会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • Method for forming p-type semiconductor region, and semiconductor element
    • 形成p型半导体区域的方法和半导体元件
    • US07501666B2
    • 2009-03-10
    • US11659610
    • 2005-08-02
    • Keiichiro TanabeSusumu Yoshimoto
    • Keiichiro TanabeSusumu Yoshimoto
    • H01L33/00
    • H01L21/268H01L33/0095
    • A substrate 103 is set in a film-forming apparatus, such as a metal organic vapor phase epitaxy system 101, and a GaN buffer film 105, an undoped GaN film 107, and a GaN film 109 containing a p-type dopant are successively grown on the substrate 103 to form an epitaxial substrate E1. The semiconductor film 109 also contains hydrogen, which was included in a source gas, in addition to the p-type dopant. Then the epitaxial substrate E1 is placed in a short pulsed laser beam emitter 111. A laser beam LB1 is applied to a part or the whole of a surface of the epitaxial substrate E1 to activate the p-type dopant by making use of a multiphoton absorption process. When the substrate is irradiated with the pulsed laser beam LB1 which can induce multiphoton absorption, a p-type GaN film 109a is formed. There is thus provided a method of optically activating the p-type dopant in the semiconductor film to form the p-type semiconductor region, without use of thermal annealing.
    • 将基板103设置在诸如金属有机气相外延系统101的成膜装置中,并且依次生长包含p型掺杂剂的GaN缓冲膜105,未掺杂的GaN膜107和GaN膜109 在衬底103上形成外延衬底E1。 除了p型掺杂剂之外,半导体膜109还含有包含在源气体中的氢。 然后将外延衬底E1放置在短脉冲激光束发射器111中。激光束LB1施加到外延衬底E1的表面的一部分或全部,以通过利用多光子吸收激活p型掺杂剂 处理。 当用可以诱导多光子吸收的脉冲激光束LB1照射基​​板时,形成p型GaN膜109a。 因此,提供了在半导体膜中光学活化p型掺杂剂以形成p型半导体区域而不使用热退火的方法。
    • 12. 发明申请
    • Method for Forming P-Type Semiconductor Region, and Semiconductor Element
    • 形成P型半导体区域的方法和半导体元件
    • US20070296060A1
    • 2007-12-27
    • US11659610
    • 2005-08-02
    • Keiichiro TanabeSusumu Yoshimoto
    • Keiichiro TanabeSusumu Yoshimoto
    • H01L29/36H01L21/268H01L21/428
    • H01L21/268H01L33/0095
    • A substrate 103 is set in a film-forming apparatus, such as a metal organic vapor phase epitaxy system 101, and a GaN buffer film 105, an undoped GaN film 107, and a GaN film 109 containing a p-type dopant are successively grown on the substrate 103 to form an epitaxial substrate E1. The semiconductor film 109 also contains hydrogen, which was included in a source gas, in addition to the p-type dopant. Then the epitaxial substrate E1 is placed in a short pulsed laser beam emitter 111. A laser beam LB1 is applied to a part or the whole of a surface of the epitaxial substrate E1 to activate the p-type dopant by making use of a multiphoton absorption process. When the substrate is irradiated with the pulsed laser beam LB1 which can induce multiphoton absorption, a p-type GaN film 109a is formed. There is thus provided a method of optically activating the p-type dopant in the semiconductor film to form the p-type semiconductor region, without use of thermal annealing.
    • 将基板103设置在诸如金属有机气相外延系统101的成膜装置中,并且依次生长包含p型掺杂剂的GaN缓冲膜105,未掺杂的GaN膜107和GaN膜109 在衬底103上形成外延衬底E 1。 除了p型掺杂剂之外,半导体膜109还含有包含在源气体中的氢。 然后将外延衬底E 1放置在短脉冲激光束发射器111中。 激光束L B1被施加到外延衬底E 1的表面的一部分或全部,以通过使用多光子吸收工艺来激活p型掺杂剂。 当用可以诱导多光子吸收的脉冲激光束L B1照射基​​板时,形成p型GaN膜109a。 因此,提供了在半导体膜中光学活化p型掺杂剂以形成p型半导体区域而不使用热退火的方法。
    • 14. 发明授权
    • Surface acoustic wave filter having parameters optimized to suppress
spurious signals
    • 表面声波滤波器具有优化的参数以抑制杂散信号
    • US6049260A
    • 2000-04-11
    • US231657
    • 1999-01-15
    • Susumu YoshimotoYasushi Yamamoto
    • Susumu YoshimotoYasushi Yamamoto
    • H03H9/145H03H9/25H03H9/64
    • H03H9/6433H03H9/25
    • A surface acoustic wave filter includes IDTs on an input side and on an output side, the Inter Digital Transducers (IDTs) are formed by depositing a thin film made of aluminum and the like on a piezoelectric substrate made of crystal, and disposed on the substrate with a spacing interposed therebetween. The width of each electrode digit of each IDT is 1/4 of the wavelength of the surface acoustic wave during resonance. A reflection coefficient .epsilon. per electrode digit and the total number N of pairs of the electrode digits constituting the IDTs on the input side and on the output side are set to satisfy N.epsilon..gtoreq.0.55. Also, the aperture width W.lambda. of a surface acoustic wave transmission path, the center frequency of the filter f in units of Hertz , and the thickness of the electrode digits H in units of meters, are set to satisfy fH.ltoreq.-17.5W+210.
