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11. 发明授权

US06787922B2 Semiconductor chip—mounting board 失效
标题翻译：半导体芯片安装板
公开(公告)号：US06787922B2
公开(公告)日：2004-09-07
申请号：US10361605
申请日：2003-02-11
申请人： Hiroyuki Otani , Yoshihiko Yagi , Kenichi Yamamoto
发明人： Hiroyuki Otani , Yoshihiko Yagi , Kenichi Yamamoto
IPC分类号： H01L2940
CPC分类号： H01L24/16 , H01L23/49838 , H01L24/32 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83051 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3511 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
摘要翻译：在与半导体芯片上的非操作电极对应的半导体芯片安装板上形成有强化焊盘。加强焊盘和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

12. 发明授权

US06328196B1 Bump bonding device and bump bonding method 失效
标题翻译：凸块接合装置和凸块接合方法
公开(公告)号：US06328196B1
公开(公告)日：2001-12-11
申请号：US09202567
申请日：1998-12-17
申请人： Makoto Imanishi , Akihiro Yamamoto , Hiroyuki Otani , Shinzo Eguchi , Takahiro Yonezawa , Kazushi Higashi , Koichi Yoshida , Kouji Hirotani
发明人： Makoto Imanishi , Akihiro Yamamoto , Hiroyuki Otani , Shinzo Eguchi , Takahiro Yonezawa , Kazushi Higashi , Koichi Yoshida , Kouji Hirotani
IPC分类号： B23Q900
CPC分类号： H01L21/68 , H01L21/321 , H01L24/11 , H01L24/81 , H01L2224/13099 , H01L2224/45144 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00
摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
摘要翻译：为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

13. 发明授权

US6135024A Screen printing method and printing apparatus 失效
标题翻译：丝网印刷方法和印刷装置
公开(公告)号：US6135024A
公开(公告)日：2000-10-24
申请号：US983448
申请日：1998-03-25
申请人： Takaaki Higashida , Hiroyuki Otani , Takahiko Iwaki
发明人： Takaaki Higashida , Hiroyuki Otani , Takahiko Iwaki
IPC分类号： B23K26/00 , B23K26/38 , B41F15/08 , B41F15/40 , H05K1/03 , H05K3/00 , H05K3/12 , H05K3/34 , H05K3/40 , B41F15/42
CPC分类号： H05K3/1233 , B41F15/0818 , B41F15/40 , H05K2201/10151 , H05K2203/0139 , H05K2203/0783 , H05K2203/1105 , H05K2203/163 , H05K3/3484 , H05K3/4069
摘要： Regarding filling of a paste, a temperature gradient at a paste-pressing face is managed by a heater incorporated in a filling head. Alternatively, a nonvolatile component is applied to a printing face of a base material before the paste is filled, thereby preventing a volatile component of the paste from evaporating with time. Viscosity of the paste is thus maintained. Meanwhile, a change of the quantity of the paste is coped with by changing a moving speed of the filling head or a contact angle of the filling head to the printing face, or by supporting the filling head at the side in touch with the printing face.
摘要翻译： PCT No.PCT / JP96 / 01929 Sec。 371日期：1998年3月25日 102（e）1998年3月25日PCT PCT 1996年7月11日PCT公布。公开号WO97 / 02953 日期1997年1月30日关于糊状物的填充，通过装在灌装头中的加热器来管理糊压面的温度梯度。或者，在填充糊料之前，将非挥发性成分施加到基材的印刷面上，由此防止糊剂的挥发性成分随时间蒸发。因此保持糊状物的粘度。同时，通过改变填充头的移动速度或填充头与打印面的接触角，或者通过将填充头支撑在与印刷面接触的一侧来处理浆料的量的改变。

