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11. 发明授权

US07501710B2 Semiconductor integrated circuit and method of manufacturing the same 失效
标题翻译：半导体集成电路及其制造方法
公开(公告)号：US07501710B2
公开(公告)日：2009-03-10
申请号：US11333297
申请日：2006-01-18
申请人： Shigeru Nonoyama , Naoto Ueda
发明人： Shigeru Nonoyama , Naoto Ueda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L27/0207 , H01L23/50 , H01L24/03 , H01L24/05 , H01L24/06 , H01L27/11898 , H01L2224/02166 , H01L2224/05093 , H01L2224/05096 , H01L2224/05552 , H01L2224/05554 , H01L2224/05624 , H01L2224/06051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).
摘要翻译：一种具有集成电路区域（1a）的半导体集成电路（1）和多个具有用于从元件形成区域进行外部电连接的元件形成区域的I / O单元（6）。输入/输出信号电极焊盘（3），电源电极焊盘（4）和GND电极焊盘（5）放置在每个I / O电池（6）的元件形成区域上。

12. 发明申请

US20070073783A1 Snapshot management apparatus and method, and storage system 有权
标题翻译：快照管理装置及方法及存储系统
公开(公告)号：US20070073783A1
公开(公告)日：2007-03-29
申请号：US11285203
申请日：2005-11-23
申请人： Koji Honami , Motoaki Satoyama , Naohiro Fujii , Naoto Ueda
发明人： Koji Honami , Motoaki Satoyama , Naohiro Fujii , Naoto Ueda
IPC分类号： G06F17/30
CPC分类号： G06F17/30088 , G06F2201/84 , Y10S707/99953
摘要： Proposed are: a high-performance and highly-reliable snapshot management apparatus and method, and storage system, that can prevent the adverse influence of overhead when they retain a multiplicity of snapshots. An operational volume is set in a storage area provided by a first storage apparatus and a difference volume is set in a storage area provided by a second storage apparatus. In response to data writing to the operational volume, difference data is saved in the difference volume and a management table for it is created, and each snapshot is managed according to the management table. This management table is divided according to one or more snapshots in accordance with the snapshot creation time; and if there is more than one management table, the second and any following management tables store specified inheritance information to inherit the content of the preceding management tables.
摘要翻译：提出的是：高性能和高可靠性的快照管理设备和方法以及存储系统，可以防止在保留多个快照时开销的不利影响。在由第一存储装置提供的存储区域中设置操作量，并且将差异体积设置在由第二存储装置提供的存储区域中。响应于对操作卷的数据写入，将差异数据保存在差异卷中，并创建管理表，并根据管理表对每个快照进行管理。该管理表根据快照创建时间根据一个或多个快照进行划分; 并且如果存在多个管理表，则第二和任何以下管理表存储指定的继承信息以继承前述管理表的内容。

13. 发明授权

US06768516B2 Semiconductor device constituting a CMOS camera system 有权
标题翻译：构成CMOS照相机系统的半导体装置
公开(公告)号：US06768516B2
公开(公告)日：2004-07-27
申请号：US09732925
申请日：2000-12-11
申请人： Satoshi Yamada , Michitaka Kimura , Naoto Ueda , Masatoshi Yasunaga
发明人： Satoshi Yamada , Michitaka Kimura , Naoto Ueda , Masatoshi Yasunaga
IPC分类号： H04N5225
CPC分类号： H04N5/2257 , H01L27/14618 , H01L27/14625 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： The invention is intended for rendering a CMOS camera compact and less costly. A semiconductor device constituting a CMOS camera system includes a lens unit which includes a wiring board having an image pick-up opening formed therein and a lens, and the lens is provided on one side of the wiring board and positioned opposite the image pick-up opening. An image pick-up semiconductor is provided on the other side of the wiring board, and is positioned opposite the image pick-up opening, and is connected to a connection section of the wiring board by means of flip-chip bonding. An image processing semiconductor is connected by means of flip-chip bonding to another connection section provided on the other side of the wiring board, and processes an image signal output from the image pick-up semiconductor.
摘要翻译：本发明旨在使CMOS相机紧凑且成本更低。构成CMOS照相机系统的半导体器件包括透镜单元，该透镜单元包括其中形成有摄像开口的布线板和透镜，并且透镜设置在布线板的一侧并与图像拾取器相对定位开放在接线板的另一侧设置摄像半导体，与摄像开口相对设置，并通过倒装芯片接合而与布线基板的连接部连接。图像处理半导体通过倒装芯片接合连接到设置在布线板的另一侧的另一连接部分，并处理从摄像半导体输出的图像信号。

