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    • 13. 发明申请
    • SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
    • 半导体器件制造方法和半导体器件
    • US20100140617A1
    • 2010-06-10
    • US12629150
    • 2009-12-02
    • Hideaki Kuroda
    • Hideaki Kuroda
    • H01L29/78H01L21/66H01L23/544
    • H01L27/105H01L21/84H01L22/14H01L22/20H01L27/11H01L27/1104H01L27/1116H01L27/1203H01L29/78H01L29/7855
    • A semiconductor device manufacturing method includes the steps of: forming a transistor on a surface side of a silicon layer of a silicon-on-insulator substrate, the silicon-on-insulator substrate being formed by laminating a substrate, an insulating layer, and the silicon layer; forming a first insulating film covering the transistor and a wiring section including a part electrically connected to the transistor on the silicon-on-insulator substrate; measuring a threshold voltage of the transistor through the wiring section; forming a supporting substrate on a surface of the first insulating film with a second insulating film interposed between the supporting substrate and the first insulating film; removing at least a part of the substrate and the insulating layer on a back side of the silicon-on-insulator substrate; and adjusting the threshold voltage of the transistor on a basis of the measured threshold voltage.
    • 半导体器件制造方法包括以下步骤:在绝缘体上硅衬底的硅层的表面侧上形成晶体管,绝缘体上硅衬底通过层叠衬底,绝缘层和 硅层; 形成覆盖晶体管的第一绝缘膜和包括与绝缘体上硅基板上的晶体管电连接的部分的布线部分; 通过所述布线部分测量所述晶体管的阈值电压; 在所述第一绝缘膜的表面上形成支撑衬底,其中所述第二绝缘膜置于所述支撑衬底和所述第一绝缘膜之间; 在绝缘体上硅衬底的背面去除衬底和绝缘层的至少一部分; 以及基于测量的阈值电压来调整晶体管的阈值电压。
    • 15. 发明申请
    • Electroacoustic Transducer
    • 电声传感器
    • US20080218031A1
    • 2008-09-11
    • US12126022
    • 2008-05-23
    • Hideaki KurodaYoshihiro Sonoda
    • Hideaki KurodaYoshihiro Sonoda
    • H04R17/00
    • H04R17/10
    • An electroacoustic transducer having one end portion of a first piezoelectric element and one end portion of a second piezoelectric element fixed to a frame such that the first piezoelectric element and the second piezoelectric element are supported by the frame in an opening of the frame in the cantilever manner. A flexible thin film is bonded to the frame and the first and second piezoelectric elements so that it covers at least a gap between each of the piezoelectric elements and the frame. The other end portions of the piezoelectric elements are free end portions, and face each other with a gap therebetween.
    • 一种电声换能器,其具有第一压电元件的一个端部和固定到框架的第二压电元件的一个端部,使得第一压电元件和第二压电元件由框架支撑在悬臂中的框架的开口中 方式。 柔性薄膜结合到框架和第一和第二压电元件,使得它覆盖每个压电元件和框架之间的至少一个间隙。 压电元件的另一端部是自由端部,并且彼此面对地间隔开。
    • 19. 发明授权
    • Semiconductor device manufacturing method and semiconductor device
    • 半导体器件制造方法和半导体器件
    • US08860149B2
    • 2014-10-14
    • US13544036
    • 2012-07-09
    • Hideaki Kuroda
    • Hideaki Kuroda
    • H01L27/088H01L21/66H01L27/105H01L27/12H01L21/84H01L27/11H01L29/78
    • H01L27/105H01L21/84H01L22/14H01L22/20H01L27/11H01L27/1104H01L27/1116H01L27/1203H01L29/78H01L29/7855
    • A semiconductor device including a transistor formed on a first surface of a silicon layer; a first insulating film formed on the first surface of said silicon layer and covering said transistor; a wiring section formed in the first insulating film and electrically connected to the transistor; a supporting substrate formed on a surface of the first insulating film with a second insulating film interposed between the supporting substrate and the first insulating film; and an adjusting insulating film for adjusting a threshold voltage of said transistor, the adjusting insulating film being formed on a second surface of said silicon layer opposing the first surface of said silicon layer. Some embodiments may include a probing electrode electrically connected to the transistor and an opening in the silicon layer for exposing the probing electrode.
    • 一种半导体器件,包括形成在硅层的第一表面上的晶体管; 形成在所述硅层的第一表面上并覆盖所述晶体管的第一绝缘膜; 形成在第一绝缘膜中并与晶体管电连接的布线部分; 支撑基板,形成在第一绝缘膜的表面上,第二绝缘膜介于支撑基板和第一绝缘膜之间; 以及用于调节所述晶体管的阈值电压的调整绝缘膜,所述调整绝缘膜形成在所述硅层的与所述硅层的第一表面相对的第二表面上。 一些实施例可以包括电连接到晶体管的探测电极和用于暴露探测电极的硅层中的开口。