专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

181. 发明申请

US20010042853A1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same 有权
公开(公告)号：US20010042853A1
公开(公告)日：2001-11-22
申请号：US09757391
申请日：2001-01-08
发明人： Mark J. Hampden-Smith , Toivo T. Kodas , James Caruso , Daniel J. Skamser , Quint H. Powell
IPC分类号： C09K011/08
CPC分类号： H01G4/0085 , B01J2/003 , B01J2/006 , B01J2/02 , B01J2/04 , B24B37/044 , B42D25/29 , B82Y30/00 , C01B13/185 , C01B17/20 , C01G15/006 , C01G23/003 , C01G23/006 , C01G25/00 , C01P2002/60 , C01P2002/70 , C01P2004/03 , C01P2004/32 , C01P2004/34 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , C01P2004/80 , C01P2006/10 , C01P2006/60 , C01P2006/80 , C09D11/03 , C09D11/38 , C09G1/02 , C09K3/1436 , C09K3/1463 , C09K11/025 , C09K11/0805 , C09K11/0877 , C09K11/54 , C09K11/562 , C09K11/565 , C09K11/567 , C09K11/576 , C09K11/584 , C09K11/595 , C09K11/623 , C09K11/625 , C09K11/642 , C09K11/643 , C09K11/644 , C09K11/662 , C09K11/666 , C09K11/671 , C09K11/672 , C09K11/7701 , C09K11/7708 , C09K11/7718 , C09K11/7729 , C09K11/7731 , C09K11/7734 , C09K11/7746 , C09K11/7769 , C09K11/7771 , C09K11/7774 , C09K11/7776 , C09K11/7784 , C09K11/7786 , C09K11/7787 , C09K11/7789 , C09K11/7797 , G21K4/00 , G21K2004/06 , H01J29/085 , H01J29/20 , H01J2211/42 , H01L21/3212 , H01L23/49883 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H05B33/14 , H05B33/20 , Y10S462/903 , Y10T428/2991 , Y10T428/2993 , H01L2924/00
摘要： Phosphor powders and a method for making phosphor powders. The powders are oxygen-containing, such as metal oxides, silicates, borates or titanates and have a small particle size, narrow particle size distribution and are substantially spherical. The method of the invention advantageously permits the continuous production of such powders. The invention also relates to improved devices, such as display devices, incorporating the phosphor powders.

182. 发明授权

US06294472B1 Dual slurry particle sizes for reducing microscratching of wafers 有权
标题翻译：用于减少晶片显微镜的双重浆料粒径
公开(公告)号：US06294472B1
公开(公告)日：2001-09-25
申请号：US09576750
申请日：2000-05-23
申请人： Jonathan B. Smith , Paul R. Besser , Jeremy I. Martin
发明人： Jonathan B. Smith , Paul R. Besser , Jeremy I. Martin
IPC分类号： H01L2100
CPC分类号： C09G1/02 , B24B37/044 , B24B57/02 , H01L21/30625
摘要： A method includes providing at least one wafer having a process layer formed thereon for polishing. The process layer is polished using a first polishing process that is associated with a slurry having a first abrasive particle size. The process layer is polished using a second polishing process that is associated with a slurry having a second abrasive particle size that is different from the first abrasive particle size. A system includes a polishing tool and a process controller. The polishing tool is adapted to receive at least one wafer having a process layer formed thereon for polishing. The polishing tool is adapted to polish the process layer using a first polishing process that is associated with a slurry having a first abrasive particle size. The polishing tool is adapted to polish the process layer using a second polishing process that is associated with a slurry having a second abrasive particle size that is different from the first abrasive particle size. The process controller is coupled to the polishing tool and adapted to communicate with at least one of a slurry controller and the polishing tool.
摘要翻译：一种方法包括提供至少一个晶片，其上形成有用于抛光的工艺层。使用与具有第一研磨粒度的浆料相关联的第一抛光工艺来抛光工艺层。使用与具有不同于第一磨料颗粒尺寸的第二磨料颗粒尺寸的浆料相关联的第二抛光方法来抛光工艺层。系统包括抛光工具和过程控制器。抛光工具适于接收至少一个晶片，其上形成有用于抛光的工艺层。抛光工具适于使用与具有第一研磨粒度的浆料相关联的第一抛光工艺来抛光工艺层。抛光工具适于使用与具有不同于第一磨料颗粒尺寸的第二磨料颗粒尺寸的浆料相关联的第二抛光工艺来抛光工艺层。过程控制器耦合到抛光工具并且适于与浆料控制器和抛光工具中的至少一个连通。

