栅阵列型器件通过树枝状插入器连接到印刷电路板的自对准薄型插座，该插座提供用于以最小的热阻抗将散热器附接到电子器件的资源。压缩力均匀分布在插入器阵列的图形上，并且通过使用由平螺钉机构接合的互补的凹凸表面，在电子器件的顶部和散热器之间提供导热性。插座表现出低调，同时提供树枝状插入件的灵活性和有效的散热器附件。

15. 发明授权

US5675889A Solder ball connections and assembly process 失效
标题翻译：焊球连接和组装过程
公开(公告)号：US5675889A
公开(公告)日：1997-10-14
申请号：US474343
申请日：1995-06-07
申请人： John Acocella , Donald Ray Banks , Joseph Angelo Benenati , Thomas Caulfield , John Saunders Corbin, Jr. , Karl Grant Hoebener , David P. Watson
发明人： John Acocella , Donald Ray Banks , Joseph Angelo Benenati , Thomas Caulfield , John Saunders Corbin, Jr. , Karl Grant Hoebener , David P. Watson
IPC分类号： B23K1/00 , H01L21/48 , H01L23/488 , H01L23/498 , H05K1/11 , H05K3/34 , H05K3/36 , H05K3/42
CPC分类号： B23K1/0008 , B23K1/0016 , H01L21/4853 , H01L21/486 , H01L23/488 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H05K1/114 , H05K3/3436 , H05K3/3478 , B23K2201/36 , B23K2201/40 , B23K2201/42 , H01L2224/81191 , H01L2224/814 , H01L2924/00013 , H01L2924/09701 , H05K2201/0215 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0415 , H05K2203/0455 , H05K2203/082 , H05K3/3452 , H05K3/42 , H05K3/429 , Y02P70/613 , Y10T29/49126 , Y10T29/49144
摘要： Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.
摘要翻译：制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。衬底被定位成与平行对置的矩阵定义成对的面对的接触。金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

16. 发明授权

US07345881B2 Non-influencing fastener for mounting a heat sink in contact with an electronic component 有权
标题翻译：用于安装与电子部件接触的散热器的不影响的紧固件
公开(公告)号：US07345881B2
公开(公告)日：2008-03-18
申请号：US11379417
申请日：2006-04-20
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Eric Alan Eckberg , James Dorance Gerken , Roger Duane Hamilton , Maurice Francis Holahan
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Eric Alan Eckberg , James Dorance Gerken , Roger Duane Hamilton , Maurice Francis Holahan
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2224/16225 , Y10T24/44017 , Y10T24/44026
摘要： A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.
摘要翻译：负载框架具有暴露电子部件的表面的开放区域。散热器设置在负载框架上并且具有与电子部件的表面热接触的表面。不影响的紧固件设置在散热器的孔内并且拧入负载框架中，以将散热器固定到负载框架上。非影响性紧固件包括具有头部的螺钉; 锥形环设置在螺钉的头部下方并具有锥形的下外周表面; 与锥形环的锥形下周面接合的密封环; 以及设置在密封环和负载框架之间的负载垫圈。通过将螺钉转入负载框架来压缩环使得密封环相对于散热器的孔膨胀。优选地，密封环具有弯曲的外表面。

17. 发明授权

US06792375B2 Apparatus, system, and method of determining loading characteristics on an integrated circuit module 失效
标题翻译：确定集成电路模块上负载特性的装置，系统和方法
公开(公告)号：US06792375B2
公开(公告)日：2004-09-14
申请号：US10286193
申请日：2002-11-01
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Arvind Kumar Sinha
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Arvind Kumar Sinha
IPC分类号： G06F1900
CPC分类号： G01M5/005 , G01R31/046
摘要： A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.
摘要翻译：一种便携式测试装置，其可与用于在耦合到电路板的集成电路组件上测试负载特性的施力装置一起操作。包括具有尺寸和形状以模拟待测试的集成电路组件的壳体组件; 联接成用于相对于壳体组件移动的加载元件，可与负载检测系统接合，用于响应于施加力的力施加的力而向其传递力; 将外壳组件与电路板配合的插入器; 以及负载检测系统，其与壳体组件相关联，用于提供表示由施力装置施加到其上的负载力的特性的信号，由此可以确定施力装置的负载传递特性。还提供了一种测试方法。

18. 发明授权

US06449155B1 Land grid array subassembly for multichip modules 失效
标题翻译：用于多芯片模块的Land Grid阵列子组件
公开(公告)号：US06449155B1
公开(公告)日：2002-09-10
申请号：US09927056
申请日：2001-08-09
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.
摘要翻译：公开了一种多芯片模块子组件，其提供散热器，热接口，安装多芯片模块的模块盖，平台栅格阵列插入件和组件盖。模块盖已经垫上了负载柱和可调节支架，用于将插入件精确对准和加载到模块上。盖可以具有用于将插入件精确地预加载到多芯片模块上用于运输的弹簧板。多芯片模块子组件可轻松用作现场可更换单元。

19. 发明授权

US06385044B1 Heat pipe heat sink assembly for cooling semiconductor chips 失效
标题翻译：用于冷却半导体芯片的热管散热器组件
公开(公告)号：US06385044B1
公开(公告)日：2002-05-07
申请号：US09917446
申请日：2001-07-27
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.
摘要翻译：公开了一种为安装在模块上的半导体芯片提供热管冷却的装置和方法。每个芯片都设有自己的热管用于冷却。每个热管的端部上的活塞以预定的力加载到每个芯片上，而不需要计数螺杆的转数或使用扭矩测量工具。每个热管将热量从其被加载的芯片上吸走，将热量传递到散热器以耗散到环境中。一个大的多芯片模块可以被加载到具有均匀的插入器负载的焊盘栅格阵列插入器上。该插入器负载独立于热管对芯片的负载而完成。

20. 发明授权

US06278615B1 Heatsink grounding spring and shield apparatus 失效
标题翻译：散热器接地弹簧和屏蔽装置
公开(公告)号：US06278615B1
公开(公告)日：2001-08-21
申请号：US09343452
申请日：1999-06-30
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
IPC分类号： H05K900
CPC分类号： H05K9/0039 , H01L23/433 , H01L23/552 , H01L2924/0002 , Y10T24/44923 , H01L2924/00
摘要： A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board. The force of the spring arms against the circuit board maintains the grounding piece ring in electrical contact with the heat sink and the termination points of the spring arms in electrical contact with the grounding plates.
摘要翻译：散热器接地机构及相关电路卡及计算机系统。电路卡包括连接到集成电路模块的印刷电路板。散热器被定位成与集成电路模块封装件接触或紧邻集成电路模块封装。使用接地机构的散热片接地片将散热器接地。接地件包括限定孔的大致矩形且导电的接地片环。尺寸适用于接收和规避集成电路模块。接地件包括远离接地片环延伸的一组半刚性导电弹簧臂。弹簧臂定位和定向，使得当接地片在散热器和电路板之间被压缩时，弹簧臂的端接点接触印刷电路板上的接地焊盘。弹簧臂抵靠电路板的力使接地片环与散热片电气接触，弹簧臂的端接点与接地板电接触。

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