专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06634802B2 Optical-electronic array module and method therefore 有权
标题翻译：因此，光电子阵列模块和方法
公开(公告)号：US06634802B2
公开(公告)日：2003-10-21
申请号：US09925593
申请日：2001-08-09
申请人： Johnny Roy Brezina , Brian Michael Kerrigan , Gerald Daniel Malagrino, Jr.
发明人： Johnny Roy Brezina , Brian Michael Kerrigan , Gerald Daniel Malagrino, Jr.
IPC分类号： G02B636
CPC分类号： G02B6/42 , G02B6/421 , G02B6/4224 , G02B6/4231 , G02B6/4246 , G02B6/4249 , G02B6/43
摘要： In one aspect of the invention, an assembly includes an optical-electronic die having electrically conductive pads and a submount with first and second opposing sides and a third side essentially perpendicular to the first submount side. The first and third submount sides have an adjoining edge, with electrically conductive pads on the first submount side bonded to the die pads, second electrically conductive pads on the third side of the submount, and electrically conductive traces interconnecting the first and second submount pads. The conductive traces are formed on the first and third sides and adjoining edge of the submount by a process that uses a shadow mask.
摘要翻译：在本发明的一个方面，一种组件包括具有导电焊盘的光电子管芯和具有第一和第二相对侧的基座以及基本上垂直于第一基座侧的第三侧。第一和第三基座侧面具有相邻的边缘，其中第一基座侧上的导电焊盘接合到管芯焊盘，在基座的第三侧上的第二导电焊盘以及将第一和第二基座焊盘互连的导电迹线。导电迹线通过使用荫罩的过程形成在子安装座的第一和第三侧和相邻边缘上。

2. 发明授权

US06278615B1 Heatsink grounding spring and shield apparatus 失效
标题翻译：散热器接地弹簧和屏蔽装置
公开(公告)号：US06278615B1
公开(公告)日：2001-08-21
申请号：US09343452
申请日：1999-06-30
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
IPC分类号： H05K900
CPC分类号： H05K9/0039 , H01L23/433 , H01L23/552 , H01L2924/0002 , Y10T24/44923 , H01L2924/00
摘要： A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board. The force of the spring arms against the circuit board maintains the grounding piece ring in electrical contact with the heat sink and the termination points of the spring arms in electrical contact with the grounding plates.
摘要翻译：散热器接地机构及相关电路卡及计算机系统。电路卡包括连接到集成电路模块的印刷电路板。散热器被定位成与集成电路模块封装件接触或紧邻集成电路模块封装。使用接地机构的散热片接地片将散热器接地。接地件包括限定孔的大致矩形且导电的接地片环。尺寸适用于接收和规避集成电路模块。接地件包括远离接地片环延伸的一组半刚性导电弹簧臂。弹簧臂定位和定向，使得当接地片在散热器和电路板之间被压缩时，弹簧臂的端接点接触印刷电路板上的接地焊盘。弹簧臂抵靠电路板的力使接地片环与散热片电气接触，弹簧臂的端接点与接地板电接触。

3. 发明授权

US06540414B1 Integrated optical coupler and housing arrangement 失效
标题翻译：集成光耦合器和外壳布置
公开(公告)号：US06540414B1
公开(公告)日：2003-04-01
申请号：US09970974
申请日：2001-10-05
申请人： Johnny Roy Brezina , Brian Michael Kerrigan , Gerald Daniel Malagrino, Jr. , James Robert Moon , Michael Lynn Zumbrunnen
发明人： Johnny Roy Brezina , Brian Michael Kerrigan , Gerald Daniel Malagrino, Jr. , James Robert Moon , Michael Lynn Zumbrunnen
IPC分类号： G02B636
CPC分类号： G02B6/4277 , G02B6/421 , G02B6/4292
摘要： An optical coupler and housing arrangement includes a housing portion adapted to receive an optical connector of a fiber optic cable, and further includes an optical coupler portion integrally formed with the housing portion. The optical coupler portion is adapted to transmit optical signals to and from the fiber optic cable. The optical coupler portion has a plurality of optical fibers for transmitting the optical signals. Each of the optical fibers extends from one end surface of the optical coupler portion to another end surface of the optical coupler portion. The housing portion has a recess for receiving the optical connector, with one of the end surfaces of the optical coupler portion forming a back surface of the recess.
摘要翻译：光耦合器和壳体布置包括适于容纳光纤电缆的光学连接器的壳体部分，并且还包括与壳体部分一体形成的光耦合器部分。光耦合器部分适于将光信号传输到光纤电缆和从光纤电缆传输光信号。光耦合器部分具有用于传输光信号的多个光纤。每个光纤从光耦合器部分的一个端面延伸到光耦合器部分的另一个端面。壳体部分具有用于接收光学连接器的凹部，光耦合器部分的一个端面形成凹部的后表面。

4. 发明授权

US5808236A High density heatsink attachment 失效
标题翻译：高密度散热器附件
公开(公告)号：US5808236A
公开(公告)日：1998-09-15
申请号：US827745
申请日：1997-04-10
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
IPC分类号： H01L23/40 , H01L23/26
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.
摘要翻译：因此，装置和方法将不同散热器的阵列安装到在数据处理系统内使用的数据处理元件的紧密排列的阵列。该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。金属框架具有允许访问下面的数据处理元件的顶部的多个孔。金属框架用作用于多个散热器的容纳车辆，并且还将其中设备附接到印刷电路板的拐角的特别脆弱的附近的印刷电路板提供刚性。

5. 发明授权

US06180874B2 High density heatsink attachment and method therefor 失效
标题翻译：高密度散热器附件及其方法
公开(公告)号：US06180874B2
公开(公告)日：2001-01-30
申请号：US09097891
申请日：1998-06-15
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
IPC分类号： H01L2326
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.
摘要翻译：将不同散热器的阵列安装到紧密堆叠的处理器阵列，高速缓存控制器设备以及在数据处理系统内使用的任何其他类型的数据处理元件的装置和方法。该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。金属框架具有允许访问下面的数据处理元件的顶部的多个孔。金属框架用作用于多个散热器的容纳车辆，并且还提供刚性，其特征在于在设备附接到印刷电路板的拐角特别脆弱的附近的印刷电路板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式