14. 发明授权

US5900582A Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame 失效
标题翻译：引线框架包括用于片上芯片（LOC）半导体器件的框架切割狭缝和结合引线框架的半导体器件
公开(公告)号：US5900582A
公开(公告)日：1999-05-04
申请号：US50397
申请日：1998-03-31
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01L23/28
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.
摘要翻译：一种用于制造半导体器件的引线框架，其具有穿过半导体芯片的引线引线芯片（LOC）结构，所述引线框架包括用于具有外框部分的管芯焊盘的框架，从所述外框架部分移位的管芯焊盘，以及悬挂引线，其将所述管芯焊盘连接到所述外框部，所述管芯焊盘设置在所述外框部内部; 以及用于引线的框架，所述框架包括外框架部分和从所述外框架部分的相对侧延伸的引线，所述引线连接到所述用于芯片焊盘的框架，所述芯片焊盘连接到所述悬挂引线的引线框架，其中，用于管芯焊盘的框架和用于引线的框架包括突起，并且用于管芯焊盘的框架中的另一个，用于引线的框架包括孔，孔接收突起，突起平行于引线的框架设置，连接用于芯片的框架用于引线的框架。

15. 发明授权

US5763829A Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe 失效
标题翻译：引线框架包括用于片上芯片（LOC）半导体器件的框架切割狭缝和结合引线框架的半导体器件
公开(公告)号：US5763829A
公开(公告)日：1998-06-09
申请号：US506852
申请日：1995-07-25
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01L23/02
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.
摘要翻译：高可靠性半导体器件及其制造方法。通过使用诸如不具有吸湿性的普通焊料等硬焊料材料将半导体芯片芯片接合到管芯焊盘，有效地避免了将水分吸收到半导体器件中。因此，在根据本发明的半导体器件中，由于吸收的水分而没有腐蚀问题和包装破裂。

16. 发明授权

US09411292B2 Image forming apparatus, image forming method, and computer-readable recording medium 有权
标题翻译：图像形成装置，图像形成方法和计算机可读记录介质
公开(公告)号：US09411292B2
公开(公告)日：2016-08-09
申请号：US13950978
申请日：2013-07-25
申请人： Makoto Nakura , Naoto Ueda , Satoshi Ueda , Shingo Takai , Koichi Kudo
发明人： Makoto Nakura , Naoto Ueda , Satoshi Ueda , Shingo Takai , Koichi Kudo
IPC分类号： G06F3/12 , G06F15/00 , G06K15/02 , B41C1/02 , H04N1/405 , G03G15/00 , G03G15/23 , H04N1/00 , H04N1/393
CPC分类号： G03G15/607 , G03G15/235 , G03G15/5095 , H04N1/00034 , H04N1/00047 , H04N1/0005 , H04N1/00063 , H04N1/00087 , H04N1/00713 , H04N1/00732 , H04N1/00734 , H04N1/00745 , H04N1/00779 , H04N1/00793 , H04N1/393 , H04N2201/0082
摘要： An image forming apparatus includes an image forming unit forming an image on a first recording medium based on image data, a measurement unit being positioned in an immediate vicinity of the image forming unit, being arranged upstream of a sheet-conveyance path than the image forming unit, and measuring a size of the first recording medium, an expansion ratio calculation unit calculating an expansion ratio of the first recording medium based on a first size of the first recording medium obtained before the first recording medium is passed through the image forming unit and a second size of the first recording medium obtained after the first recording medium is passed through the image forming unit, and a correction unit correcting the image data used for forming another image on a second recording medium conveyed after the first recording medium based on the expansion ratio.
摘要翻译：图像形成装置包括基于图像数据在第一记录介质上形成图像的图像形成单元，位于图像形成单元附近的测量单元，布置在比图像形成的纸张传送路径的上游单位，并且测量第一记录介质的尺寸;扩展比计算单元，基于在第一记录介质通过图像形成单元之前获得的第一记录介质的第一尺寸，计算第一记录介质的扩展比;以及在第一记录介质通过图像形成单元之后获得的第一记录介质的第二尺寸，以及校正单元，用于校正用于在基于扩展的第一记录介质之后传送的第二记录介质上形成另一图像的图像数据比。

