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11. 发明授权

US07226269B2 Substrate edge grip apparatus 有权
标题翻译：基板边缘抓地装置
公开(公告)号：US07226269B2
公开(公告)日：2007-06-05
申请号：US10758753
申请日：2004-01-15
申请人： Satish Sundar , Sanjeev Baluja
发明人： Satish Sundar , Sanjeev Baluja
IPC分类号： B65G49/07
CPC分类号： H01L21/68707 , Y10S414/141
摘要： In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
摘要翻译：在一个实施例中，本发明是用于将半导体衬底定位在传送机器人上的衬底边缘夹持器组件。在一个实施例中，模块化组件包括安装在机器人端部执行器的任一侧上的弹簧加载的夹爪。钳口适于由远离机器人末端执行器的特征致动以释放用于输送的基底。

12. 发明申请

US20050158153A1 Substrate edge grip apparatus 有权
标题翻译：基板边缘抓地装置
公开(公告)号：US20050158153A1
公开(公告)日：2005-07-21
申请号：US10758753
申请日：2004-01-15
申请人： Satish Sundar , Sanjeev Baluja
发明人： Satish Sundar , Sanjeev Baluja
IPC分类号： B65G1/00 , H01L21/687
CPC分类号： H01L21/68707 , Y10S414/141
摘要： In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
摘要翻译：在一个实施例中，本发明是用于将半导体衬底定位在传送机器人上的衬底边缘夹持器组件。在一个实施例中，模块化组件包括安装在机器人端部执行器的任一侧上的弹簧加载的夹爪。钳口适于由远离机器人末端执行器的特征致动以释放用于输送的基底。

13. 发明授权

US06685422B2 Pneumatically actuated flexure gripper for wafer handling robots 有权
标题翻译：用于晶圆处理机器人的气动弯曲夹具
公开(公告)号：US06685422B2
公开(公告)日：2004-02-03
申请号：US10032663
申请日：2001-10-23
申请人： Satish Sundar , Ned G. Matthews
发明人： Satish Sundar , Ned G. Matthews
IPC分类号： B25J1502
CPC分类号： H01L21/68707 , B25J15/0206
摘要： The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In a particular embodiment, a clamp for securing silicon wafers uses a flexure assembly to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that the wafers are normally clamped near full extension of the workpiece handling member to deliver or pick up a wafer. A particular embodiment uses a pneumatic cylinder to actuate the flexure assembly so that the flexure assembly moves outwardly and rearwardly away from the wafer when actuated at or near full extension of the workpiece handling member.
摘要翻译：本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。在特定实施例中，用于固定硅晶片的夹具使用挠曲组件来以最小的颗粒产生和晶片损坏来定位和保持晶片。夹具被设计成使得晶片通常被夹持在工件处理构件的完全延伸附近以递送或拾取晶片。特定实施例使用气动缸来致动弯曲组件，使得挠曲组件在工件处理构件的全部延伸处或在其附近被致动时向外和向后移动远离晶片。

14. 发明授权

US06322312B1 Mechanical gripper for wafer handling robots 有权
标题翻译：用于晶片处理机器人的机械夹具
公开(公告)号：US06322312B1
公开(公告)日：2001-11-27
申请号：US09272658
申请日：1999-03-18
申请人： Satish Sundar
发明人： Satish Sundar
IPC分类号： B25J906
CPC分类号： H01L21/68707 , B25J15/0206
摘要： The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The workpiece clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near full extension of the workpiece handling member to deliver or pick up a wafer.
摘要翻译：本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。工件夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。在一个实施例中，用于固定硅晶片的夹具使用连接到单个挠曲构件的两个夹钳指状件，以最小的颗粒产生和晶片损坏来定位和保持晶片。夹具被设计成使得晶片通常被夹紧，除了工件处理构件的完全延伸以便递送或拾取晶片。

