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    • 11. 发明授权
    • Methods and systems for detecting defects on a reticle
    • 用于检测光罩上的缺陷的方法和系统
    • US08041106B2
    • 2011-10-18
    • US12328862
    • 2008-12-05
    • Patrick Tung-Sing PakWee-Teck ChiaAaron Geurdon ChinIrfan MalikBrian Duffy
    • Patrick Tung-Sing PakWee-Teck ChiaAaron Geurdon ChinIrfan MalikBrian Duffy
    • G01K9/00
    • G01N21/956G01N2021/95676G06T7/001G06T2207/30148
    • Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
    • 提供了用于检测光罩上的缺陷的方法和系统。 一种方法包括使用光刻工艺的参数的不同值和使用参数的标称值的至少一个第二区域在晶片的第一区域中印刷单个模具掩模版。 该方法还包括获取至少一个第二区域的第一区域和第二图像的第一图像。 此外,该方法包括将对于不同的第一区域获取的第一图像分别与第二图像中的至少一个进行比较。 该方法还包括基于第一图像的第一部分来检测标线上的缺陷,其中与至少一个第二图像相比的第一图像的变化大于第一图像的第二部分和第二图像的两个共同的第一部分 或更多的第一图像。
    • 12. 发明授权
    • Systems and methods for creating inspection recipes
    • 用于创建检验食谱的系统和方法
    • US07877722B2
    • 2011-01-25
    • US11960157
    • 2007-12-19
    • Brian DuffyAshok Kulkarni
    • Brian DuffyAshok Kulkarni
    • G06F17/50
    • G03F7/7065G03F7/70525
    • Systems and methods for creating inspection recipes are provided. One computer-implemented method for creating an inspection recipe includes acquiring a first design and one or more characteristics of output of an inspection system for a wafer on which the first design is printed using a manufacturing process. The method also includes creating an inspection recipe for a second design using the first design and the one or more characteristics of the output acquired for the wafer on which the first design is printed. The first and second designs are different. The inspection recipe will be used for inspecting wafers after the second design is printed on the wafers using the manufacturing process.
    • 提供了用于创建检查配方的系统和方法。 用于创建检查配方的一种计算机实现的方法包括采用制造过程获取第一设计和用于印刷第一设计的晶片的检查系统的输出的一个或多个特性。 该方法还包括使用第一设计和为其上印刷有第一设计的晶片获取的输出的一个或多个特性来创建用于第二设计的检查配方。 第一和第二种设计是不同的。 在使用制造工艺将第二设计印刷在晶片上之后,检查配方将用于检查晶片。
    • 15. 发明授权
    • Monitoring of time-varying defect classification performance
    • 监测时变缺陷分类性能
    • US08537349B2
    • 2013-09-17
    • US12811319
    • 2010-06-23
    • Patrick HuetBrian DuffyMartin PlihalThomas TrautzschChris Maher
    • Patrick HuetBrian DuffyMartin PlihalThomas TrautzschChris Maher
    • G01N21/00
    • G01R31/2656G01R31/2894G05B19/41875G05B2219/37224H01L22/12H01L22/20H01L2924/0002Y02P90/22H01L2924/00
    • Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.
    • 公开了用于监视时变分类性能的系统和方法。 方法可以包括但不限于:从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性,所述一个或多个缺陷类型的群体由应用于从所述一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号应用的一个或多个分类规则确定 使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。
    • 17. 发明申请
    • METHODS AND SYSTEMS FOR DETECTING DEFECTS ON A RETICLE
    • 用于检测有缺陷的方法和系统
    • US20100142800A1
    • 2010-06-10
    • US12328862
    • 2008-12-05
    • Patrick Tung-Sing PakWee-Teck ChiaAaron Geurdon ChinIrfan MalikBrian Duffy
    • Patrick Tung-Sing PakWee-Teck ChiaAaron Geurdon ChinIrfan MalikBrian Duffy
    • G06K9/00
    • G01N21/956G01N2021/95676G06T7/001G06T2207/30148
    • Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
    • 提供了用于检测光罩上的缺陷的方法和系统。 一种方法包括使用光刻工艺的参数的不同值和使用参数的标称值的至少一个第二区域在晶片的第一区域中印刷单个模具掩模版。 该方法还包括获取至少一个第二区域的第一区域和第二图像的第一图像。 此外,该方法包括将对于不同的第一区域获取的第一图像分别与第二图像中的至少一个进行比较。 该方法还包括基于第一图像的第一部分来检测标线上的缺陷,其中与至少一个第二图像相比的第一图像的变化大于第一图像的第二部分和第二图像的两个共同的第一部分 或更多的第一图像。
    • 19. 发明申请
    • SYSTEMS AND METHODS FOR CREATING INSPECTION RECIPES
    • 用于创建检验录像的系统和方法
    • US20080250384A1
    • 2008-10-09
    • US11960157
    • 2007-12-19
    • Brian DuffyAshok Kulkarni
    • Brian DuffyAshok Kulkarni
    • G06F17/50
    • G03F7/7065G03F7/70525
    • Systems and methods for creating inspection recipes are provided. One computer-implemented method for creating an inspection recipe includes acquiring a first design and one or more characteristics of output of an inspection system for a wafer on which the first design is printed using a manufacturing process. The method also includes creating an inspection recipe for a second design using the first design and the one or more characteristics of the output acquired for the wafer on which the first design is printed. The first and second designs are different. The inspection recipe will be used for inspecting wafers after the second design is printed on the wafers using the manufacturing process.
    • 提供了用于创建检查配方的系统和方法。 用于创建检查配方的一种计算机实现的方法包括采用制造过程获取第一设计和用于印刷第一设计的晶片的检查系统的输出的一个或多个特性。 该方法还包括使用第一设计和为其上印刷有第一设计的晶片获取的输出的一个或多个特性来创建用于第二设计的检查配方。 第一和第二种设计是不同的。 在使用制造工艺将第二设计印刷在晶片上之后,检查配方将用于检查晶片。