    • 表面声波滤波器包括输入侧和输出侧的IDT,通过将由铝等制成的薄膜沉积在由晶体制成的压电基板上并且设置在基板上而形成数字间转换器(IDT) 间隔开。 每个IDT的每个电极数字的宽度是共振期间声表面波波长的+ E,fra 1/4 + EE。 构成输入侧和输出侧的IDT的电极数对对的每个电极数的反射系数ε和总数N被设定为满足Nε= 0.55。 此外,声表面波传输路径的孔径宽度λλ,以赫兹为单位的滤波器f的中心频率和以米为单位的电极数H的厚度被设置为满足fH≤17.5 W + 210。
    • 16. 发明申请
    • Wafer Guide, MOCVD Equipment, and Nitride Semiconductor Growth Method
    • 晶圆指南,MOCVD设备和氮化物半导体生长方法
    • US20120003822A1
    • 2012-01-05
    • US13231981
    • 2011-09-14
    • Masaki UenoSusumu YoshimotoSatoshi Matsuba
    • Masaki UenoSusumu YoshimotoSatoshi Matsuba
    • H01L21/20
    • H01L21/68771C23C16/303C23C16/4584C30B25/12C30B29/403H01L21/67103H01L21/68H01L21/68764
    • Wafer guide for MOCVD equipment that reduces influence from III-nitride deposits. A wafer support (15) includes one or more first sections (15a), and a second section (15b) surrounding the first sections (15a). Each first section (15a) includes a surface for supporting wafers (19) on which nitride semiconductor is deposited. In MOCVD tools (11) and (13), a wafer guide (17) is provided on the wafer-support (15) second section (15b). The wafer guide (17) is furnished with a protector (17a) for covering the second section (15b), and one or more openings (17b) for receiving the wafers (19) on the first sections (15a). The protector (17a) has lateral surfaces (17c) defining the openings (17b) and guiding the wafers (19), and receives a wafer (19) in each opening (17b). A wafer (19) is loaded onto the support surface of each wafer-support (15) first section (15a) exposed in that opening (17b).
    • 用于减少III族氮化物沉积物影响的MOCVD设备的晶圆导轨。 晶片支撑件(15)包括一个或多个第一部分(15a)和围绕第一部分(15a)的第二部分(15b)。 每个第一部分(15a)包括用于支撑沉积有氮化物半导体的晶片(19)的表面。 在MOCVD工具(11)和(13)中,在晶片支撑(15)第二部分(15b)上设置晶片引导件(17)。 晶片引导件(17)配备有用于覆盖第二部分(15b)的保护器(17a)和用于在第一部分(15a)上接收晶片(19)的一个或多个开口(17b)。 保护器(17a)具有限定开口(17b)并引导晶片(19)的侧表面(17c),并且在每个开口(17b)中接收晶片(19)。 将晶片(19)装载到暴露在该开口(17b)中的每个晶片支撑件(15)的第一部分(15a)的支撑表面上。
    • 18. 发明申请
    • DUPLEXER
    • 双机
    • US20110032051A1
    • 2011-02-10
    • US12736459
    • 2009-04-10
    • Toshihiko KawamotoSusumu Yoshimoto
    • Toshihiko KawamotoSusumu Yoshimoto
    • H03H9/72
    • H03H9/02637H03H9/6483H03H9/725
    • Disclosed is a miniaturized duplexer having a good isolation characteristic. A duplexer having a high band side filter and a low band side filter that are each formed in a ladder-type filter provided on a common piezoelectric substrate is provided with a first elastic wave resonator to be included in one of these filters, a second elastic wave resonator to be included in the other of the filters, and a first additional grating reflector provided between these resonators to reflect an elastic wave leaked from a grating reflector of the first elastic wave resonator, and in which an additional grating reflector is not provided on a side opposite to the second elastic wave resonator in the first elastic wave resonator.
    • 公开了具有良好隔离特性的小型化双工器。 具有分别形成在公共压电基板上的梯型滤波器中的高频带侧滤波器和低频带侧滤波器的双工器具备:第一弹性波谐振器,其包含在这些滤波器之一中;第二弹性体 波形谐振器被包括在另一个滤波器中,以及第一附加光栅反射器,设置在这些谐振器之间以反射从第一弹性波谐振器的光栅反射器泄漏的弹性波,并且其中不在其上设置附加的光栅反射器 在第一弹性波谐振器中与第二弹性波谐振器相对的一侧。