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11. 发明授权

US06621471B1 Display device having combined display-panel unit 有权
标题翻译：具有组合显示面板单元的显示装置
公开(公告)号：US06621471B1
公开(公告)日：2003-09-16
申请号：US09658473
申请日：2000-09-08
申请人： Masaaki Ozaki , Takahisa Kaneko , Ken Nishioka , Tsuneo Uchida
发明人： Masaaki Ozaki , Takahisa Kaneko , Ken Nishioka , Tsuneo Uchida
IPC分类号： G06G500
CPC分类号： B60K35/00 , B60K37/02 , B60K2350/2095 , B60K2350/906
摘要： A display device is comprised of a main display panel, a transparent display panel that is disposed to cover the first display panel, and a control unit. The main display panel indicates a first information pattern, the transparent display panel indicates a second information pattern, and the control unit controls relative visibility of the main and transparent display panels to selectively indicate the first and second information patterns according to various vehicle conditions.
摘要翻译：显示装置包括主显示面板，设置成覆盖第一显示面板的透明显示面板和控制单元。主显示面板指示第一信息图案，透明显示面板指示第二信息图案，并且控制单元控制主透明显示面板的相对可见度，以根据各种车辆状况选择性地指示第一和第二信息图案。

12. 发明授权

US08558375B2 Semiconductor package cooled by grounded cooler 有权
标题翻译：半导体封装由接地冷却器冷却
公开(公告)号：US08558375B2
公开(公告)日：2013-10-15
申请号：US13170475
申请日：2011-06-28
申请人： Kuniaki Mamitsu , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
发明人： Kuniaki Mamitsu , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3672 , H01L23/3736 , H01L23/427 , H01L23/4334 , H01L23/46 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/06181 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/06 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1517 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
摘要翻译：半导体器件包括封装和冷却器。半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。导电层和冷却器电连接在一起。

13. 发明授权

US08398799B2 Method of manufacturing honeycomb structure 有权
标题翻译：制造蜂窝结构的方法
公开(公告)号：US08398799B2
公开(公告)日：2013-03-19
申请号：US10542013
申请日：2004-01-20
申请人： Jun Fujita , Takahisa Kaneko
发明人： Jun Fujita , Takahisa Kaneko
IPC分类号： B32B37/12
CPC分类号： B01D39/2068 , B01D53/885 , B01J35/04 , B28B11/006 , F01N3/0222 , F01N3/2828 , F01N2450/28 , Y02T10/20 , Y10T156/11 , Y10T156/1153 , Y10T156/1168
摘要： A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.
摘要翻译：一种具有蜂窝状节段的蜂窝结构体的制造方法，其特征在于，包括将掩模材料（8）附着到所述蜂窝体部（2）的两端面（2a）的掩模工序（S1），层叠体接合工序通过将多个蜂窝片段（2）粘合在一起，同时在其间插入粘合剂层而将蜂窝体层叠体（3）粘合在一起;粘合剂层干燥步骤（S3），通过加热和干燥粘合剂层，隔离掩模材料（8）的掩模材料分离步骤（S4）和将蜂窝状叠层体（3）的外周部分研磨成预定形状的研磨步骤（S5）。

14. 发明申请

US20120250380A1 ELECTRIC POWER CONVERSION APPARATUS 有权
标题翻译：电力转换装置
公开(公告)号：US20120250380A1
公开(公告)日：2012-10-04
申请号：US13430789
申请日：2012-03-27
申请人： Hiromi ICHIJYO , Takahisa Kaneko , Takeshi Fujihara , Kenshiro Hida
发明人： Hiromi ICHIJYO , Takahisa Kaneko , Takeshi Fujihara , Kenshiro Hida
IPC分类号： H05K7/20 , H02M7/00
CPC分类号： H05K7/20927 , H01L23/4006 , H01L23/4012 , H01L23/473 , H01L25/0657 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
摘要： An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.
摘要翻译：电力转换装置包括多个半导体模块，框架，控制电路板以及增强固定构件。每个半导体模块具有多个控制端子。框架在其中接收半导体模块。框架至少具有彼此面对的一对侧壁，半导体模块插入其间。控制电路板位于框架外部，并具有连接到其上的半导体模块的控制端子。加强和固定构件延伸以连接框架的侧壁，从而加强框架。加强固定部件还具有固定在其上的控制电路板，使得加强固定部件位于控制电路板和半导体模块之间。

