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11. 发明申请

US20070045575A1 Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target 有权
标题翻译：用于使用处理目标作为度量目标相对于半导体集成电路定位激光束点的方法和系统
公开(公告)号：US20070045575A1
公开(公告)日：2007-03-01
申请号：US11365468
申请日：2006-02-28
申请人： Kelly Bruland
发明人： Kelly Bruland
IPC分类号： G01N21/86
CPC分类号： B23K26/04 , H01L23/5258 , H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. The various methods and systems utilize those structures themselves to perform the measurement, determination, or alignment.
摘要翻译：各种方法和系统相对于具有在半导体衬底上或半导体衬底内的结构的半导体衬底来测量，确定或对准激光束点的位置，以通过将处理激光束传送到处理激光束点来进行选择性处理。各种方法和系统利用这些结构本身进行测量，确定或对准。

12. 发明申请

US20060128073A1 Multiple-wavelength laser micromachining of semiconductor devices 审中-公开
标题翻译：半波长激光微加工半导体器件
公开(公告)号：US20060128073A1
公开(公告)日：2006-06-15
申请号：US11067464
申请日：2005-02-25
申请人： Yunlong Sun , Richard Harris , Kelly Bruland , Robert Hainsey , Ho Lo , Lei Sun
发明人： Yunlong Sun , Richard Harris , Kelly Bruland , Robert Hainsey , Ho Lo , Lei Sun
IPC分类号： H01L21/82 , B23K26/16
CPC分类号： H01L23/5258 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , B23K26/361 , B23K26/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/50 , H01L2924/0002 , H01S3/10046 , H01S3/2383 , Y10S438/94 , H01L2924/00
摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.
摘要翻译：在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

13. 发明申请

US20050282407A1 Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously 有权
标题翻译：使用同轴间隔的多个激光束点的半导体结构处理
公开(公告)号：US20050282407A1
公开(公告)日：2005-12-22
申请号：US11051500
申请日：2005-02-04
申请人： Kelly Bruland , Brian Baird , Ho Lo , Stephen Swaringen , Frank Evans
发明人： Kelly Bruland , Brian Baird , Ho Lo , Stephen Swaringen , Frank Evans
IPC分类号： B23K26/067 , H01L21/26 , H01L21/768
CPC分类号： B23K26/067 , H01L21/76894
摘要： Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.
摘要翻译：方法和系统使用多个激光束选择性地照射半导体衬底上或内部的结构。这些结构被布置成在大体上沿长度方向延伸的一排。该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一激光束和沿着与半导体衬底相交的第二激光束轴传播的第二激光束。该方法同时将第一和第二激光束引导到行中不同的第一和第二结构。该方法使第一激光束和第二激光束相对于半导体衬底在基本上平行于该行的长度方向的方向基本上一致地移动，以便用一个或多个第一和第二激光器选择性地照射该行中的结构梁同时进行。

14. 发明申请

US20050281102A1 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling 有权
标题翻译：半导体结构处理采用多个横向间隔的激光束点，具有接头速度分布
公开(公告)号：US20050281102A1
公开(公告)日：2005-12-22
申请号：US11052014
申请日：2005-02-04
申请人： Kelly Bruland
发明人： Kelly Bruland
IPC分类号： G11C17/14 , G11C29/00 , H01L23/525
CPC分类号： H01L23/5258 , B23K26/0344 , B23K26/0622 , B23K26/082 , G11C17/14 , G11C17/143 , H01L2924/0002 , H01L2924/00
摘要： A method is used in processing structures on or within a semiconductor substrate using N series of laser pulses to obtain a throughput benefit, wherein N≧2. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected structures in N respective distinct rows. The method determines a joint velocity profile for simultaneously moving in the lengthwise direction the N laser beam axes substantially in unison relative to the semiconductor substrate so as to process structures in the N rows with the respective N series of laser pulses, whereby the joint velocity profile is such that the throughput benefit is achieved while ensuring that the joint velocity profile represents feasible velocities for each of the N series of laser pulses and for each of the respective N rows of structures processed with the N series of laser pulses. A semiconductor substrate is designed to have a structure layout that takes advantage of the N-fold processing parallelism provided by the N laser beams.
摘要翻译：使用N系列激光脉冲在半导体衬底上或半导体衬底内的处理结构中使用一种方法来获得生产效益，其中N≥2。这些结构被布置成沿大致长度方向延伸的多个基本上平行的行。 N系列激光脉冲沿着N个相应的光束轴传播，直到在N个相应的不同行中的选定结构上入射。该方法确定了相对于半导体衬底基本上一致地使N个激光束轴沿长度方向同时移动的关节速度分布图，以便利用相应的N系列激光脉冲处理N行中的结构，从而使关节速度分布使得在确保联合速度分布表示对于N系列激光脉冲中的每一个以及用N系列激光脉冲处理的各个N行结构中的每一个的可行速度的同时，实现了吞吐量益处。半导体衬底被设计成具有利用由N个激光束提供的N倍处理平行度的结构布局。

