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    • 14. 发明授权
    • Bonding apparatus
    • 接合装置
    • US07337939B2
    • 2008-03-04
    • US11236594
    • 2005-09-28
    • Touru TeradaYasuhisa Matsumoto
    • Touru TeradaYasuhisa Matsumoto
    • B23K31/00
    • B23K31/12B23K2101/40H01L24/75
    • A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.
    • 接合装置由接合工具,基板台,用于移动接合工具和基板台的移动机构,用于上下移动所述接合工具的上下机构和芯片识别照相机构成。 接合装置被配置为使得基于芯片识别相机的识别结果对芯片和基板进行定位,使得芯片被接合到基板上。 芯片识别照相机被设置为低于衬底台的衬底安装表面的水平。 芯片的下表面被识别为芯片的下表面基本上处于与基板的芯片接合表面的水平面上的状态。 通过识别图像来进行芯片和基板的定位。
    • 15. 发明申请
    • Bonding apparatus
    • 接合装置
    • US20060022019A1
    • 2006-02-02
    • US11236594
    • 2005-09-28
    • Touru TeradaYasuhisa Matsumoto
    • Touru TeradaYasuhisa Matsumoto
    • H01L21/00
    • B23K31/12B23K2101/40H01L24/75
    • A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of. the chip and the substrate is performed by the recognition image.
    • 接合装置由接合工具,基板台,用于移动接合工具和基板台的移动机构,用于上下移动所述接合工具的上下机构和芯片识别照相机构成。 接合装置被配置为使得基于芯片识别相机的识别结果对芯片和基板进行定位,使得芯片被接合到基板上。 芯片识别照相机被设置为低于衬底台的衬底安装表面的水平。 芯片的下表面被识别为芯片的下表面基本上处于与基板的芯片接合表面的水平面上的状态。 定位。 芯片和基板由识别图像执行。
    • 16. 发明申请
    • ELECTRODE, MANUFACTURING METHOD THEREFOR, AND HIGH PRESSURE DISCHARGE LAMP
    • 电极,其制造方法和高压放电灯
    • US20120153819A1
    • 2012-06-21
    • US13391942
    • 2010-09-01
    • Yasuhisa MatsumotoKouji Komata
    • Yasuhisa MatsumotoKouji Komata
    • H01J61/073H01J9/04H01J1/20
    • H01J61/0732H01J9/02H01J61/86
    • In an electrode having a structure in which a coil is wound around an electrode rod, an ignition performance is ensured while preventing abnormal discharge and sputtering, an appropriate electrode temperature is obtained during drive, and having this operation maintained even if the lamp is repeatedly turned on and off. A discharge lamp electrode (30) having an electrode rod (10) and a coil (20) wound around a discharge portion (11) of the electrode rod includes a first welding portion (41) in which a front end of the coil is welded to the discharge portion, a second welding portion (42) in which a rear end of the coil is welded to the discharge portion, and a weld-joining portion (50) in which at least a pair of adjacent coil portions in windings of the coil are welded to each other.
    • 在线圈缠绕在电极杆上的结构中,确保了点火性能,同时防止异常放电和溅射,在驱动期间获得适当的电极温度,并且即使灯反复转动也保持该操作 开启和关闭。 具有缠绕在电极棒的排出部分(11)上的电极棒(10)和线圈(20)的放电灯电极(30)包括:第一焊接部分(41),其中线圈的前端被焊接 到排出部分的第二焊接部分(42),其中线圈的后端焊接到排出部分,以及焊接接合部分(50),其中至少一对相邻的线圈部分 线圈彼此焊接。
    • 19. 发明授权
    • Projection exposure apparatus
    • 投影曝光装置
    • US4758864A
    • 1988-07-19
    • US88143
    • 1987-08-21
    • Kazumasa EndoYasuhisa Matsumoto
    • Kazumasa EndoYasuhisa Matsumoto
    • G01B11/00G03B27/32G03F9/00H01L21/027H01L21/30H01L21/68G03B27/52G03B27/70
    • G03F9/70
    • A projection exposure apparatus on which are placed a reticle whose pattern is comprised of an area transmitting a radiation therethrough and an area not transmitting the radiation therethrough and a substrate includes a projection optical system for projecting the pattern formed on the reticle onto the substrate, the projection optical system being telecentric on the substrate side, a device producing a radiation beam for alignment of the reticle and the substrate, an alignment device for supplying the radiation beam onto the substrate through the reticle and the projection optical system and detecting the relative positional relation between the reticle and the substrate through the projection optical system, a device for imparting displacement to the projection optical system to the position of incidence of the radiation beam onto the projection optical system by the alignment device, a device for outputting a position signal conforming to the relative position of the optic axis of the projection optical system and the position of incidence, and a deflecting device responsive to the position signal to deflect the angle of the principal ray of the radiation beam entering the projection optical system so that the telecentricity of the projection optical system on the substrate side is maintained.
    • 一种投影曝光装置,其上装有图案由透射辐射的区域和不透过辐射的区域构成的掩模版和基板,其包括用于将形成在掩模版上的图案投影到基板上的投影光学系统, 投影光学系统在基板侧是远心的,产生用于对准标线片和基板的辐射束的装置,用于通过标线和投影光学系统将辐射束提供到基板上的对准装置,并且检测相对位置关系 通过所述投影光学系统在所述掩模版和所述基板之间,通过所述对准装置向所述投影光学系统施加位移到所述投影光学系统的入射位置的装置,用于输出符合 光轴的相对位置 投影光学系统和入射位置,以及响应于位置信号的偏转装置偏转入射投影光学系统的辐射束的主光线的角度,使得投影光学系统在基板侧的远心度为 保持。