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    • 186. 发明授权
    • Digital-to-analog-converter
    • 数模转换器
    • US06686859B2
    • 2004-02-03
    • US10351724
    • 2003-01-27
    • Masami AiuraSatoshi TakahashiYuichi Nakatani
    • Masami AiuraSatoshi TakahashiYuichi Nakatani
    • H03M166
    • H03M1/0643H03M1/0682H03M1/747
    • It is an objective to provide a digital-to-analog converter circuit that allows the value of the current output from each current source cell to be identical, regardless of the position of that current source cell relative to the power supply line. To ensure that the voltages supplied to the respective current source cells are identical, the power supply lines La and Lb are disposed in the form of a right triangle modified such that their line widths W1 and W2 become constantly narrower on one side depending on the position at which the power supply lines La and Lb are formed. The power supply lines La and Lb are also disposed such that their hypotenuses are opposite to each other.
    • 目的是提供数模转换器电路,其允许来自每个电流源单元的电流输出的值相同,而不管该电流源单元相对于电源线的位置如何。 为了确保提供给各个电流源单元的电压相同,电源线La和Lb以直角三角形的形式被设置,使得它们的线宽W1和W2根据位置在一侧变得不断变窄 在其上形成电源线La和Lb。 电源线La和Lb也被布置成使得它们的斜边彼此相对。
    • 188. 发明授权
    • Photoresist compositions and flexible printed wiring boards with protective layer
    • 光刻胶组合物和具有保护层的柔性印刷线路板
    • US06638689B1
    • 2003-10-28
    • US09288240
    • 1999-04-08
    • Satoshi TakahashiAkira TsutsumiKoichi UnoMinoru Nagashima
    • Satoshi TakahashiAkira TsutsumiKoichi UnoMinoru Nagashima
    • G03F740
    • H05K3/002G03F7/033H05K3/0076H05K2201/0154H05K2201/0166Y10S430/106Y10S430/107Y10S430/108Y10S430/11Y10S430/111
    • Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer. Alternatively, a film can be formed from the photoresist composition and then be applied on the surface of the polyimide precursor layer to form a photoresist layer.
    • 公开了可以获得高精度蚀刻而不产生分离的光致抗蚀剂组合物,并且用光致抗蚀剂组合物制备的柔性印刷线路板。 为了蚀刻导电电路上的聚酰亚胺前体层,将包含可光聚合有机材料(A),水溶性树脂(B)和含氨基树脂(C)的光致抗蚀剂组合物涂覆在 聚酰亚胺前体层以形成光致抗蚀剂层。 然后,通过光刻工艺对光致抗蚀剂层进行图案化。 蚀刻聚酰亚胺前体层,将光致抗蚀剂层的图案转印到聚酰亚胺前体层。 将光致抗蚀剂层中的含氨基树脂(C)与聚酰亚胺前体层中的酸酐组合以获得良好的粘附性和高精度蚀刻,而不会使光致抗蚀剂层分离。 或者,可以由光致抗蚀剂组合物形成膜,然后施加在聚酰亚胺前体层的表面上以形成光致抗蚀剂层。
    • 189. 发明授权
    • Semiconductor device manufacturing method including forming FOX with dual oxidation
    • 半导体器件制造方法,包括形成具有双重氧化的FOX
    • US06579769B2
    • 2003-06-17
    • US09726384
    • 2000-12-01
    • Hiroyuki ShimadaMasaaki HigashitaniHideo KuriharaHideki KomoriSatoshi Takahashi
    • Hiroyuki ShimadaMasaaki HigashitaniHideo KuriharaHideki KomoriSatoshi Takahashi
    • H01L21336
    • H01L21/76221
    • In a method of manufacturing a semiconductor device, there are comprised the steps of forming an oxidation preventing layer on a surface of a semiconductor substrate, forming a first window in the oxidation preventing layer, placing the semiconductor substrate in a first atmosphere in which an oxygen gas and a first amount of a chlorine gas are supplied through and then heating the semiconductor substrate at a first temperature such that a first selective oxide film is to grown by thermally oxidizing the surface of the semiconductor substrate exposed from the first window, forming a second window by patterning the oxidation preventing layer, and placing the semiconductor substrate in a second atmosphere in which the oxygen gas and a second amount, which is larger than the first amount, of the chlorine gas are supplied through and then heating the semiconductor substrate at a second temperature such that a second selective oxide film is formed and that a thickness of the first selective oxide film formed below the first window is enhanced. Accordingly, generation of projection on bird's beak of a selective oxide film can be prevented in a semiconductor device manufacturing method including a step of growing a local oxidation of silicon film.
    • 在制造半导体器件的方法中,包括在半导体衬底的表面上形成防氧化层的步骤,在氧化防止层中形成第一窗口,将半导体衬底放置在第一气氛中,其中氧气 气体和第一量的氯气通过第一温度被供应,然后在第一温度下加热半导体衬底,使得通过热氧化从第一窗口暴露的半导体衬底的表面来生长第一选择性氧化物膜,形成第二 通过图案化氧化防止层,并将半导体衬底放置在第二气氛中,在第二气氛中,将氧气和大于第一量的第二量的氯气供给到第二气氛中,然后在 第二温度使得形成第二选择性氧化物膜,并且形成第一选择性氧化物膜的厚度 增强了形成在第一窗口下方的氧化膜。 因此,在包括生长硅膜的局部氧化的步骤的半导体器件制造方法中,可以防止在选择性氧化物膜的鸟嘴上产生投影。