14. 发明授权

US6061248A Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon 失效
标题翻译：半导体芯片安装板与安装在其上的半导体芯片提供高的结合强度
公开(公告)号：US6061248A
公开(公告)日：2000-05-09
申请号：US897085
申请日：1997-07-18
申请人： Hiroyuki Otani , Yoshihiko Yagi , Kenichi Yamamoto
发明人： Hiroyuki Otani , Yoshihiko Yagi , Kenichi Yamamoto
IPC分类号： H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/498 , H05K1/18 , H05K7/02
CPC分类号： H01L24/16 , H01L23/49838 , H01L24/32 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83051 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3511
摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
摘要翻译：在与半导体芯片上的非操作电极对应的半导体芯片安装板上形成有强化焊盘。加强焊盘和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

15. 发明授权

US06894387B2 Semiconductor element having protruded bump electrodes 失效
标题翻译：具有凸起电极的半导体元件
公开(公告)号：US06894387B2
公开(公告)日：2005-05-17
申请号：US09768246
申请日：2001-01-25
申请人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
发明人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
IPC分类号： H01L21/60 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/78 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/78303 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49179 , Y10T29/49181 , H01L2224/13099 , H01L2224/48 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/00012 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.
摘要翻译：在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到球接合部分，并切割Au线。通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

16. 发明申请

US20050001315A1 Method for assembling integral type electronic device, and integral type electronic device 审中-公开
标题翻译：集成式电子装置的组装方法和整体式电子装置
公开(公告)号：US20050001315A1
公开(公告)日：2005-01-06
申请号：US10902135
申请日：2004-07-30
申请人： Kazushi Higashi , Hiroyuki Otani , Norihito Tsukahara
发明人： Kazushi Higashi , Hiroyuki Otani , Norihito Tsukahara
IPC分类号： H05K3/32 , H01L21/98 , H01L25/16 , H01L33/30 , H01L33/34 , H01L33/62 , H05K1/14 , H05K1/18 , H05K7/10 , H05K13/04 , H01L23/48
CPC分类号： H01L25/50 , H01L2224/16 , H01L2924/00014 , H01L2924/09701 , H05K1/145 , H05K7/1061 , H05K13/0482 , H01L2224/0401
摘要： An integral type electronic device is formed from a first board and a second board by storing and holding electronic components in component storage parts of the first board, and then electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on a basis of an arrangement accuracy of the component storage parts, and the electronic components stored and held in the component storage parts are limited in motion.
摘要翻译：一体式电子设备由第一板和第二板通过在第一板的组件存储部分中存储和保持电子元件，然后将第二板电连接到电子元件而形成。基于部件存储部件的配置精度来确定电子部件的布置精度，并且保持在部件收纳部中的电子部件的运动受到限制。

17. 发明授权

US06467670B2 Method and apparatus for mounting component 失效
标题翻译：组件安装方法和装置
公开(公告)号：US06467670B2
公开(公告)日：2002-10-22
申请号：US09756307
申请日：2001-01-08
申请人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
发明人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
IPC分类号： B23K2012
CPC分类号： H01L21/563 , B23K20/10 , B23K2101/40 , H01L21/67126 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75355 , H01L2224/75743 , H01L2224/75801 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/83874 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/014 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.
摘要翻译：密封剂11预先被供给到部件3的电接合区域5,6和安装表面4中，并且当部件3与安装表面4接触时，密封剂11被压缩和填充在所需区域之间。同时，对组件3施加超声波振动，以在组件3的电接合区域5,6和安装表面4之间产生摩擦力，彼此紧密接触，使得两个电接合区域5,6被熔化并超声波接合在一起，从而将部件3安装在安装面4上。