17. 发明授权

US09354537B2 Image forming apparatus for calculating shape of recording medium based on angles between conveying direction and straight lines using upstream and downstream detectors 有权
标题翻译：用于使用上游和下游检测器基于输送方向和直线之间的角度计算记录介质的形状的图像形成装置
公开(公告)号：US09354537B2
公开(公告)日：2016-05-31
申请号：US13951007
申请日：2013-07-25
申请人： Naoto Ueda , Makoto Nakura , Shingo Takai , Satoshi Ueda , Koichi Kudo
发明人： Naoto Ueda , Makoto Nakura , Shingo Takai , Satoshi Ueda , Koichi Kudo
IPC分类号： G06K15/16 , G03G15/01 , G03G15/00
CPC分类号： G03G15/0131 , G03G15/0189 , G03G15/6567
摘要： An image forming apparatus includes an image forming unit that forms an image on a recording medium; a width detector that detects positions of side edges of the recording medium in a width direction, which is orthogonal to a conveying direction in which the recording medium is conveyed, at multiple detection positions along the conveying direction; a shape calculator that calculates angles between the conveying direction and straight lines each connecting the positions of the same side edge detected at the multiple detection positions and calculates a shape of the recording medium based on the angles; and a correction unit that corrects image data of the image to be formed by the image forming unit based on the calculated shape of the recording medium.
摘要翻译：图像形成装置包括在记录介质上形成图像的图像形成单元; 宽度检测器，沿着所述输送方向检测与所述记录介质被输送的传送方向正交的宽度方向上的记录介质的侧边缘的位置; 计算器，其计算输送方向与连接在多个检测位置检测到的同一侧边缘的位置的直线之间的角度，并基于角度计算记录介质的形状; 以及校正单元，其基于计算出的记录介质的形状校正由图像形成单元形成的图像的图像数据。

18. 发明授权

US08838010B2 Sheet conveying apparatus, image forming apparatus, sheet conveying distance calculation apparatus and sheet length calculation apparatus 有权
标题翻译：片材输送装置，图像形成装置，片材输送距离计算装置和片材长度计算装置
公开(公告)号：US08838010B2
公开(公告)日：2014-09-16
申请号：US13559837
申请日：2012-07-27
申请人： Makoto Nakura , Takuro Kamiya , Shingo Takai , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Koichi Kudo
发明人： Makoto Nakura , Takuro Kamiya , Shingo Takai , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Koichi Kudo
IPC分类号： G03G15/00 , B65H5/06 , G03G15/16 , B65H7/14 , B65H7/20 , G03G15/23 , G03G15/01
CPC分类号： G03G15/6529 , B65H5/06 , B65H5/062 , B65H7/06 , B65H7/14 , B65H7/20 , B65H2511/11 , B65H2511/33 , B65H2513/50 , B65H2553/51 , B65H2701/1311 , B65H2701/1313 , G03G15/0189 , G03G15/1615 , G03G15/234 , G03G15/6561 , B65H2220/01 , B65H2220/03 , B65H2220/02
摘要： A sheet conveying apparatus includes a sheet conveying unit that conveys a sheet; a conveying amount measuring unit that measures a conveying amount of the sheet conveyed by the sheet conveying unit; a first detection unit that detects the sheet downstream of the sheet conveying unit in a conveying direction of the sheet; a second detection unit that detects the sheet upstream of the sheet conveying unit in the conveying direction of the sheet; and a conveying distance calculation unit that calculates a conveying distance of the sheet based on the measured result by the conveying amount measuring unit and the detected results detected by the first detection unit and the second detection unit.
摘要翻译：片材输送装置包括输送片材的片材输送单元; 输送量测量单元，其测量由所述纸张输送单元输送的纸张的输送量; 第一检测单元，在片材的输送方向上检测片材输送单元下游的片材; 第二检测单元，在片材的输送方向上检测片材输送单元的上游的片材; 以及输送距离计算单元，其基于由所述输送量测量单元的测量结果和由所述第一检测单元和所述第二检测单元检测到的检测结果来计算所述纸张的输送距离。