15. 发明申请

US20120001349A1 METHOD OF MANUFACTURING SEMICONDUCTOR MODULES AND SEMICONDUCTOR MODULE 有权
标题翻译：制造半导体模块和半导体模块的方法
公开(公告)号：US20120001349A1
公开(公告)日：2012-01-05
申请号：US13173334
申请日：2011-06-30
申请人： Daisuke HARADA , Hiroshi ISHIYAMA , Takahisa KANEKO , Yoshikazu SUZUKI
发明人： Daisuke HARADA , Hiroshi ISHIYAMA , Takahisa KANEKO , Yoshikazu SUZUKI
IPC分类号： H01L23/48 , H01L21/66
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3672 , H01L23/42 , H01L23/49562 , H01L23/49568 , H01L24/30 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/30181 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13054 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.
摘要翻译：具有一体结构的半导体模块通过绝缘材料将半导体芯片安装在冷却板表面的侧面，并通过树脂模制部件模制半导体芯片和冷却板来制造。该方法包括以下步骤：（a）在冷却板的表面上形成作为绝缘材料的喷涂绝缘膜; （b）在与设置有冷却板的面相反的喷涂绝缘膜的表面上形成喷涂的导电膜; （c）通过使用喷涂的导电膜和冷却板作为电极并在其间施加电压来检查喷涂的导电膜是否与冷却板绝缘; 以及（d）当喷涂的导电膜绝缘时，将半导体芯片安装在喷涂导电膜的上侧，然后树脂成型半导体芯片和冷却板。

16. 发明授权

US07981476B2 Apparatus for coating outer peripheral surface of pillar structure and method for coating outer peripheral surface of pillar structure 有权
标题翻译：支柱结构外周面涂层装置及柱结构外周面涂层方法
公开(公告)号：US07981476B2
公开(公告)日：2011-07-19
申请号：US10531577
申请日：2003-10-21
申请人： Takashi Noro , Takahisa Kaneko
发明人： Takashi Noro , Takahisa Kaneko
IPC分类号： B05D1/42 , B05C11/02
CPC分类号： B05C5/0208 , B05C5/0241 , B05C5/0254 , B05C11/04
摘要： An apparatus for coating the outer peripheral surface 1a of a pillar structure 1 comprising a smoothing means 10 having a smoothing plate 10a and an elastic body 10b; the elastic body 10 being disposed to be contacted with the outer peripheral surface 1a of the pillar structure 1 to be coated. The coating surface of a coating material supplied to the outer peripheral surface 1a is smoothed between the outer peripheral surface 1a and the elastic body 10b. A method for coating the outer peripheral surface of a pillar structure is also provided. According to the method by using the apparatus, the occurrence of partial uncoating or peeling of the coating and occurrence of cracks in the coating portion during drying after coating can be inhibited since the coating material can be applied thinly and uniformly on the outer peripheral surface, thereby the coating surface is smoothed.
摘要翻译：一种用于涂覆柱结构1的外周面1a的装置，包括具有平滑板10a和弹性体10b的平滑装置10; 弹性体10设置成与要被涂覆的柱状结构1的外周面1a接触。供给到外周面1a的涂料的涂布面在外周面1a和弹性体10b之间平滑化。还提供了一种用于涂覆柱状结构的外周面的方法。根据使用该装置的方法，由于可以在外周面上均匀地涂布涂料，所以可以抑制在涂布后的干燥期间涂布部分脱涂或剥离以及涂布部分发生裂纹的发生，从而使涂层表面光滑。

17. 发明申请

US20100317427A1 GAME MACHINE INCLUDING VARIABLE PATTERN DISPLAY UNITS 有权
标题翻译：游戏机包括可变图案显示单元
公开(公告)号：US20100317427A1
公开(公告)日：2010-12-16
申请号：US12868916
申请日：2010-08-26
申请人： Masaaki OZAKI , Takahisa Kaneko , Ken Nishioka , Tsuneo Uchida , Hiroshi Kawakami , Yoshio Aoki , Takashi Yamaguchi
发明人： Masaaki OZAKI , Takahisa Kaneko , Ken Nishioka , Tsuneo Uchida , Hiroshi Kawakami , Yoshio Aoki , Takashi Yamaguchi
IPC分类号： A63F13/00
CPC分类号： G07F17/3225 , G07F17/3206 , G07F17/3211 , G07F17/3288
摘要： A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player.
摘要翻译：游戏机具有由用于显示背面图案的卷轴构成的背面显示单元，以及由透明EL面板组成的前侧显示单元，用于显示与背部图案重叠的重叠图案。背面显示单元和前侧显示单元不会产生背部图案的盲点区域。游戏机可以向玩家提供具有良好可见性和高游戏选择能力的各种重叠模式。