183. 发明授权

US06277169B1 Method for making silver-containing particles 失效
标题翻译：含银颗粒的制备方法
公开(公告)号：US06277169B1
公开(公告)日：2001-08-21
申请号：US09028277
申请日：1998-02-24
申请人： Mark J. Hampden-Smith , Toivo T. Kodas , Quint H. Powell , Daniel J. Skamser , James Caruso , Clive D. Chandler
发明人： Mark J. Hampden-Smith , Toivo T. Kodas , Quint H. Powell , Daniel J. Skamser , James Caruso , Clive D. Chandler
IPC分类号： B22F924
CPC分类号： B01J2/003 , B01J2/006 , B01J2/02 , B01J2/04 , B22F1/0014 , B22F1/0018 , B22F1/02 , B22F1/025 , B22F9/02 , B22F9/026 , B22F9/24 , B22F9/26 , B22F9/30 , B22F2998/00 , B22F2999/00 , B24B37/044 , B82Y30/00 , C01B13/185 , C01B17/20 , C01G15/006 , C01G23/003 , C01G23/006 , C01G25/00 , C01P2002/60 , C01P2002/70 , C01P2004/03 , C01P2004/32 , C01P2004/34 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , C01P2004/80 , C01P2006/10 , C01P2006/60 , C01P2006/80 , C09G1/02 , C09K3/1436 , C09K3/1463 , C09K11/025 , C09K11/0805 , C09K11/0877 , C09K11/562 , C09K11/565 , C09K11/567 , C09K11/595 , C09K11/625 , C09K11/671 , C09K11/7718 , C09K11/7731 , C09K11/7734 , C09K11/7746 , C09K11/7771 , C09K11/7774 , C09K11/7789 , C09K11/7797 , C22C1/1026 , C22C29/12 , C22C32/0089 , H01G4/008 , H01G4/0085 , H01G4/12 , H01G4/30 , H01J29/20 , H01L21/3212 , H01L23/49883 , H01L31/022425 , H01L2224/29339 , H01L2224/8384 , H01L2924/01019 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H01L2924/12044 , H01L2924/203 , H01M4/02 , H01M4/0421 , H01M4/366 , H01M4/38 , H01M14/005 , H01M2004/021 , H05K1/092 , Y02E10/50 , Y02P10/32 , Y10T428/12181 , Y10T428/29 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , Y10T428/31678 , B22F1/0048 , B22F2202/01 , B22F3/008 , B22F2202/11 , H01L2924/00 , H01L2924/0002
摘要： Provided are silver-containing powders and a method and apparatus for manufacturing the silver-containing particles of high quality, of a small size and narrow size distribution. An aerosol is generated from liquid feed and sent to a furnace, where liquid in droplets in the aerosol is vaporized to permit formation of the desired particles, which are then collected in a particle collector. The aerosol generation involves preparation of a high quality aerosol, with a narrow droplet size distribution, with close control over droplet size and with a high droplet loading suitable for commercial applications.
摘要翻译：本发明提供含银粉体以及制造质量好，体积小，分布窄的含银粒子的方法和装置。从液体进料产生气溶胶并将其送入炉中，其中气雾剂中的液滴中的液体被蒸发以允许形成所需的颗粒，然后将其收集在颗粒收集器中。气溶胶生成涉及制备具有窄液滴尺寸分布的高质量气溶胶，其具有对液滴尺寸的紧密控制以及适用于商业应用的高液滴负载。

