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    • 14. 发明授权
    • Multi-level cell programming of PCM by varying the reset amplitude
    • 通过改变复位幅度对PCM进行多级单元编程
    • US07944740B2
    • 2011-05-17
    • US12564904
    • 2009-09-22
    • Chung H. LamMing-Hsiu LeeThomas NirschiBipin Rajendran
    • Chung H. LamMing-Hsiu LeeThomas NirschiBipin Rajendran
    • G11C11/00
    • G11C13/0004G11C11/5678G11C13/0069G11C2013/0083G11C2013/0092
    • A phase change memory device and a method for programming the same. The method includes determining a characterized lowest SET current and corresponding SET resistance for the phase change memory device. The method includes determining a characterized RESET current slope for the phase change memory device. The method also includes calculating a first current amplitude for a RESET pulse based on the characterized lowest SET current and the characterized RESET current slope. The method includes applying the RESET pulse to a target memory cell in the phase change memory device and measuring the resistance of the target memory cell. If the measured resistance is substantially less than a target resistance, the method further includes applying one or more additional RESET pulses. In one embodiment of the invention, the one or more additional RESET pulses have current amplitudes greater than a previously applied RESET pulse.
    • 相变存储器件及其编程方法。 该方法包括确定用于相变存储器件的特征最低的SET电流和相应的SET电阻。 该方法包括确定用于相变存储器件的特征化的RESET电流斜率。 该方法还包括基于所表征的最低SET电流和表征的RESET电流斜率来计算RESET脉冲的第一电流幅度。 该方法包括将RESET脉冲施加到相变存储器件中的目标存储单元并测量目标存储单元的电阻。 如果所测量的电阻远小于目标电阻,该方法还包括应用一个或多个附加的RESET脉冲。 在本发明的一个实施例中,一个或多个附加的RESET脉冲的电流幅度大于先前施加的RESET脉冲。
    • 16. 发明申请
    • SUB-LITHOGRAPHIC PRINTING METHOD
    • 分层印刷方法
    • US20110108960A1
    • 2011-05-12
    • US13006403
    • 2011-01-13
    • Chung H. LamHemantha K. Wickramasinghe
    • Chung H. LamHemantha K. Wickramasinghe
    • H01L21/02H01L29/06
    • H01L21/0337
    • A trench structure and an integrated circuit comprising sub-lithographic trench structures in a substrate. In one embodiment the trench structure is created by forming sets of trenches with a lithographic mask and filling the sets of trenches with sets of step spacer blocks comprising two alternating spacer materials which are separately removable from each other. In one embodiment, the trench structures formed are one-nth the thickness of the lithographic mask's feature size. The size of the trench structures being dependent on the thickness and number of spacer material layers used to form the set of step spacer blocks. The number of spacer material layers being n/2 and the thickness of each spacer material layer being one-nth of the lithographic mask's feature size.
    • 沟槽结构和集成电路,其包括衬底中的次光刻沟槽结构。 在一个实施例中,沟槽结构是通过用光刻掩膜形成一组沟槽而形成的,并且用一组间隔块块填充该组沟槽,该组间隔块包括彼此分离地可拆卸的两个交替间隔物材料。 在一个实施例中,形成的沟槽结构是光刻掩模的特征尺寸的厚度的十分之一。 沟槽结构的尺寸取决于用于形成一组步进间隔块的间隔材料层的厚度和数量。 间隔材料层的数量为n / 2,每个间隔材料层的厚度为光刻掩模的特征尺寸的十分之一。
    • 20. 发明申请
    • HIGH DENSITY TERNARY CONTENT ADDRESSABLE MEMORY
    • 高密度内容可寻址存储器
    • US20100265748A1
    • 2010-10-21
    • US12427484
    • 2009-04-21
    • Chung H. LamBipin Rajendran
    • Chung H. LamBipin Rajendran
    • G11C15/00G11C11/00G11C11/56
    • G11C15/046G11C11/5678G11C13/0004
    • A content addressable memory device with a plurality of memory cells storing data words. Each data bit in the data words is set to one of three values of a first binary value, a second binary value, and a don't care value. An aspect of the content addressable memory device is the use of a single memory element and an access device in the memory cells. The memory cells are arranged such that each memory cell is electrically coupled to a single bit line, a single match line, and a single word line. The memory elements in the memory cells store low resistance states if the data bit value is the first binary value, high resistance states if the data bit value is the second binary value, and very high resistance states if the data bit value is the don't care value.
    • 一种具有存储数据字的多个存储器单元的内容可寻址存储器件。 数据字中的每个数据位被设置为第一二进制值,第二二进制值和不关心值的三个值之一。 内容可寻址存储器件的一个方面是在存储器单元中使用单个存储器元件和存取器件。 存储器单元被布置成使得每个存储器单元电耦合到单个位线,单个匹配线和单个字线。 如果数据位值是第一个二进制值,则存储器单元中的存储元件存储低电阻状态,如果数据位值是第二个二进制值则为高电阻状态,如果数据位值为“ 关心价值。