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    • 14. 发明申请
    • Self-aligned top-gate thin film transistors and method for fabricating same
    • 自对准顶栅薄膜晶体管及其制造方法
    • US20120018718A1
    • 2012-01-26
    • US12927835
    • 2010-11-26
    • Hsiao-Wen ZanWei-Tsung ChenCheng-Wei ChouChuang-Chuang Tsai
    • Hsiao-Wen ZanWei-Tsung ChenCheng-Wei ChouChuang-Chuang Tsai
    • H01L29/12H01L21/04
    • H01L29/7869H01L29/42384H01L29/66969
    • A self-aligned top-gate thin film transistor and a fabrication method thereof. The method includes preparing a substrate having sequentially formed thereon an oxide semiconductor layer, a dielectric layer, and a metallic layer, wherein the oxide semiconductor layer includes first and second connecting regions that are not covered by the dielectric layer and the metallic layer thereon respectively, the first and second connecting regions having a property of a conductor after undergone a heating process or an ultraviolet irradiation; and a source electrode and a drain electrode formed on the substrate and connected to the first and second connecting regions, respectively. Therefore, the contact resistance of the first and second connecting regions can be reduced without the process of ion dopants as required by prior art techniques, thereby simplifying the manufacturing process. Also, the source electrode and the drain electrode can be exactly relocated and further increase performance of the device.
    • 一种自对准顶栅薄膜晶体管及其制造方法。 该方法包括制备其上依次形成有氧化物半导体层,电介质层和金属层的衬底,其中氧化物半导体层包括分别不被电介质层和金属层覆盖的第一和第二连接区域, 所述第一和第二连接区域在进行加热处理或紫外线照射之后具有导体的性质; 以及源极电极和漏电极,分别形成在所述基板上并连接到所述第一和第二连接区域。 因此,不需要现有技术所要求的离子掺杂剂的处理,可以减少第一和第二连接区域的接触电阻,从而简化了制造工艺。 此外,源电极和漏电极可以精确地定位并进一步提高器件的性能。
    • 17. 发明授权
    • Method of forming polysilicon thin film transistor structure
    • 多晶硅薄膜晶体管结构的形成方法
    • US06410373B1
    • 2002-06-25
    • US09845438
    • 2001-04-30
    • Ting-Chang ChangHsiao-Wen ZanPo-Sheng Shih
    • Ting-Chang ChangHsiao-Wen ZanPo-Sheng Shih
    • H01L2100
    • H01L29/66757H01L29/78621H01L29/78627H01L29/78666H01L29/78684
    • A method of forming a polysilicon thin film transistor. An amorphous silicon channel layer is formed over an insulating substrate. An active region is patterned out in the amorphous silicon channel layer. An oxide layer and a gate electrode are sequentially formed over the amorphous silicon channel layer. A lightly doped source/drain region is formed in the amorphous silicon channel layer and then a spacer is formed over the gate electrode. A source/drain region is formed in the amorphous silicon channel layer. A portion of the oxide layer above the source/drain region is removed. An isolation spacer is formed on the sidewalls of the spacer. A self-aligned silicide layer is formed at the top section of the spacer and the source/drain region. Finally, a metal-induced lateral crystallization process is conducted to transform the amorphous silicon channel layer into a lateral-crystallization-polysilicon channel layer.
    • 一种形成多晶硅薄膜晶体管的方法。 在绝缘基板上形成非晶硅沟道层。 在非晶硅沟道层中形成有源区。 在非晶硅沟道层上依次形成氧化物层和栅电极。 在非晶硅沟道层中形成轻掺杂的源极/漏极区,然后在栅极上形成间隔物。 源极/漏极区域形成在非晶硅沟道层中。 除去源极/漏极区上方的氧化物层的一部分。 在间隔物的侧壁上形成隔离间隔物。 在间隔物的顶部和源极/漏极区域上形成自对准的硅化物层。 最后,进行金属诱导的横向结晶工艺以将非晶硅沟道层转变成横向结晶 - 多晶硅沟道层。
    • 19. 发明授权
    • Polysilicon thin film transistor structure
    • 多晶硅薄膜晶体管结构
    • US06486496B2
    • 2002-11-26
    • US09994322
    • 2001-11-26
    • Ting-Chang ChangHsiao-Wen ZanPo-Sheng Shih
    • Ting-Chang ChangHsiao-Wen ZanPo-Sheng Shih
    • H01L21108
    • H01L29/66757H01L29/78621H01L29/78627H01L29/78666H01L29/78684
    • A method of forming a polysilicon thin film transistor. An amorphous silicon channel layer is formed over an insulating substrate. An active region is patterned out in the amorphous silicon channel layer. An oxide layer and a gate electrode are sequentially formed over the amorphous silicon channel layer. A lightly doped source/drain region is formed in the amorphous silicon channel layer and then a spacer is formed over the gate electrode. A source/drain region is formed in the amorphous silicon channel layer. A portion of the oxide layer above the source/drain region is removed. An isolation spacer is formed on the sidewalls of the spacer. A self-aligned silicide layer is formed at the top section of the spacer and the source/drain region. Finally, a metal-induced lateral crystallization process is conducted to transform the amorphous silicon channel layer into a lateral-crystallization-polysilicon channel layer.
    • 一种形成多晶硅薄膜晶体管的方法。 在绝缘基板上形成非晶硅沟道层。 在非晶硅沟道层中形成有源区。 在非晶硅沟道层上依次形成氧化物层和栅电极。 在非晶硅沟道层中形成轻掺杂的源极/漏极区,然后在栅极上形成间隔物。 源极/漏极区域形成在非晶硅沟道层中。 除去源极/漏极区上方的氧化物层的一部分。 在间隔物的侧壁上形成隔离间隔物。 在间隔物的顶部和源极/漏极区域上形成自对准的硅化物层。 最后,进行金属诱导的横向结晶工艺以将非晶硅沟道层转变成横向结晶 - 多晶硅沟道层。