184. 发明授权

US06180029B2 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same 失效
标题翻译：含氧荧光体粉末，制造荧光体粉末的方法和结合其的装置
公开(公告)号：US06180029B2
公开(公告)日：2001-01-30
申请号：US09028603
申请日：1998-02-24
申请人： Mark J. Hampden-Smith , Toivo T. Kodas , James Caruso , Daniel J. Skamser , Quint H. Powell
发明人： Mark J. Hampden-Smith , Toivo T. Kodas , James Caruso , Daniel J. Skamser , Quint H. Powell
IPC分类号： C09K1108
CPC分类号： H01G4/0085 , B01J2/003 , B01J2/006 , B01J2/02 , B01J2/04 , B24B37/044 , B42D25/29 , B82Y30/00 , C01B13/185 , C01B17/20 , C01G15/006 , C01G23/003 , C01G23/006 , C01G25/00 , C01P2002/60 , C01P2002/70 , C01P2004/03 , C01P2004/32 , C01P2004/34 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , C01P2004/80 , C01P2006/10 , C01P2006/60 , C01P2006/80 , C09D11/03 , C09D11/38 , C09G1/02 , C09K3/1436 , C09K3/1463 , C09K11/025 , C09K11/0805 , C09K11/0877 , C09K11/54 , C09K11/562 , C09K11/565 , C09K11/567 , C09K11/576 , C09K11/584 , C09K11/595 , C09K11/623 , C09K11/625 , C09K11/642 , C09K11/643 , C09K11/644 , C09K11/662 , C09K11/666 , C09K11/671 , C09K11/672 , C09K11/7701 , C09K11/7708 , C09K11/7718 , C09K11/7729 , C09K11/7731 , C09K11/7734 , C09K11/7746 , C09K11/7769 , C09K11/7771 , C09K11/7774 , C09K11/7776 , C09K11/7784 , C09K11/7786 , C09K11/7787 , C09K11/7789 , C09K11/7797 , G21K4/00 , G21K2004/06 , H01J29/085 , H01J29/20 , H01J2211/42 , H01L21/3212 , H01L23/49883 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H05B33/14 , H05B33/20 , Y10S462/903 , Y10T428/2991 , Y10T428/2993 , H01L2924/00
摘要： Phosphor powders and a method for making phosphor powders. The powders are oxygen-containing, such as metal oxides, silicates, borates or titanates and have a small particle size, narrow particle size distribution and are substantially spherical. The method of the invention advantageously permits the continuous production of such powders. The invention also relates to improved devices, such as display devices, incorporating the phosphor powders.
摘要翻译：荧光体粉末和制造荧光体粉末的方法。粉末是含氧的，例如金属氧化物，硅酸盐，硼酸盐或钛酸盐，并且具有小的粒度，窄的粒度分布并且基本上是球形的。本发明的方法有利地允许这种粉末的连续生产。本发明还涉及改进的装置，例如掺入荧光体粉末的显示装置。

185. 发明授权

US06046111A Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates 有权
标题翻译：用于终止微电子基板的机械和化学机械平面化的方法和装置
公开(公告)号：US06046111A
公开(公告)日：2000-04-04
申请号：US146330
申请日：1998-09-02
申请人： Karl M. Robinson
发明人： Karl M. Robinson
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B37/015 , B24B37/044 , B24B37/105 , B24B49/10 , B24B49/12 , B24B49/14 , B24B49/16
摘要： A method and apparatus for endpointing mechanical and chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrates. In one application in which a microelectronic substrate is planarized against a planarizing medium defined by a planarizing fluid and a polishing pad, one method of endpointing the planarizing process in accordance with the invention includes increasing the viscosity of the planarizing fluid between the substrate and the polishing pad as the substrate becomes substantially planar. The endpointing method continues by detecting a change in drag or frictional force between the substrate and the planarizing medium, and then stopping removal of material from the substrate when the rate that the friction increases between the substrate and the planarizing medium changes from a first rate to a second rate greater than the first rate. To increase the viscosity of the planarizing fluid as the substrate becomes planar, the method may further include adding resistance elements to the planarizing fluid. The resistance elements are typically separate from the abrasive particles in the planarizing medium, and the resistance elements can be selected to cause the viscosity of the planarizing fluid to increase from a first viscosity when the substrate is not substantially planar to a second viscosity when the substrate becomes at least substantially planar.
摘要翻译：用于终止半导体晶片，场发射显示器和其它微电子基板的机械和化学机械平面化的方法和装置。在微电子衬底相对于由平坦化流体和抛光垫定义的平坦化介质进行平面化的一个应用中，根据本发明的一种终止平坦化工艺的方法包括增加衬底和抛光之间的平坦化流体的粘度衬底作为基底变得基本上是平面的。通过检测衬底和平坦化介质之间的阻力或摩擦力的变化，然后当衬底和平坦化介质之间的摩擦增加的速率从第一速率变化到第一速率至第二比率大于第一率。为了在基板变成平面时增加平坦化流体的粘度，该方法还可以包括向平坦化流体添加电阻元件。电阻元件通常与平坦化介质中的磨料颗粒分离，并且可以选择电阻元件，以使得当衬底基本上不平面时，平坦化流体的粘度从第一粘度增加到基底变得至少基本上是平面的。