15. 发明授权

US08278595B2 Use of predictive pulse triggering to improve accuracy in link processing 有权
标题翻译：使用预测脉冲触发来提高链路处理的准确性
公开(公告)号：US08278595B2
公开(公告)日：2012-10-02
申请号：US11687578
申请日：2007-03-16
申请人： Kelly Bruland , Clint Vandergiessen
发明人： Kelly Bruland , Clint Vandergiessen
IPC分类号： B23K26/02
CPC分类号： B23K26/0648 , B23K26/034 , B23K26/0344 , B23K26/04 , B23K26/0622 , B23K26/0643 , B23K26/08 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.
摘要翻译：预测脉冲触发（PPT）方法能够在链路处理系统中精确触发激光束。 PPT方法需要基于目标和激光束轴的估计的相对运动参数触发激光束。与传统的完全基于测量的方法相比，PPT方法可以提高激光定位精度的六倍。

16. 发明授权

US07608800B2 Methods and systems for decreasing the effective pulse repetition of a laser 有权
标题翻译：减少激光有效脉冲重复的方法和系统
公开(公告)号：US07608800B2
公开(公告)日：2009-10-27
申请号：US11758497
申请日：2007-06-05
申请人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
发明人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/04 , B23K26/0622 , B23K26/0853 , B23K2101/40
摘要： A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.
摘要翻译：一种方法用激光脉冲选择性地处理工件上的结构。这些结构被布置成具有大致相等间距的线性图案。脉冲沿着终止于工件上的激光束点的激光束传播路径传播。当该点与第一结构位置一致时，该方法触发第一处理脉冲，在第一脉冲期间选择性地阻挡或清除传播路径，使工件和光点相对于彼此移动，使得光点向第二结构位置移动小于激光器PRF和音调的乘积的速度，在点到达第二结构位置之前触发虚拟脉冲，在伪激光脉冲期间阻挡传播路径，当光束点与第二结构重合时触发另一个处理脉冲并且在第二处理脉冲期间选择性地阻挡或清除传播路径。

17. 发明申请

US20070008534A1 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing 有权
标题翻译：用于区分多个激光束的反射用于半导体结构处理的校准的系统和方法
公开(公告)号：US20070008534A1
公开(公告)日：2007-01-11
申请号：US11499394
申请日：2006-08-03
申请人： Ho Lo , David Hemenway , Brady Nilsen , Kelly Bruland
发明人： Ho Lo , David Hemenway , Brady Nilsen , Kelly Bruland
IPC分类号： G01B11/00
CPC分类号： H01L23/5258 , G11C17/14 , G11C17/143 , H01L2924/0002 , H01L2924/00
摘要： A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.
摘要翻译：系统确定半导体衬底和机器中半导体衬底上或半导体衬底内的多个激光束点的相对位置，用于使用多个激光束选择性地照射衬底上或衬底内的结构。该系统包括激光源，第一和第二激光束传播路径，第一和第二反射传感器以及处理器。激光源至少产生第一和第二激光束，其分别沿着第一和第二传播路径朝着衬底传播，其具有在相应的第一和第二点处与衬底相交的相应的第一和第二轴。反射传感器被定位成检测点的反射，因为光点相对于基板移动，从而产生反射信号。处理器被配置为基于反射信号确定基板上或内部的斑点的位置。

18. 发明申请

US20060180581A1 Method for correcting systematic errors in a laser processing system 有权
标题翻译：用于校正激光加工系统中的系统误差的方法
公开(公告)号：US20060180581A1
公开(公告)日：2006-08-17
申请号：US11059025
申请日：2005-02-15
申请人： Stephen Swaringen , Kelly Bruland , Andrew Wells
发明人： Stephen Swaringen , Kelly Bruland , Andrew Wells
IPC分类号： B23K26/03 , G06F19/00
CPC分类号： B23K26/04 , B23K2101/40
摘要： A method for calibrating a laser micro-machining system in three dimensions includes scanning a sample workpiece to determine the 3D surface, calculating the best fit surfaces to the scanned data in a series of steps, and storing the results so that subsequent workpieces can be calibrated to remove systematic errors introduced by variations in an associated material handling subsystem. The method optionally uses plate bending theory to model particulate contamination and splines to fit the 3D surface in a piecewise fashion to minimize the effect of local variations on the entire surface fit.
摘要翻译：用于在三维中校准激光微加工系统的方法包括扫描样品工件以确定3D表面，以一系列步骤计算扫描数据的最佳拟合曲面，并存储结果，使得随后的工件可以被校准以消除由相关材料处理子系统中的变化引入的系统误差。该方法可选地使用板弯曲理论来模拟颗粒污染物和花键以便以分段方式拟合3D表面，以最小化局部变化对整个表面拟合的影响。

