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11. 发明授权

US08340479B2 Electro-optic modulator with inverse tapered waveguides 有权
标题翻译：具有倒锥形波导的电光调制器
公开(公告)号：US08340479B2
公开(公告)日：2012-12-25
申请号：US12687633
申请日：2010-01-14
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/12
CPC分类号： G02B6/1228 , G02F1/2257
摘要： An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss.
摘要翻译：描述了一种集成电路，其包括用于在片上光波导中经由光学模式传送光信号的光波导。在该集成电路中，光波导的横截面积可以在集成电路中的电光调制器附近逐渐变细，例如锗电光调制器或量子阱（QW）电光调制器。特别地，横截面积可以从远离电光调制器的第一直径逐渐变细到靠近电光调制器的第二直径。这种所谓的反向锥度可以增加光学模式的空间范围或尺寸，从而允许光学信号光电耦合到或具有低光损耗的电光调制器。

12. 发明授权

US08320761B2 Broadband and wavelength-selective bidirectional 3-way optical splitter 有权
标题翻译：宽带和波长选择性双向3路光分路器
公开(公告)号：US08320761B2
公开(公告)日：2012-11-27
申请号：US11962426
申请日：2007-12-21
申请人： Xuezhe Zheng , Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H04J14/00 , G02B6/26 , G02B6/42
CPC分类号： G02B6/2804 , G02B6/29343 , G02B6/29352 , G02B6/43 , G02B2006/1215 , H04J14/0212 , H04Q2213/1301 , H04Q2213/13322
摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.
摘要翻译：描述双向3路光分路器的实施例。这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。

13. 发明申请

US20120230695A1 WAVELENGTH-DIVISION MULTIPLEXING FOR USE IN MULTI-CHIP SYSTEMS 有权
标题翻译：用于多芯片系统的波长分段多路复用
公开(公告)号：US20120230695A1
公开(公告)日：2012-09-13
申请号：US11863815
申请日：2007-09-28
申请人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
发明人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
IPC分类号： H04J14/02
CPC分类号： G02B6/43 , G02B6/3897 , H01L23/48 , H01L2924/0002 , H04J14/02 , H01L2924/00
摘要： Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
摘要翻译：描述了包括芯片模块（CM）阵列的系统的实施例。在该系统中，阵列中的给定CM包括被配置为通过使用接近连接器的电磁接近通信来将数据信号与一个或多个相邻CM通信的半导体管芯。注意，接近连接器靠近半导体管芯的表面。此外，给定CM被配置为通过使用光通信的光信号路径与其他CM通信光信号，并且使用波分复用（WDM）对光信号进行编码。

14. 发明申请

US20120189025A1 MONOLITHIC LASER SOURCE USING RING-RESONATOR REFLECTORS 审中-公开
标题翻译：单声道激光源使用环形谐振器反射器
公开(公告)号：US20120189025A1
公开(公告)日：2012-07-26
申请号：US12952838
申请日：2010-11-23
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01S5/06
CPC分类号： H01S5/1071 , H01S5/021 , H01S5/02248 , H01S5/0261 , H01S5/0612 , H01S5/06255 , H01S5/1032 , H01S5/50
摘要： In a laser source, a first optical waveguide includes a gain medium, and a second optical waveguide includes a phase tuner which adjusts a phase value of the phase tuner to specify the wavelength of the laser source. Furthermore, the laser source includes a first ring resonator and a second ring resonator, which, respectively, are optically coupled to the first optical waveguide and the second optical waveguide at opposite ends of the laser source. In particular, coupling wavelengths of the first and second ring resonators may match a wavelength of the optical signal, thereby defining an optical resonance cavity in the laser source and selecting a laser mode of the laser source which is associated with the wavelength. Additionally, the laser source includes an optical amplifier that receives and amplifies the optical signal output from the optical resonance cavity.
摘要翻译：在激光源中，第一光波导包括增益介质，第二光波导包括相位调谐器，其调节相位调谐器的相位值以指定激光源的波长。此外，激光源包括第一环形谐振器和第二环形谐振器，其分别在激光源的相对端处光耦合到第一光波导和第二光波导。特别地，第一和第二环形谐振器的耦合波长可以匹配光信号的波长，从而在激光源中限定光学谐振腔并选择与波长相关联的激光源的激光模式。此外，激光源包括光放大器，其接收并放大从光谐振腔输出的光信号。

15. 发明授权

US08103165B2 Collision detection scheme for optical interconnects 有权
标题翻译：光互连的碰撞检测方案
公开(公告)号：US08103165B2
公开(公告)日：2012-01-24
申请号：US12176293
申请日：2008-07-18
申请人： Brian W. O'Krafka , Pranay Koka , John E. Cunningham , Ashok Krishnamoorthy , Xuezhe Zheng
发明人： Brian W. O'Krafka , Pranay Koka , John E. Cunningham , Ashok Krishnamoorthy , Xuezhe Zheng
IPC分类号： H04B10/08 , H04B17/00
CPC分类号： H04L12/413 , H04Q11/0062 , H04Q2011/0064 , H04Q2011/009
摘要： A method of detecting transmission collisions in an optical data interconnect system. The method includes initiating a data transmission of a data signal from a transmitting node over the optical data channel, transmitting a first collision detect signal from the transmitting node throughout a duration of the data transmission where the first collision detect signal is transmitted over an optical detection channel corresponding to the transmitting node, monitoring at the transmitting node of the optical data interconnect system for a predetermined period of time, where the optical data interconnect system further includes optical collision detection channels corresponding to each of a plurality of receiving nodes and one or more remaining nodes, and identifying a transmission collision when a second collision signal is received through one of the optical collision detection channels at the transmitting node during the predetermined period of time.
摘要翻译：一种检测光学数据互连系统中的传输冲突的方法。该方法包括通过光数据信道发起来自发射节点的数据信号的数据传输，在数据传输的持续时间内从发射节点发射第一冲突检测信号，其中第一冲突检测信号通过光学检测传输信道，在光学数据互连系统的发送节点处监视预定时间段，其中光学数据互连系统还包括与多个接收节点中的每一个对应的光学冲突检测信道和一个或多个剩余节点，并且在预定时间段期间通过发送节点的光学冲突检测信道之一接收到第二冲突信号时识别传输冲突。