186. 发明授权

US5860848A Polishing silicon wafers with improved polishing slurries 失效
标题翻译：用改进的抛光浆抛光硅晶片
公开(公告)号：US5860848A
公开(公告)日：1999-01-19
申请号：US758064
申请日：1996-11-27
申请人： Scott B. Loncki , Lee Melbourne Cook , James Shen , Keith G. Pierce
发明人： Scott B. Loncki , Lee Melbourne Cook , James Shen , Keith G. Pierce
IPC分类号： B24B37/04 , C09G1/02 , B24B1/04
CPC分类号： B24B37/044 , Y10S977/775 , Y10S977/888
摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles at about 0.02 to about 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm and an iron, nickel and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.
摘要翻译：提供改进的浆料组合物和使用它的方法用于硅晶片的最终抛光。该组合物包含水，基于该组合物的约0.02至约0.5重量％的亚微米二氧化硅颗粒，浓度为约100至约1000ppm的盐，浓度足以使组合物pH为约8至约11和浓度为约20至约500ppm的聚电解质分散剂，其中所述组合物的总钠和钾含量低于约1ppm，铁，镍和铜含量低于约0.1ppm，所有ppm为组分的重量百万分数。

187. 发明授权

US5626640A Composition adapted for use in texturing process for magnetic disc 失效
标题翻译：适用于磁盘纹理处理的组合
公开(公告)号：US5626640A
公开(公告)日：1997-05-06
申请号：US631174
申请日：1996-04-12
申请人： Ken Ishitobi
发明人： Ken Ishitobi
IPC分类号： C09K3/14 , G11B5/82 , G11B5/84 , B24B3/34
CPC分类号： G11B5/8404 , B24B37/044 , C09K3/1472 , G11B5/84 , G11B5/82
摘要： A composition capable of forming uniform textured streaks and eliminating or reducing the occurrence of protrusions to as few as possible on the ground layer (the ground layer of a magnetic layer) of a magnetic disc. The composition comprises minute grains or powder of diamond etc., an alkylene gycol monoalkyl ether and a fatty acid or a metallic salt thereof.
摘要翻译：可以在磁盘的接地层（磁性层的接地层）上尽可能少地形成均匀纹理条纹并消除或减少突起的发生的组合物。组合物包含微粒或金刚石粉等，亚烷基双酚单烷基醚和脂肪酸或其金属盐。

188. 发明公开

US20240293912A1 MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL OF GROUP 13 ELEMENT IN PERIODIC TABLE 审中-公开
公开(公告)号：US20240293912A1
公开(公告)日：2024-09-05
申请号：US18574699
申请日：2022-06-29
申请人： KYOCERA Corporation
发明人： Mari YOSHIMORI HIGUCHI , Yuri ONO
IPC分类号： B24B37/32 , B24B37/04 , C30B29/40 , C30B33/10 , H01L21/02
CPC分类号： B24B37/32 , B24B37/044 , C30B29/406 , C30B33/10 , H01L21/02013
摘要： A manufacturing method of the present disclosure includes grinding at least one main surface of a crystal of a nitride of a group 13 element while housing the crystal in an opening portion provided in a plate-like carrier, and chemical mechanical polishing (CMP) the main surface ground while the substrate is housed in the carrier. The main surface is a semipolar plane, a nonpolar plane, or an N-face, a slurry used in the CMP is alkaline, and the carrier is made of carbon fiber reinforced plastic.

189. 发明公开

US20240218251A1 POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING AND METHOD OF POLISHING A SUBSTRATE 审中-公开
公开(公告)号：US20240218251A1
公开(公告)日：2024-07-04
申请号：US18403539
申请日：2024-01-03
申请人： SK enpulse Co., Ltd.
发明人： Seung Chul HONG , Kangsik MYUNG , Deok Su HAN , Han Teo PARK , Yongsoo CHOI
IPC分类号： C09K13/04 , A01N43/80 , A01N59/08 , B24B37/04 , C09K13/00 , H01L21/3105
CPC分类号： C09K13/04 , A01N43/80 , A01N59/08 , B24B37/044 , C09K13/00 , H01L21/31053
摘要： A composition for semiconductor processing includes polishing particles, water, and a biocide. The biocide includes a first biocide and a second biocide, the first biocide includes a thiazolinone-based compound, and the second biocide includes a chloric acid-based compound.

190. 发明授权

US12020946B2 Chemical mechanical polishing apparatus 有权
公开(公告)号：US12020946B2
公开(公告)日：2024-06-25
申请号：US16194640
申请日：2018-11-19
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Yu-Ping Tseng , Ren-Hao Jheng
IPC分类号： H01L21/321 , B24B9/06 , B24B37/04 , B24B37/24 , B24B37/26
CPC分类号： H01L21/3212 , B24B9/065 , B24B37/044 , B24B37/24 , B24B37/26
摘要： The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering exiting a respective plurality of screw holes.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式