18. 发明申请

US20100230879A1 Process for producing polyurethane elastomer foams 有权
标题翻译：生产聚氨酯弹性体泡沫的方法
公开(公告)号：US20100230879A1
公开(公告)日：2010-09-16
申请号：US12310638
申请日：2007-06-25
申请人： Tetsuya Watanabe , Takashi Chiba , Hiroyuki Otani
发明人： Tetsuya Watanabe , Takashi Chiba , Hiroyuki Otani
IPC分类号： F16F1/36 , C08J9/00 , B60G11/22
CPC分类号： C08G18/7685 , C08G18/10 , C08G18/4238 , C08G18/7678 , C08G2101/0083 , C08G2350/00 , C08L83/00 , C08G18/6644 , C08G18/305 , C08G18/664
摘要： Polyurethane elastomer foams can be prepared by mixing an isocyanate-terminated prepolymer obtained by reaction of a polyol with 3,3′-dimethylbiphenyl-4,4′-diisocyanate, with a foaming agent comprising a mixture of water, a low-molecular weight glycol having a molecular weight of 48-200, and a high-molecular weight glycol having a number average molecular weight Mn of 1000-3000 under stirring to conduct foaming reaction. The polyurethane elastomer foams so produced can have a high durability, particularly under a high load, even though a low-cost, easy-to-handle diisocyanate compound is used.
摘要翻译：聚氨酯弹性体泡沫可以通过将通过多元醇与3,3'-二甲基联苯-4,4'-二异氰酸酯反应获得的异氰酸酯封端的预聚物与包含水，低分子量二醇的混合物的发泡剂混合来制备分子量为48-200，搅拌下数均分子量Mn为1000-3000的高分子量二醇进行发泡反应。即使使用低成本，易于处理的二异氰酸酯化合物，所生产的聚氨酯弹性体泡沫体也可以具有高耐久性，特别是在高负载下。

19. 发明授权

US07683482B2 Electronic component unit 失效
标题翻译：电子元件单元
公开(公告)号：US07683482B2
公开(公告)日：2010-03-23
申请号：US11527461
申请日：2006-09-27
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： H01L23/48 , H01L21/44 , H05K3/32
CPC分类号： H01L24/27 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/31 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05568 , H01L2224/05571 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13023 , H01L2224/13099 , H01L2224/13118 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/45 , H01L2224/45118 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48624 , H01L2224/48824 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81191 , H01L2224/81801 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83856 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译：芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

20. 发明授权

US07430644B2 Storage device, control method for partitioning logical memory devices, and medium embodying program for partitioning logical memory devices 失效
标题翻译：存储设备，用于分区逻辑存储器设备的控制方法以及体现用于分区逻辑存储器设备的程序的介质
公开(公告)号：US07430644B2
公开(公告)日：2008-09-30
申请号：US11122101
申请日：2005-05-05
申请人： Hiroyuki Otani
发明人： Hiroyuki Otani
IPC分类号： G06F12/00
CPC分类号： G06F3/0644 , G06F3/0614 , G06F3/0689
摘要： A storage device which limits the partition of the logical memory devices for computers in accordance with properties such as reliability. An access control approves an access only to the logical memory device which was partitioned referring to an access control table. An access control setting control renews the access control table so as to partition the assigned logical memory devices to the assigned computer when the assigned logical memory devices can be partitioned. A utilization condition setting control determines the partition propriety of the logical memory device based the content of the partition condition defining table including a pair of the property condition which is the origin of judging whether the logical memory device can be partitioned or not and the partition propriety information of showing the propriety of partition to the computer and the content of the property table including a pair of the logical memory device ID and the property information of the corresponding logical memory device, and renews the partition management table.
摘要翻译：根据诸如可靠性的特性限制用于计算机的逻辑存储器件的分区的存储设备。访问控制仅允许对参考访问控制表进行分区的逻辑存储器设备的访问。访问控制设置控制更新访问控制表，以便当分配的逻辑存储器设备可以被分区时，将分配的逻辑存储器设备分配给分配的计算机。利用条件设置控制基于分区条件定义表的内容确定逻辑存储设备的分区适当性，该内容包括作为判断逻辑存储设备是否可以被分区的原因的属性条件对以及分区正当性显示分配给计算机的适当性的信息和属性表的内容，包括一对逻辑存储器设备ID和对应的逻辑存储设备的属性信息，并更新分区管理表。

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