15. 发明授权

US6155773A Substrate clamping apparatus 失效
标题翻译：基板夹紧装置
公开(公告)号：US6155773A
公开(公告)日：2000-12-05
申请号：US935293
申请日：1997-09-22
申请人： Peter F. Ebbing , Satish Sundar
发明人： Peter F. Ebbing , Satish Sundar
IPC分类号： B65G49/07 , B25J15/08 , H01L21/673 , H01L21/677 , H01L21/687 , B66C23/00 , B25J15/00
CPC分类号： H01L21/68707 , H01L21/67742
摘要： The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.
摘要翻译：本发明通常提供一种机器人，其可以同时并且以增加的速度和加速度和减速度传递两个工件，例如硅晶片。更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。在一个实施例中，用于固定硅晶片的夹具使用连接到单个挠曲构件的两个夹钳指状件，以最小的颗粒产生和晶片损坏来定位和保持晶片。夹具被设计成使得晶片通常被夹紧，除了工件处理构件的靠近落下的延伸部分以递送或拾取晶片。

16. 发明申请

US20180242702A1 Suitcase with Retractable Wheels 审中-公开
公开(公告)号：US20180242702A1
公开(公告)日：2018-08-30
申请号：US15758126
申请日：2017-07-11
申请人： Bobby Sohail Shah , Pathmanath D. DeSilva , Satish Sundar
发明人： Bobby Sohail Shah , Pathmanath D. DeSilva , Satish Sundar
IPC分类号： A45C5/14 , A45C5/03 , A45C13/26
CPC分类号： A45C5/146 , A45C5/03 , A45C5/14 , A45C13/001 , A45C13/18 , A45C13/262 , A45C15/00 , A45C15/06 , A45C2013/267
摘要： A suitcase with retractable wheels is described. A linkage provides a means to raise and lower wheels either by a vertical motion or a folding motion such that the wheels may be extended for rolling the suitcase when the use is walking and the wheels may be retracted for easy stowage of the suitcase such as in a luggage compartment. The linkage may be attached to the back of the suitcase, located in the interior of the suitcase or enclosed in a shell that is attached to the back of the suitcase.

17. 发明授权

US08599531B2 Electrostatic end effector apparatus, systems and methods 有权
标题翻译：静电末端执行器装置，系统和方法
公开(公告)号：US08599531B2
公开(公告)日：2013-12-03
申请号：US12684733
申请日：2010-01-08
申请人： Satish Sundar , Jeffrey C. Hudgens , Prudhvi R. Chintalapati , William Nixon Taylor, Jr. , William P. Laceky , Jeffrey A. Brodine , Dean C. Hruzek , Mario Dave Silvetti
发明人： Satish Sundar , Jeffrey C. Hudgens , Prudhvi R. Chintalapati , William Nixon Taylor, Jr. , William P. Laceky , Jeffrey A. Brodine , Dean C. Hruzek , Mario Dave Silvetti
IPC分类号： H01L21/683 , H01L21/67 , H01L21/673 , H01L21/677
CPC分类号： H01L21/6833 , H01L21/67 , H01L21/673 , H01L21/677 , H01L21/683 , H01L21/6831 , H01L21/68707 , Y10S414/141 , Y10S901/30 , Y10S901/40
摘要： Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.
摘要翻译：提供了用于在电子设备制造系统的系统部件之间传送基板的系统，设备和方法。该系统和装置包括具有基座的静电末端执行器，基座上的电极对和用于将基板与电极对间隔开的隔离构件，以在电极对和基板之间提供间隙。提供了本发明的方法以及许多其它方面。

