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11. 发明授权

US07134645B1 Winch assembly for use with synthetic ropes 失效
标题翻译：绞车总成用于合成绳索
公开(公告)号：US07134645B1
公开(公告)日：2006-11-14
申请号：US10358911
申请日：2003-02-05
申请人： Eric Arthur Johnson , Stuart Leigh Phoenix
发明人： Eric Arthur Johnson , Stuart Leigh Phoenix
IPC分类号： B66D1/36
CPC分类号： B66D1/741
摘要： A winch assembly is disclosed that eliminates rope crushing, even when synthetic ropes are used. Tension is applied to the rope by at least one traction sheave so that the tension at the drum is reduced. By using multiple sheaves with large wrap angles traction can be applied to the rope over a much larger area, reducing shear stress and minimizing internal wear due to relative motion of rope components. The winch drum and at least one traction sheave are driven independently, preferably by AC induction motors using frequency control. The winch assembly may operate in conjunction with a hydraulic tensioner so that lower horsepower motors can be used to maintain constant tension in moving systems.
摘要翻译：公开了一种绞车组件，即使在使用合成绳索时也可消除绳索破碎。通过至少一个牵引滑轮对绳索施加张力，使得滚筒处的张力减小。通过使用具有大包角的多个滑轮，牵引力可以在更大的面积上施加到绳索上，减少剪切应力并且最小化由于绳索部件的相对运动引起的内部磨损。绞车鼓和至少一个牵引滑轮独立地驱动，优选地通过使用频率控制的AC感应电动机驱动。绞车组件可以与液压张紧器一起操作，使得较低马力的马达可用于在运动系统中保持恒定的张力。

12. 发明授权

US06691769B2 Heat sink for convection cooling in horizontal applications 有权
标题翻译：散热器用于水平应用中的对流冷却
公开(公告)号：US06691769B2
公开(公告)日：2004-02-17
申请号：US09924210
申请日：2001-08-07
申请人： Eric Arthur Johnson , Randall Joseph Stutzman
发明人： Eric Arthur Johnson , Randall Joseph Stutzman
IPC分类号： F28F700
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译：提供了一种用于水平应用中自由对流冷却的散热器。具体地，散热器包括多个间隔开的冷却翅片，其由倾斜的基座支撑。冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。此外，冷却翅片延伸超过基座的外边缘，使得空气可以水平地在基座下方流动，然后垂直地流过间隔开的散热片。

13. 发明授权

US5888849A Method for fabricating an electronic package 失效
标题翻译：电子封装的制造方法
公开(公告)号：US5888849A
公开(公告)日：1999-03-30
申请号：US833478
申请日：1997-04-07
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L21/56 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L2224/16 , H01L2924/15311
摘要： An electronic package is fabricated by providing a thin, circuitized substrate having electrical circuitry on a first surface; and then molding a dielectric body to the first surface of the substrate. The dielectric body contains an opening for exposing a portion of the surface of the thin circuitized substrate having at least a portion of the electrical circuitry. A semiconductor device is then positioned within the opening of the molded dielectric body and is electrically coupled to at least a portion of the electrical circuitry on the exposed portion of the surface of the thin circuitized substrate. Next, a plurality of electrical conductive members are secured to a surface of the thin circuitized substrate that is opposite the first surface.
摘要翻译：通过在第一表面上提供具有电路的薄的电路化基板来制造电子封装; 然后将电介质体模塑到衬底的第一表面上。电介质体包含用于暴露具有电路的至少一部分的薄电路化衬底的表面的一部分的开口。然后将半导体器件定位在模制的电介质体的开口内，并且电耦合到薄电路化衬底的表面的暴露部分上的电路的至少一部分。接下来，多个导电构件固定到薄电路基板的与第一表面相对的表面。

