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    • 11. 发明授权
    • Methods of forming integrated circuit devices including insulation layers
    • 形成包括绝缘层的集成电路器件的方法
    • US07033908B2
    • 2006-04-25
    • US10775677
    • 2004-02-10
    • Yong-Won ChaWon-Jin Kim
    • Yong-Won ChaWon-Jin Kim
    • H01L21/76
    • H01L21/76837
    • Methods of forming an electronic device including a substrate and a raised pattern on the substrate are provided. For example, a first insulating layer may be formed on the raised pattern and on the substrate. More particularly, forming the first insulating layer may include forming a first portion of the first insulating layer using a first processing condition and forming a second portion of the first insulating layer using a second processing condition. After forming the first insulating layer including the first and second portions, portions of the first insulating layer may be removed to expose portions of the raised pattern while maintaining portions of the first insulating layer on the substrate. After removing portions of the first insulating layer, a second insulating layer may be formed on the exposed portions of the raised pattern and on the maintained portions of the first insulating layer.
    • 提供了在衬底上形成包括衬底和凸起图案的电子器件的方法。 例如,可以在凸起图案和基板上形成第一绝缘层。 更具体地,形成第一绝缘层可以包括使用第一处理条件形成第一绝缘层的第一部分,并且使用第二处理条件形成第一绝缘层的第二部分。 在形成包括第一和第二部分的第一绝缘层之后,可以去除第一绝缘层的部分以暴露凸起图案的部分,同时保持基板上的第一绝缘层的部分。 在去除第一绝缘层的部分之后,可以在凸起图案的暴露部分和第一绝缘层的保持部分上形成第二绝缘层。
    • 14. 发明申请
    • ROLLER FOR BELT CONVEYER
    • 皮带输送机滚子
    • US20110240444A1
    • 2011-10-06
    • US13075750
    • 2011-03-30
    • Won-Jin KIM
    • Won-Jin KIM
    • B65G39/09
    • B65G39/09B65G39/10B65G2207/48
    • A roller for a belt conveyer. A roller tube has an engraved groove for indicating the degree to which the surface of the roller is abraded. A shaft reinforcement member is provided in one end of the roller tube, connected to a shaft disposed inside the roller tube, and rotatably coupled to the belt conveyor. A dustproof cover closes one end of the roller tube, and the shaft reinforcement member extends through the dustproof cover. A bearing housing is fitted into the dustproof cover, with a bearing thereof being rotatably coupled to the outer circumference of the shaft reinforcement member. A flat spring is fitted into the bearing housing, and elastically supports one surface of the bearing, thereby controlling expansion or contraction of the bearing. An end cap is fixedly coupled to an outer surface of the dustproof cover in order to block impurities from entering the roller.
    • 用于皮带输送机的滚筒。 辊管具有用于表示辊的表面被磨损的程度的雕刻槽。 轴加强构件设置在辊管的一端中,连接到设置在辊管内部的轴,并且可旋转地联接到带式输送机。 防尘盖封闭辊管的一端,轴加强件延伸穿过防尘罩。 轴承座安装在防尘盖中,其轴承可旋转地联接到轴加强件的外周。 一个扁平的弹簧装配到轴承座中,弹性地支撑轴承的一个表面,从而控制轴承的膨胀或收缩。 端盖固定地连接到防尘盖的外表面,以阻止杂质进入辊。
    • 17. 发明授权
    • Metal via contact of a semiconductor device and method for fabricating the same
    • 半导体器件的金属通孔接触及其制造方法
    • US06503829B2
    • 2003-01-07
    • US09812564
    • 2001-03-21
    • Won-Jin KimSeong-Ho Kim
    • Won-Jin KimSeong-Ho Kim
    • H01L2144
    • H01L21/76804H01L21/31116
    • A metal via contact of a semiconductor device and a method for fabricating the same, wherein the method includes sequentially forming a first insulating layer, a low dielectric SOG (Spin On Glass) layer, a second insulating layer and a silicon oxynitride (SiON) layer on a semiconductor substrate forming a photoresist pattern, using the photoresist pattern as an etching mask and wet etching the silicon oxynitride layer and a portion of the second insulating layer, using the same photoresist pattern as an etching mask and anisotropically etching remainder second insulating layer, the low dielectric SOG layer and the first insulating layer to form a via hole exposing a predetermined portion of the semiconductor substrate, removing the photoresist pattern, using radio frequency (RF) etching to remove a reverse slope of the via hole and forming a metal plug in the via hole.
    • 半导体器件的金属通孔接触及其制造方法,其中该方法包括顺序形成第一绝缘层,低电介质SOG(旋转玻璃)层,第二绝缘层和氮氧化硅(SiON)层 在形成光致抗蚀剂图案的半导体衬底上,使用光致抗蚀剂图案作为蚀刻掩模,并且使用与蚀刻掩模相同的光致抗蚀剂图案和各向异性蚀刻剩余的第二绝缘层来湿式蚀刻氮氧化硅层和第二绝缘层的一部分, 低电介质SOG层和第一绝缘层,以形成暴露半导体衬底的预定部分的通孔,去除光致抗蚀剂图案,使用射频(RF)蚀刻去除通孔的反向斜面并形成金属插塞 在通孔中。