18. 发明授权

US08260461B2 Method and system for robot calibrations with a camera 有权
标题翻译：用相机进行机器人校准的方法和系统
公开(公告)号：US08260461B2
公开(公告)日：2012-09-04
申请号：US12198079
申请日：2008-08-25
申请人： Sekar Krishnasamy , Vijay Sakhare , Mordechai Leska , Donald Foldenauer , Rinat Shimshi , Satish Sundar
发明人： Sekar Krishnasamy , Vijay Sakhare , Mordechai Leska , Donald Foldenauer , Rinat Shimshi , Satish Sundar
IPC分类号： G05B19/04 , G05B19/18
CPC分类号： B25J19/023 , B25J9/107 , B25J9/1692 , G05B2219/39011 , G05B2219/39016
摘要： Described herein is a method and system for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes manually calibrating a center of a robot blade aligned with respect to a target. The method further includes recording a first positional value of the center of the robot blade aligned with respect to a camera. The method further includes automatically determining a second positional value of the center of the robot blade aligned with respect to the camera. The method further includes automatically recalibrating the robot blade based on an offset between the second positional value and the first positional value exceeding a tolerance offset from the first positional value.
摘要翻译：这里描述了一种用于对机器人部件执行校准的方法和系统。在一个实施例中，执行机器人校准的方法包括手动校准相对于目标对准的机器人刀片的中心。该方法还包括记录相对于照相机对准的机器人刀片的中心的第一位置值。该方法还包括自动确定机器人刀片的中心相对于相机对准的第二位置值。该方法还包括基于第二位置值和第一位置值之间的偏移超过与第一位置值的公差偏差自动重新校准机器人刀片。

19. 发明申请

US20100292635A1 High Precision Infusion Pump Controller 有权
标题翻译：高精度输液泵控制器
公开(公告)号：US20100292635A1
公开(公告)日：2010-11-18
申请号：US12678417
申请日：2008-09-17
申请人： Satish Sundar
发明人： Satish Sundar
IPC分类号： A61M37/00
CPC分类号： A61M5/16813 , A61M5/141 , A61M5/1411 , A61M5/1454 , A61M5/1456 , A61M5/14586 , A61M5/1684 , A61M5/16881 , A61M5/1689 , A61M5/172 , A61M2205/3306 , A61M2205/3317 , A61M2205/3389 , A61M2205/3592 , G06F19/00 , Y10S128/12 , Y10S128/13
摘要： A controller for closed loop control of infusion devices is described. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.
摘要翻译：描述了用于输液装置闭环控制的控制器。描述了使用闭环控制架构的各种输注系统。在一些实施例中，闭环控制可适用于当前常用的输注装置，例如重力给料静脉内系统。其他实施例描述了使用弹簧，弹性体，旋转和线性电动机的偏置或驱动机构的输注泵系统。

20. 发明申请

US20100211003A1 High Precision Infusion Pumps 有权
标题翻译：高精度输液泵
公开(公告)号：US20100211003A1
公开(公告)日：2010-08-19
申请号：US12678426
申请日：2008-09-17
申请人： Satish Sundar , Swaminathan Balakrishnan , Ivan Melnyk
发明人： Satish Sundar , Swaminathan Balakrishnan , Ivan Melnyk
IPC分类号： A61M5/168 , A61M5/145
CPC分类号： A61M5/16813 , A61M5/141 , A61M5/1411 , A61M5/1454 , A61M5/1456 , A61M5/14586 , A61M5/1684 , A61M5/16881 , A61M5/1689 , A61M5/172 , A61M2205/3306 , A61M2205/3317 , A61M2205/3389 , A61M2205/3592 , G06F19/00 , Y10S128/12 , Y10S128/13
摘要： A system architecture for closed loop control of infusion devices is described. The architecture provides means to control the flow from an infusion device as well as in some embodiments the pressure of the delivery. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.
摘要翻译：描述了用于输液装置的闭环控制的系统架构。该结构提供了控制来自输注装置的流动以及在一些实施例中输送压力的手段。描述了使用闭环控制架构的各种输注系统。在一些实施例中，闭环控制可适用于当前常用的输注装置，例如重力给料静脉内系统。其他实施例描述了使用弹簧，弹性体，旋转和线性电动机的偏置或驱动机构的输注泵系统。

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