18. 发明授权

US07431873B2 Method for manufacturing honeycomb structure 有权
标题翻译：蜂窝结构体的制造方法
公开(公告)号：US07431873B2
公开(公告)日：2008-10-07
申请号：US10506967
申请日：2003-02-05
申请人： Masayuki Nate , Takahisa Kaneko , Yukihisa Wada
发明人： Masayuki Nate , Takahisa Kaneko , Yukihisa Wada
IPC分类号： B28B21/52
CPC分类号： B28B11/243 , B28B3/269 , B28B11/241 , B28B11/248 , B28B17/00 , B28B2003/203 , B29C47/0028 , B29C47/12 , B29L2031/60 , F26B3/343 , F26B25/18 , F26B2210/02
摘要： The present invention provides a method for manufacturing a honeycomb structure, the method including steps of: forming, by extrusion, a formed body 1 having an outer wall, partition walls provided inside the outer wall, and cells each surrounded by the partition walls as well as extending to an axial direction of the body; and drying the formed body 1. The method for manufacturing the honeycomb structure is characterized in that the forming step includes receiving the formed body on a cradle 10 which receives the formed body so that an angle of a face 7a of the outer wall on the cradle 10 relative to the horizontal plane is 15 to 35 degrees, a cradle which has a V-shaped cross section with a cut at an apex of the V shape and which receives the formed body so that the angle relative to the horizontal plane is 15 to 45 degrees, or a cradle which receives one face of the formed body and characterized in that the drying step includes drying the formed body 1 in a state of being received on the cradle 10 having the predetermined angle. The method for manufacturing the honeycomb structure reduces distortion and deformation of the honeycomb structure.
摘要翻译：本发明提供一种蜂窝结构体的制造方法，其特征在于，包括以下步骤：通过挤压成形具有外壁的成形体1，设置在所述外壁内部的隔壁，以及由所述隔壁包围的单元延伸到身体的轴向方向; 并干燥成形体1。该蜂窝结构体的制造方法的特征在于，上述成形工序包括将上述成形体容纳在上述托架10上，所述托架10容纳上述成形体，使托架10的外壁面7a相对于该水平面的角度是15至35度的托架，其具有V形横截面，在V形的顶点处具有切口，并且接收成形体使得相对于水平面的角度为15至45度，或者支架其接收成形体的一个面，其特征在于，所述干燥步骤包括以被接收在具有预定角度的支架10上的状态干燥成形体1。蜂窝结构体的制造方法能够减少蜂窝结构的变形和变形。

19. 发明申请

US20060254713A1 Bonding Method of Ceramic Honeycomb Structure 有权
标题翻译：陶瓷蜂窝结构的粘结方法
公开(公告)号：US20060254713A1
公开(公告)日：2006-11-16
申请号：US10541841
申请日：2004-01-14
申请人： Jun Fujita , Takahisa Kaneko , Yukihisa Wada
发明人： Jun Fujita , Takahisa Kaneko , Yukihisa Wada
IPC分类号： B32B37/12 , C09J5/00 , B01D39/20
CPC分类号： B01D46/0001 , B01D46/2418 , B01D46/2459 , C04B35/565 , C04B35/62625 , C04B35/6263 , C04B35/632 , C04B35/806 , C04B37/005 , C04B38/008 , C04B2111/00793 , C04B2111/0081 , C04B2235/3418 , C04B2235/3826 , C04B2235/5228 , C04B2235/668 , C04B2235/80 , C04B2235/96 , C04B2237/083 , Y10T428/24149 , C04B38/0006
摘要： Respective pieces of the porous honeycomb segments (2) are stacked while interposing the adhesive layers between respective adhered surfaces (2a), and are bonded together by performing main pressurization (F1, F2) on the whole through the porous honeycomb segments (2) located on an outermost layer after stacking a predetermined number of pieces. Main pressurization force at this time is simultaneously applied to all the honeycomb segments (2) and does not act as a separating force against any of the honeycomb segments (2).
摘要翻译：多孔蜂窝片段（2）的各个片段被叠置在粘合剂层之间，并且通过主要加压（F 1，F 2）通过多孔蜂窝片段（F 1，F 2）粘合在一起，并粘合在一起 2）在堆叠预定数量的片之后位于最外层。此时的主加压力同时施加到所有蜂窝段（2）上，并且不作为与任何蜂窝段（2）的分离力。

20. 发明授权

US07052735B2 Method of plugging at least some of the cells of a honeycomb structure 有权
标题翻译：堵塞蜂窝结构体的至少一些细胞的方法
公开(公告)号：US07052735B2
公开(公告)日：2006-05-30
申请号：US10514839
申请日：2003-06-26
申请人： Masayuki Nate , Takahisa Kaneko , Yukihisa Wada
发明人： Masayuki Nate , Takahisa Kaneko , Yukihisa Wada
IPC分类号： B05D7/22 , B05D3/12 , B05D1/18
CPC分类号： B01D46/2418 , B01D46/0001 , B01D46/2466 , B01D46/2474 , B01D53/885 , B01D2046/2477 , B01D2046/2481 , B01D2046/2488 , B01D2046/2496 , B28B11/006 , C04B38/0012 , C04B35/195
摘要： A method of producing a honeycomb structure of the present invention includes the steps of: forming plugged portions by dipping an end face of a honeycomb structure in slurry in a container, and pressing the honeycomb structure against an inner bottom surface of the container to force the slurry into at least some of the cells; and bringing out the honeycomb structure from the container to obtain the honeycomb structure having at least some of the cells being plugged. An air layer is formed between the plugged portions and the inner bottom surface of the container to separate them from each other in advance of bringing out the honeycomb structure having plugged portions from the container.
摘要翻译：本发明的蜂窝结构体的制造方法包括以下步骤：通过将蜂窝结构体的端面浸渍在容器中而形成堵塞部分，并将蜂窝结构体压靠在容器的内底面上，以迫使浆料至少部分细胞; 从容器中取出蜂窝结构物，得到至少一部分电池被堵塞的蜂窝结构体。在封闭部分和容器的内底表面之间形成空气层，以在将具有堵塞部分的蜂窝结构从容器中取出之前彼此分离。

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