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    • 16. 发明授权
    • Treatment of supercritical fluid utilized in semiconductor manufacturing applications
    • 半导体制造应用中超临界流体的处理
    • US06735978B1
    • 2004-05-18
    • US10364558
    • 2003-02-11
    • Glenn M. TomMichael B. KorzenskiEliodor G. GhenciuChongying XuThomas H. Baum
    • Glenn M. TomMichael B. KorzenskiEliodor G. GhenciuChongying XuThomas H. Baum
    • F25D100
    • C01B32/50Y02P20/544
    • A system and process for utilization and disposition of a supercritical fluid composition, in which a supercritical fluid (SCF) composition is used in an SCF-using process facility such as a semiconductor manufacturing plant. The supercritical fluid composition is withdrawn from the process facility containing at least one component that is extraneous with respect to the further disposition of the supercritical fluid composition. The withdrawn supercritical fluid composition is converted to a pressurized liquid, which is treated to at least partially remove the extraneous component(s) therefrom. The extraneous component(s)-depleted pressurized liquid in its further disposition can be reconverted to a supercritical state for recycle to the SCF-using process facility, or it can be gasified and discharged to the atmosphere in the case of supercritical fluids such as CO2.
    • 一种用于利用和处置超临界流体组合物的系统和方法,其中超临界流体(SCF)组合物在诸如半导体制造厂的SCF使用过程设备中使用。 超临界流体组合物从处理设备中取出,其中含有至少一种相对于超临界流体组合物的进一步处置是无关的组分。 将取出的超临界流体组合物转化为加压液体,其被处理以至少部分地从其中除去外来成分。 在其进一步的处置中,去除加压液体的外来成分可以再转化为超临界状态,以再循环至使用SCF的工艺设备,或者在超临界流体如CO2的情况下,可将其气化并排放到大气中 。