16. 发明申请

US20110235962A1 OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY 有权
标题翻译：具有高热调谐效率的光学器件
公开(公告)号：US20110235962A1
公开(公告)日：2011-09-29
申请号：US12730774
申请日：2010-03-24
申请人： Ivan Shubin , John E. Cunningham , Xuezhe Zheng , Guoliang Li , Ashok V. Krishnamoorthy
发明人： Ivan Shubin , John E. Cunningham , Xuezhe Zheng , Guoliang Li , Ashok V. Krishnamoorthy
IPC分类号： G02B6/12 , H01L21/02
CPC分类号： G02B6/12007 , G02F1/0147 , G02F1/025 , G02F1/3132
摘要： An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced.
摘要翻译：描述了具有高热调谐效率的光学装置。该光学器件可以使用三层结构（绝缘体上硅技术）来实现，包括：衬底，掩埋氧化物层和半导体层。特别地，热可调谐光波导可以限定在半导体层中。此外，制造掩埋氧化物层下面的基板的一部分并且基本上位于热可调谐光波导的位置下方，使得一部分掩埋氧化物层露出。以这种方式，热可调谐光波导和外部环境之间的热阻抗增加，并且降低与光波导的热调谐相关的功耗。

17. 发明申请

US20110170819A1 ELECTRO-OPTIC MODULATOR WITH INVERSE TAPERED WAVEGUIDES 有权
标题翻译：具有反转波形的电光调制器
公开(公告)号：US20110170819A1
公开(公告)日：2011-07-14
申请号：US12687633
申请日：2010-01-14
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02F1/035 , G02B6/26
CPC分类号： G02B6/1228 , G02F1/2257
摘要： An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss.
摘要翻译：描述了一种集成电路，其包括在片上光波导中经由光学模式传送光信号的光波导。在该集成电路中，光波导的横截面积可以在集成电路中的电光调制器附近逐渐变细，例如锗电光调制器或量子阱（QW）电光调制器。特别地，横截面积可以从远离电光调制器的第一直径逐渐变细到靠近电光调制器的第二直径。这种所谓的“倒锥度”可以增加光学模式的空间范围或尺寸，从而允许光学信号以低光损耗光学耦合到电光调制器。

18. 发明申请

US20110091157A1 THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS 有权
标题翻译：三维宏块包括光学互连
公开(公告)号：US20110091157A1
公开(公告)日：2011-04-21
申请号：US12581709
申请日：2009-10-19
申请人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/26
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译：描述了包括使用光学互连耦合的三维（3D）芯片堆叠的多芯片模块（MCM）。在该MCM中，设置在3D堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到第三光耦合器的第二光耦合器，光波导。第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。此外，第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面）或从第二方向到光波导。注意，与第二方向相关联的光路通过中间芯片中的衬底中的开口。

19. 发明申请

US20100329607A1 OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY 有权
标题翻译：具有降低机械对准灵敏度的光学连接器
公开(公告)号：US20100329607A1
公开(公告)日：2010-12-30
申请号：US12495228
申请日：2009-06-30
申请人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/34 , G02B6/26
CPC分类号： G02B6/4204 , G02B6/30 , G02B6/34 , G02B6/4215 , G02B6/4298 , G02B6/43
摘要： An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide.
摘要翻译：描述光连接器。该光学连接器在空间上分离光纤和光学部件之间的光学耦合，这松弛了相关的机械对准要求。特别地，光连接器包括设置在基板上的光扩散部件。该光扩散器部件在第一耦合区域光学耦合到光纤，并且被配置为在与第一耦合区域在基板上的不同位置处的第二耦合区域光学耦合到光学部件。此外，第一耦合区域和第二耦合区域通过光波导光学耦合。

20. 发明申请

US20100266240A1 MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUNICATION 有权
标题翻译：多芯片系统，包括电容耦合和光通信
公开(公告)号：US20100266240A1
公开(公告)日：2010-10-21
申请号：US11962419
申请日：2007-12-21
申请人： Ashok V. Krishnamoorthy , James G. Mitchell , John E. Cunningham , Brian W. O'Krafka
发明人： Ashok V. Krishnamoorthy , James G. Mitchell , John E. Cunningham , Brian W. O'Krafka
IPC分类号： G02B6/34 , G02B6/42
CPC分类号： G02B6/43 , G02B6/12009 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.
摘要翻译：描述系统的实施例。该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。

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