14. 发明授权

US07038470B1 Parallel-plate capacitive element for monitoring environmental parameters in concrete 失效
标题翻译：平行电容元件，用于监测混凝土中的环境参数
公开(公告)号：US07038470B1
公开(公告)日：2006-05-02
申请号：US10878690
申请日：2004-06-28
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： G01R27/26
CPC分类号： G01N33/383 , G01N27/226
摘要： The invention provides a sensor for monitoring an environmental parameter in concrete including an enclosure; a detecting device connected to the enclosure for a detecting at least one environmental parameter in concrete, wherein the detecting device includes at least one capacitive element; an active material connected to the enclosure, wherein the active material is liable to respond to the environmental parameter and is operably connected to the capacitive element; a RFID chip mounted within the enclosure and operably connected to the detecting device; and an antenna operably connected to the RFID chip and the detecting device, wherein the antenna is part of an L-R-C circuit whose resonance frequency shifts within an assigned frequency band. The invention also provides a MEMS-based capacitive element that responds to an environmental parameter in concrete. The invention further provides a method of forming a MEMS-based capacitive element.
摘要翻译：本发明提供了一种用于监测混凝土中的环境参数的传感器，包括外壳; 连接到所述外壳的用于检测混凝土中的至少一个环境参数的检测装置，其中所述检测装置包括至少一个电容元件; 连接到所述外壳的活性材料，其中所述活性材料易于响应于所述环境参数并且可操作地连接到所述电容元件; 安装在所述外壳内且可操作地连接到所述检测装置的RFID芯片; 以及天线，其可操作地连接到所述RFID芯片和所述检测装置，其中所述天线是共振频率在指定频带内移动的L-R-C电路的一部分。本发明还提供了一种基于MEMS的电容元件，其响应于混凝土中的环境参数。本发明还提供一种形成基于MEMS的电容元件的方法。

15. 发明授权

US07019522B1 Apparatus for measuring the magnetic field produced by an insertion device 失效
标题翻译：用于测量由插入装置产生的磁场的装置
公开(公告)号：US07019522B1
公开(公告)日：2006-03-28
申请号：US10763460
申请日：2004-01-23
申请人： Eric Arthur Johnson , Joseph Duane Kulesza
发明人： Eric Arthur Johnson , Joseph Duane Kulesza
IPC分类号： G01R33/00
CPC分类号： G01R33/025
摘要： The invention provides an apparatus for measuring the magnetic field strength between the magnet arrays of an insertion device in an X-ray generating system comprising a magnetic field strength sensor that produces an output signal, three stages for positioning the sensor along the X, Y and Z axes of the insertion device, means for controlling positions of the stages and information storage means for reading the output signal operably connected to the sensor. The apparatus eliminates the need for a dedicated measurement facility by mounting guide means for the long (Z-)axis directly to the insertion device. This long-axis guide means can be permanently or temporarily mounted to the insertion device. The remainder of the measurement apparatus may then be transferred onto the long-axis guide means while measurements and, if necessary, adjustments are made. The apparatus is compact, allowing greater access to magnet arrays for adjustment than existing systems.
摘要翻译：本发明提供一种用于测量X射线发生系统中的插入装置的磁体阵列之间的磁场强度的装置，其包括产生输出信号的磁场强度传感器，用于沿着X，Y定位传感器的三个级和插入装置的Z轴，用于控制级的位置的装置和用于读取可操作地连接到传感器的输出信号的信息存储装置。该装置通过将长（Z-）轴的引导装置直接安装到插入装置而消除了对专用测量设备的需要。该长轴引导装置可以永久地或临时地安装到插入装置。然后可以将测量装置的其余部分转移到长轴引导装置上，同时进行测量并且如果需要进行调整。该设备紧凑，允许更多地访问磁体阵列以进行调整，而不是现有系统。

16. 发明授权

US06670223B2 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses 失效
标题翻译：耦合盖倒装芯片BGA封装，具有改进的盖设计，降低界面应力
公开(公告)号：US06670223B2
公开(公告)日：2003-12-30
申请号：US10285023
申请日：2002-10-31
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H01L2148
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.
摘要翻译：封装半导体芯片的引线键合封装，例如塑料球栅阵列（PBGA）封装，提供所谓的倒装芯片的安装。芯片覆盖有网状材料的热扩散导热盖，其间隙填充有粘合剂，以防止由热膨胀系数中的错配引起的分层，导致导致整个封装布置的收缩翘曲，导致密封剂和帽之间的分层，并导致连接接头和球栅阵列的故障。