19. 发明授权

US08800160B2 Sheet length measuring device and image forming apparatus 有权
标题翻译：片材长度测量装置和成像装置
公开(公告)号：US08800160B2
公开(公告)日：2014-08-12
申请号：US13476359
申请日：2012-05-21
申请人： Koichi Kudo , Makoto Nakura , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Shingo Takai
发明人： Koichi Kudo , Makoto Nakura , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Shingo Takai
IPC分类号： G01B5/04 , G01B3/12
CPC分类号： G01B5/02 , G01B5/24 , G01B7/02 , G01B7/30 , G01B21/02 , G01B21/22 , G03G15/0189 , G03G15/5029 , G03G2215/00734
摘要： A sheet length measuring device includes a rotating body configured to rotate with a movement of a sheet in a conveying direction; a position detecting unit configured to detect leading and trailing ends of the sheet passing through a position of the rotating body; a measuring unit configured to measure a rotation amount of the rotating body and output an origin signal per one revolution of the rotating body; a storage unit configured to store changes of a sheet conveying amount with respect to respective rotation angles in one revolution of the rotating body; and a calculating unit configured to calculate a corrected length of the sheet from a value obtained from a rotation angle of the rotating body when the leading end of the sheet is detected and a value obtained from a rotation angle of the rotating body when the trailing end of the sheet is detected.
摘要翻译：片材长度测量装置包括旋转体，其构造成随着片材沿输送方向的移动而旋转; 位置检测单元，被配置为检测通过所述旋转体的位置的所述片材的前端和后端; 测量单元，被配置为测量旋转体的旋转量并输出旋转体的每转一次的原点信号; 存储单元，被配置为在旋转体的一圈中存储相对于各旋转角度的片材输送量的变化; 以及计算单元，被配置为从检测到所述纸张的前端的旋转体的旋转角度获得的值和从所述旋转体的后端的旋转角度获得的值来计算所述片材的校正长度检测到纸张。

20. 发明授权

US08420721B2 Polyolefin resin composition 有权
标题翻译：聚烯烃树脂组合物
公开(公告)号：US08420721B2
公开(公告)日：2013-04-16
申请号：US12680398
申请日：2008-08-29
申请人： Tsuyoshi Urushihara , Naoto Ueda , Naoshi Kawamoto
发明人： Tsuyoshi Urushihara , Naoto Ueda , Naoshi Kawamoto
IPC分类号： C08K5/20 , C08L23/00
CPC分类号： C08K5/0083 , C08K5/20 , C08L23/02
摘要： A polyolefin resin composition having a high crystallization temperature and excellent transparency is provided. The polyolefin resin composition comprises 0.01 to 10 parts by mass of a methylenebisanilide compound with respect to 100 parts by mass of a polyolefin resin, wherein the methylenebisanilide compound is represented by General Formula 1, wherein each of X1, X2, X3, X4, X5, X6, X7 and X8 independently represents a hydrogen atom or C1-C10 alkyl which is optionally substituted or branched; and each of R1 and R2 independently represents a hydrogen atom, C1-C21 alkyl which is optionally substituted or branched, C3-C12 cycloalkyl which is optionally substituted, or C6-C20 aryl which is optionally substituted.
摘要翻译：提供了具有高结晶温度和优异透明度的聚烯烃树脂组合物。聚烯烃树脂组合物包含相对于100质量份的聚烯烃树脂为0.01〜10质量份的亚甲基双酰苯胺化合物，其中，亚甲基双苯胺化合物由通式1表示，其中X1，X2，X3，X4，X5 ，X 6，X 7和X 8独立地表示氢原子或任选取代或支链的C 1 -C 10烷基; R 1和R 2各自独立地表示氢原子，任选取代或支链的C 1 -C 21烷基，任选取代的C 3 -C 12环烷基或任选被取代的C 6 -C 20芳基。

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