19. 发明申请

US20060027540A1 Method and system for decreasing the effective pulse repetition frequency of a laser 有权
标题翻译：减少激光有效脉冲重复频率的方法和系统
公开(公告)号：US20060027540A1
公开(公告)日：2006-02-09
申请号：US10931461
申请日：2004-08-31
申请人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
发明人： Kelly Bruland , Steve Swaringen , Steve Stone , Keith Grant
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/04 , B23K26/0622 , B23K26/0853 , B23K2101/40
摘要： A laser is characterized by a PRF (pulse repetition frequency) parameter that specifies a PRF at which pulses produced by the laser have desirable pulse properties for irradiating a target on or within a workpiece. The laser emits a laser pulse that propagates along a laser beam propagation path terminating at a laser beam spot on the workpiece. A method is effective to operate the laser at an effective PRF lower than the PRF parameter without substantially degrading the desirable pulse properties. The method receives data indicating the location on the workpiece of the target to be selectively irradiated with the laser pulse. The method determines a firing position of the laser beam spot relative to the workpiece at which the laser should emit a pulse directed at the target and calculates, based on a desired charging time, a charging start position of the laser beam spot relative to the workpiece at which the laser should begin charging so as to charge for the desired charging time before the laser beam spot reaches the firing position. The method moves the workpiece and the laser beam spot relative to one another such that the laser beam spot moves over the charging start position and then to the firing position and senses a position of the laser beam spot relative to the workpiece as the workpiece moves relative to the laser beam spot. The method commences charging of the laser when the laser beam spot is at the charging start position, whereby the laser charges for approximately the desired charging time, and the method fires the laser when the laser beam spot reaches the firing position, whereby the laser emits a pulse having desired pulse properties. Alternatively, the commencing step can be based on time rather than position.
摘要翻译：激光器的特征在于PRF（脉冲重复频率）参数，其指定由激光器产生的脉冲具有期望的脉冲特性以在工件上或工件内照射目标的PRF。激光器发射激光脉冲，其沿着终止于工件上的激光束点的激光束传播路径传播。一种方法有效地在低于PRF参数的有效PRF下操作激光器，而基本上不会降低所需的脉冲特性。该方法接收指示要用激光脉冲选择性地照射的靶的工件上的位置的数据。该方法确定激光束点相对于工件的点火位置，激光在该位置处发射指向目标的脉冲，并且基于期望的充电时间计算激光束点相对于工件的充电开始位置在激光束开始充电之前，为了在激光束点到达点火位置之前对期望的充电时间进行充电。该方法相对于彼此移动工件和激光束点，使得激光束点在充电开始位置移动，然后移动到点火位置，并且随着工件相对移动而感测激光束点相对于工件的位置到激光束点。当激光束点处于充电开始位置时，该方法开始对激光进行充电，由此激光对大约期望的充电时间进行充电，并且当激光束点到达点火位置时该方法激发激光，由此激光发射具有期望脉冲特性的脉冲。或者，开始步骤可以基于时间而不是位置。

20. 发明申请

US20050282367A1 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures 有权
标题翻译：使用在非相邻结构上在轴上间隔开的多个激光束点的半导体结构处理
公开(公告)号：US20050282367A1
公开(公告)日：2005-12-22
申请号：US11051263
申请日：2005-02-04
申请人： Kelly Bruland , Brian Baird , Ho Lo , Frank Evans
发明人： Kelly Bruland , Brian Baird , Ho Lo , Frank Evans
IPC分类号： B23K26/067 , H01L21/425
CPC分类号： B23K26/067
摘要： Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.
摘要翻译：方法和系统使用多个激光束选择性地照射半导体衬底上或内部的结构。这些结构被布置成在大体上沿长度方向延伸的一排。该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一激光束和沿着与半导体衬底相交的第二激光束轴传播的第二激光束。该方法将第一和第二激光束引导到行中不相邻的第一和第二结构。该方法使第一激光束和第二激光束相对于半导体衬底在基本上平行于该行的长度方向的方向上大致一齐地沿着行移动。

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