专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100142800A1 METHODS AND SYSTEMS FOR DETECTING DEFECTS ON A RETICLE 有权
标题翻译：用于检测有缺陷的方法和系统
公开(公告)号：US20100142800A1
公开(公告)日：2010-06-10
申请号：US12328862
申请日：2008-12-05
申请人： Patrick Tung-Sing Pak , Wee-Teck Chia , Aaron Geurdon Chin , Irfan Malik , Brian Duffy
发明人： Patrick Tung-Sing Pak , Wee-Teck Chia , Aaron Geurdon Chin , Irfan Malik , Brian Duffy
IPC分类号： G06K9/00
CPC分类号： G01N21/956 , G01N2021/95676 , G06T7/001 , G06T2207/30148
摘要： Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
摘要翻译：提供了用于检测光罩上的缺陷的方法和系统。一种方法包括使用光刻工艺的参数的不同值和使用参数的标称值的至少一个第二区域在晶片的第一区域中印刷单个模具掩模版。该方法还包括获取至少一个第二区域的第一区域和第二图像的第一图像。此外，该方法包括将对于不同的第一区域获取的第一图像分别与第二图像中的至少一个进行比较。该方法还包括基于第一图像的第一部分来检测标线上的缺陷，其中与至少一个第二图像相比的第一图像的变化大于第一图像的第二部分和第二图像的两个共同的第一部分或更多的第一图像。

2. 发明授权

US08041106B2 Methods and systems for detecting defects on a reticle 有权
标题翻译：用于检测光罩上的缺陷的方法和系统
公开(公告)号：US08041106B2
公开(公告)日：2011-10-18
申请号：US12328862
申请日：2008-12-05
申请人： Patrick Tung-Sing Pak , Wee-Teck Chia , Aaron Geurdon Chin , Irfan Malik , Brian Duffy
发明人： Patrick Tung-Sing Pak , Wee-Teck Chia , Aaron Geurdon Chin , Irfan Malik , Brian Duffy
IPC分类号： G01K9/00
CPC分类号： G01N21/956 , G01N2021/95676 , G06T7/001 , G06T2207/30148
摘要： Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
摘要翻译：提供了用于检测光罩上的缺陷的方法和系统。一种方法包括使用光刻工艺的参数的不同值和使用参数的标称值的至少一个第二区域在晶片的第一区域中印刷单个模具掩模版。该方法还包括获取至少一个第二区域的第一区域和第二图像的第一图像。此外，该方法包括将对于不同的第一区域获取的第一图像分别与第二图像中的至少一个进行比较。该方法还包括基于第一图像的第一部分来检测标线上的缺陷，其中与至少一个第二图像相比的第一图像的变化大于第一图像的第二部分和第二图像的两个共同的第一部分或更多的第一图像。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式