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    • 11. 发明申请
    • SEMICONDUCTOR OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR
    • 半导体光学器件及其制造方法
    • US20080029777A1
    • 2008-02-07
    • US11776623
    • 2007-07-12
    • Toshihiko Shiga
    • Toshihiko Shiga
    • H01L33/00H01L21/02H01S5/20
    • H01S5/22B82Y20/00H01S5/0425H01S5/2009H01S5/2214H01S5/3213H01S5/34333
    • A LD (Laser Diode) includes: a laminated semiconductor structure including an active layer, a p-cladding layer, a contact layer, etc. that are sequentially on top of one another on an n-GaN substrate; a waveguide ridge including the contact layer and a portion of the p-cladding layer; a first silicon insulating film covering sidewalls of the waveguide ridge and having an opening that exposes a top of the waveguide ridge; an adhesive layer disposed on the first silicon insulating film, but not in the opening, and on the top of the waveguide ridge, wherein the adhesive layer includes a first adhesive film of Ti; and a p-side electrode over the adhesive layer such that the p-side electrode is in contact with the contact layer at the top of the waveguide ridge, through the opening.
    • LD(激光二极管)包括:在n-GaN衬底上依次彼此叠置的有源层,p包层,接触层等的层叠半导体结构; 包括所述接触层和所述p包层的一部分的波导脊; 第一硅绝缘膜,其覆盖所述波导脊的侧壁并且具有暴露所述波导脊的顶部的开口; 设置在所述第一硅绝缘膜上但不在所述开口内且在所述波导脊的顶部上的粘合层,其中所述粘合层包括Ti的第一粘合膜; 以及在粘合剂层上的p侧电极,使得p侧电极通过开口与波导脊顶部的接触层接触。
    • 13. 发明申请
    • Semiconductor laser device
    • 半导体激光器件
    • US20070053398A1
    • 2007-03-08
    • US11439276
    • 2006-05-24
    • Hiromasu MatsuokaYasuyuki NakagawaToshihiko Shiga
    • Hiromasu MatsuokaYasuyuki NakagawaToshihiko Shiga
    • H01S5/00
    • H01S5/028H01S5/0287
    • A semiconductor laser device includes a semiconductor laser body including a resonator and having a front end face and a rear end face facing each other, the resonator being located between the front end face and the rear end face. The front end face emits principal laser light. A reflectance control film is disposed on the front end face or the rear end face of the semiconductor laser body and is made up of either an aluminum oxide film or a five-layer film including the aluminum oxide film disposed such that it is the layer in the five-layer film farthest from the front end face or the rear end face. A silicon oxide film is disposed on the aluminum oxide film of the reflectance control film and has a thickness of 20 nm or less.
    • 半导体激光装置包括:包括谐振器的半导体激光器体,其前端面和后端面彼此面对,所述谐振器位于前端面和后端面之间。 前端面发射主激光。 反射控制膜设置在半导体激光体的前端面或后端面上,由氧化铝膜或包含氧化铝膜的五层膜构成,使其成为 五层薄膜离前端面或后端面最远。 氧化硅膜设置在反射控制膜的氧化铝膜上,厚度为20nm以下。
    • 14. 发明申请
    • Semiconductor device and field-effect transistor
    • 半导体器件和场效应晶体管
    • US20060145201A1
    • 2006-07-06
    • US11290603
    • 2005-12-01
    • Toshihiko Shiga
    • Toshihiko Shiga
    • H01L31/112
    • H01L21/28581H01L29/2003H01L29/812
    • A Schottky electrode including a WNx layer on an n-type GaN layer. A crystal plane of the n-type GaN layer is in contact with a crystal plane of the WNx layer. The crystal plane of the n-type GaN layer is a (0001)-plane, and the crystal plane of the WNx layer is (111)-oriented. The WNx layer may be an electrode layer having an NaCl-type structure including at least one metal selected from the group consisting of zirconium, hafnium, niobium, tantalum, molybdenum and tungsten, and at least one element selected from nitrogen and carbon. Further, the lattice constant of the electrode layer is preferably 0.95 to 1.05 times the a-axis lattice constant of the n-type GaN layer, multiplied by 2(1/2).
    • 包括n型GaN层上的WNx层的肖特基电极。 n型GaN层的晶面与WNx层的晶面接触。 n型GaN层的晶面为(0001)面,WNx层的晶面为(111)取向。 WNx层可以是具有包含选自锆,铪,铌,钽,钼和钨中的至少一种金属的NaCl型结构的电极层和选自氮和碳的至少一种元素。 此外,电极层的晶格常数优选为n型GaN层的a轴晶格常数的0.95〜1.05倍乘以2(1/2)。
    • 17. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US07616673B2
    • 2009-11-10
    • US11439276
    • 2006-05-24
    • Hiromasu MatsuokaYasuyuki NakagawaToshihiko Shiga
    • Hiromasu MatsuokaYasuyuki NakagawaToshihiko Shiga
    • H01S5/00
    • H01S5/028H01S5/0287
    • A semiconductor laser device includes a semiconductor laser body including a resonator and having a front end face and a rear end face facing each other, the resonator being located between the front end face and the rear end face. The front end face emits principal laser light. A reflectance control film is disposed on the front end face or the rear end face of the semiconductor laser body and is made up of either an aluminum oxide film or a five-layer film including the aluminum oxide film disposed such that it is the layer in the five-layer film farthest from the front end face or the rear end face. A silicon oxide film is disposed on the aluminum oxide film of the reflectance control film and has a thickness of 20 nm or less.
    • 半导体激光装置包括:包括谐振器的半导体激光器体,其前端面和后端面彼此面对,所述谐振器位于前端面和后端面之间。 前端面发射主激光。 反射控制膜设置在半导体激光体的前端面或后端面上,由氧化铝膜或包含氧化铝膜的五层膜构成,使其成为 五层薄膜离前端面或后端面最远。 氧化硅膜设置在反射控制膜的氧化铝膜上,厚度为20nm以下。