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11. 发明授权

US09130011B2 Apparatus for mounting semiconductor device 有权
标题翻译：用于安装半导体器件的装置
公开(公告)号：US09130011B2
公开(公告)日：2015-09-08
申请号：US13071640
申请日：2011-03-25
申请人： Taehyun Kim , Dongsoo Lee , Seok Goh , Kyoungbok Cho
发明人： Taehyun Kim , Dongsoo Lee , Seok Goh , Kyoungbok Cho
IPC分类号： H01L21/67 , H05K13/04 , H01L23/00 , H01L21/683 , H05K1/02
CPC分类号： H01L24/75 , H01L21/67144 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68336 , H01L2221/68381 , H01L2224/131 , H01L2224/7501 , H01L2224/75251 , H01L2224/7565 , H01L2224/75651 , H01L2224/75744 , H01L2224/75745 , H01L2224/75801 , H01L2224/75821 , H01L2224/759 , H01L2224/7598 , H01L2224/81011 , H01L2224/81191 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/014 , H05K1/0269 , H05K13/046 , Y10T29/53178
摘要： An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.
摘要翻译：一种用于安装半导体器件的装置包括安装部件和装载部件。安装部件被配置为将半导体器件安装到电路板上。装载部件邻近安装部件设置，并且构造成将半导体器件和电路板提供给安装部件。

12. 发明授权

US08564317B2 Test socket, and test apparatus with test socket to control a temperature of an object to be tested 有权
标题翻译：测试插座和带有测试插座的测试设备，用于控制待测物体的温度
公开(公告)号：US08564317B2
公开(公告)日：2013-10-22
申请号：US12719267
申请日：2010-03-08
申请人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
发明人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
IPC分类号： G01R31/00
CPC分类号： G01R1/0458 , G01R31/2863 , G01R31/2875
摘要： A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
摘要翻译：提供了一种测试插座，其包括用于接收被测试对象的插座主体，设置在插座主体上的盖子，一个或多个连接到盖的第一表面的推动器，以向该插座的第一表面施加力主体和温度控制构件以向对象提供温度。可以在包括测试插座的测试设备中测试半导体封装，测试方法包括在测试室中的插座中接收半导体封装，将第一温度施加到测试室以在第一测试中测试半导体封装温度，并且向半导体封装施加第二温度以通过控制第二温度与插座的应用来在第二测试温度下测试半导体封装。

13. 发明授权

US06408507B1 Heat sink to semiconductor module assembly equipment and method 失效
标题翻译：散热器到半导体模块组装设备和方法
公开(公告)号：US06408507B1
公开(公告)日：2002-06-25
申请号：US09715627
申请日：2000-11-17
申请人： Seok Goh
发明人： Seok Goh
IPC分类号： H05K330
CPC分类号： H05K7/2039 , B21J15/046 , H01L2924/0002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/5136 , Y10T29/5137 , Y10T29/5142 , H01L2924/00
摘要： Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the built-up pads move from station to station around a built-up pad conveyer. Rivets are mounted in a first heat sink and inserted through holes in a semiconductor module and a second heat sink when seating the semiconductor module and the second heat sink. Working the rivets fixes the first heat sink, the semiconductor module and the second heat sink permanently, and thereby forms a semiconductor product. After that, a label is attached on the semiconductor product and the riveting quality and the labeling quality of the semiconductor product are inspected.
摘要翻译：自动化设备在印刷电路板上安装散热片。第一散热器，半导体模块和第二散热器连续地安置在多个堆积的焊盘上，当堆积焊盘从站到站周围的堆叠式输送器移动时。当安装半导体模块和第二散热器时，铆钉安装在第一散热器中并插入半导体模块中的孔和第二散热器。铆钉固定第一散热片，半导体模块和第二散热片，从而形成半导体产品。之后，在半导体产品上附着标签，检查半导体产品的铆接质量和标签质量。

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