17. 发明授权

US06486554B2 Molded body for PBGA and chip-scale packages 失效
标题翻译：用于PBGA和芯片级封装的成型体
公开(公告)号：US06486554B2
公开(公告)日：2002-11-26
申请号：US09822024
申请日：2001-03-30
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H05K720
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15162 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： An electronic package which has a thermally conductive member encapsulated with the semiconductor chip; and which is adapted for chip-scale or near-chip-scale applications of both wire-bond and flip-chip packages. For adhesively bonding the semiconductor chip to a circuitized carrier or substrate on which the chip is positioned, and to concurrently form an encapsulating structure protecting the semiconductor chip, there is provided a mold compound, such as a thermosetting plastic resin or epoxy to not only extend between the surface of the circuitized substrate or carrier facing the semiconductor chip, and possibly about the peripheral sides of the carrier, but to also at least extend over and encompass the peripheral edge portions of the opposite surface of the carrier or circuitized substrate distal to or facing away from the chip.
摘要翻译：一种具有由半导体芯片封装的导热部件的电子封装件; 并适用于芯片级或贴片级应用的引线键合和倒装芯片封装。为了将半导体芯片粘合到其上放置芯片的电路化载体或基板上，并且同时形成保护半导体芯片的封装结构，提供了一种模制化合物，例如热固性塑料树脂或环氧树脂，不仅延伸在电路化的衬底的表面或面向半导体芯片的载体之间，并且可能围绕载体的周边，但也至少延伸越过并包围载体或电路化衬底的相对表面的外围边缘部分远离或面向芯片。

18. 发明授权

US06403882B1 Protective cover plate for flip chip assembly backside 失效
标题翻译：倒装芯片组装背面的保护盖板
公开(公告)号：US06403882B1
公开(公告)日：2002-06-11
申请号：US08884796
申请日：1997-06-30
申请人： William Tze-You Chen , Michael Anthony Gaynes , Eric Arthur Johnson , Tien Yue Wu
发明人： William Tze-You Chen , Michael Anthony Gaynes , Eric Arthur Johnson , Tien Yue Wu
IPC分类号： H01L2302
CPC分类号： H01L23/49816 , H01L23/16 , H01L23/36 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.
摘要翻译：芯片封装包括具有活性表面和非活性表面的模具。在非活性表面上形成粘合剂，其中粘合剂具有低的杨氏弹性模量。低杨氏弹性模量可以是10,000psi或更小; 1,000 psi以下; 或优选约1,000psi。此外，粘合剂可以包括导热材料。使用粘合剂将保护板耦合到非活性表面，并且芯片载体耦合到模具的有效表面。

19. 发明授权

US5877043A Electronic package with strain relief means and method of making 失效
标题翻译：具有应变消除装置的电子封装和制造方法
公开(公告)号：US5877043A
公开(公告)日：1999-03-02
申请号：US28014
申请日：1998-02-23
申请人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
发明人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
IPC分类号： H01L21/60 , H01L23/12 , H01L23/13 , H01L23/16 , H01L23/373 , H01L23/495 , H01L23/498 , H01L21/44
CPC分类号： H01L24/50 , H01L23/13 , H01L23/16 , H01L23/49572 , H01L23/49816 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/15787 , H01L2924/351
摘要： An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
摘要翻译：包括柔性基板，加强件和芯片的电子封装。芯片被粘合到衬底上，固定到加强件上。应变消除装置用于包装中的各个位置，以防止与包装件的各种元件之间的热膨胀系数相对较大差异相关的问题（例如带子“起皱”）。

20. 再颁专利

USRE39426E1 Thermally enhanced flip chip package and method of forming 有权
标题翻译：热增强倒装芯片封装及成型方法
公开(公告)号：USRE39426E1
公开(公告)日：2006-12-12
申请号：US09379985
申请日：1999-08-24
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L21/44
CPC分类号： H01L23/3128 , H01L23/4334 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
摘要： A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
摘要翻译：导热平面构件与封装在介电材料内的倒装芯片导热连通，所述电介质材料围绕所述导热平面构件，所述倒装芯片以及衬底构件的预定部分。本发明提供一种具有拾取和放置能力的倒装芯片封装，而没有封装芯片封装的热阻缺点。

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