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11. 发明申请

US20050236266A1 Sputter target monitoring system 审中-公开
标题翻译：溅射目标监测系统
公开(公告)号：US20050236266A1
公开(公告)日：2005-10-27
申请号：US10518293
申请日：2003-06-10
申请人： John Poole , Charles Wickersham
发明人： John Poole , Charles Wickersham
IPC分类号： C23C14/32 , C23C14/34 , C23C14/54 , H01J37/34
CPC分类号： H01J37/32935 , C23C14/34 , C23C14/54 , H01J37/34 , H01J37/3444 , H01J37/3482
摘要： A sputtering target monitoring system (20) for monitoring the status of a sputtering source target (22) during the sputtering process. The collection of data is initiated based on measured voltages in the sputtering source target (22), whereas the arcing count is determined based on current spikes or interruptions to the current in the sputtering source target (22) during the sputtering process. The real time data collected during the sputtering process is recorded and displayed in table or graphical format at any time during the sputtering process. Thus, problems in the sputtering process, or in the sputtering source (22), including an approaching end of life of the target may be easily ascertained. Alarms, messages or other indicators may be used to alert operators to problems or conditions during the sputtering process.
摘要翻译：一种用于在溅射过程中监测溅射源靶（22）的状态的溅射靶监测系统（20）。基于溅射源目标（22）中的测量电压来启动数据的收集，而基于溅射过程期间溅射源目标（22）中的电流的电流尖峰或中断来确定电弧计数。在溅射过程中随时记录和显示溅射过程中收集的实时数据，并以表格或图形格式显示。因此，可以容易地确定溅射工艺或溅射源（22）中包括目标寿命终止的问题。报警，消息或其他指示器可用于提醒操作员在溅射过程中的问题或条件。

12. 发明申请

US20050155456A1 Sputter targets and methods of manufacturing same to reduce particulate emission during sputtering 审中-公开
标题翻译：溅射靶及其制造方法，以减少溅射过程中的颗粒物排放
公开(公告)号：US20050155456A1
公开(公告)日：2005-07-21
申请号：US11063508
申请日：2005-02-23
申请人： Charles Wickersham , John Poole , Alexander Leybovich , Lin Zhu
发明人： Charles Wickersham , John Poole , Alexander Leybovich , Lin Zhu
IPC分类号： C22B21/06 , C22C21/02 , C22C21/14 , C23C14/34 , C23C14/56 , C22B9/02
CPC分类号： C22C21/14 , C22B21/06 , C22B21/066 , C22C21/02 , C23C14/3414 , C23C14/564
摘要： Methods for reducing inclusion content of sputter targets and targets so produced are disclosed. Inclusions may be reduced by adding a small amount of Si to the molten Al or molten Al alloy followed by filtering of the molten metals through a filter medium. Targets having substantially no inclusions therein of greater than about 400 μm are especially useful in the sputtering of large flat panel displays and result, upon sputtering, in a reduction in the amount of macroparticles sputtered onto the substrate.
摘要翻译：公开了减少如此制造的溅射靶和靶的夹杂物含量的方法。可以通过向熔融的Al或熔融的Al合金中加入少量的Si，然后通过过滤介质过滤熔融金属来减少夹杂物。基本上不具有大于约400μm的夹杂物的靶材在大平板显示器的溅射中是特别有用的，并且在溅射时导致溅射到衬底上的大颗粒量的减少。

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