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    • 175. 发明申请
    • Nitride semiconductor based bipolar transistor and the method of manufacture thereof
    • 氮化物半导体双极晶体管及其制造方法
    • US20080121938A1
    • 2008-05-29
    • US11812591
    • 2007-06-20
    • Tatsuo MoritaTetsuzo Ueda
    • Tatsuo MoritaTetsuzo Ueda
    • H01L29/739H01L21/34
    • H01L29/2003H01L29/201H01L29/66318H01L29/7371
    • In a nitride semiconductor based bipolar transistor, a contact layer formed so as to contact an emitter layer is composed of n-type InAlGaN quaternary mixed crystals, the emitter layer and the contact layer are selectively removed so that the barrier height with the emitter formed thereon is small, and the ohmic electrode contact resistance can be lowered on the InAlGaN quaternary mixed crystals, for example, so that a WSi emitter electrode becomes an eave. A base electrode is formed by a self-aligned process using the emitter electrode as a mask. By such a configuration, the distance between the emitter and the edge of the base electrode is sufficiently shortened, and the base resistance can be lowered. As a result, a bipolar transistor having favorable high-frequency characteristics can be realized.
    • 在基于氮化物半导体的双极型晶体管中,形成为与发射极层接触的接触层由n型InAlGaN四元混晶构成,选择性地去除发射极层和接触层,使得其上形成有发射极的势垒高度 例如,在InAlGaN四元混晶中的欧姆电极接触电阻可以降低,使得WSi发射极成为檐。 通过使用发射电极作为掩模的自对准工艺形成基极。 通过这样的结构,能够充分地缩短发射极与基极的边缘之间的距离,能够降低基极电阻。 结果,可以实现具有良好的高频特性的双极晶体管。
    • 176. 发明授权
    • Semiconductor laser device and manufacturing method thereof
    • 半导体激光器件及其制造方法
    • US07279751B2
    • 2007-10-09
    • US11109787
    • 2005-04-20
    • Tetsuzo UedaMasaaki Yuri
    • Tetsuzo UedaMasaaki Yuri
    • H01L27/01
    • H01S5/34333B82Y20/00H01S5/0208H01S5/0425H01S5/2009H01S5/2214H01S5/2231H01S5/3214H01S2304/12Y10S438/973Y10S438/977
    • It is an object of the present invention to provide a semiconductor laser device with high-yielding in which a clack generated in an epitaxial growth layer is restrained and to the manufacturing method thereof, the semiconductor laser device includes a GaN substrate 1, an n-type GaN layer 2, an n-type AlGaN cladding layer 3, a n-type GaN guide layer 4, an InGaN multiple quantum well active layer 5, an undoped-GaN guide layer 6, a p-type AlGaN electron overflow suppression layer 7, a p-type GaN guide layer 8, a SiO2 blocking layer 9, an Ni/ITO cladding layer electrode 10 as a transparent electrode, a Ti/Au pad electrode 11, and a Ti/Al/Ni/Au electrode 12. The SiO2 blocking layer 9 is formed above the InGaN multiple quantum well active layer 5 so as to have an opening. The Ni/ITO cladding layer electrode 10 is formed inside the opening, and which is transparent for the light from the InGaN multiple quantum well active layer, and serves as a cladding layer.
    • 本发明的目的是提供一种具有高产量的半导体激光器件,其中在外延生长层中产生的夹克被抑制,并且其制造方法,半导体激光器件包括GaN衬底1, 型GaN层2,n型AlGaN包覆层3,n型GaN引导层4,InGaN多量子阱有源层5,未掺杂GaN引导层6,p型AlGaN电子溢出抑制层7 p型GaN引导层8,SiO 2阻挡层9,作为透明电极的Ni / ITO包层电极10,Ti / Au焊盘电极11和Ti / Al / Ni / Au电极12。 SiO 2阻挡层9形成在InGaN多量子阱有源层5的上方以具有开口。 Ni / ITO包层电极10形成在开口内部,对于来自InGaN多量子阱有源层的光是透明的,并且用作覆层。
    • 177. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20070210332A1
    • 2007-09-13
    • US11681408
    • 2007-03-02
    • Hiroaki UENOTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • Hiroaki UENOTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • H01L31/00
    • H01L29/7786H01L29/2003
    • It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.
    • 本发明的一个目的是提供一种半导体器件,其可以同时实现HFET的常闭模式和改进的最大值,并进一步实现gm的改善 和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄势垒层13,主要用于实现常关模式并且还实现高I max, 配置成使得栅极和源极区域之间以及栅极和漏极区域之间的半导体层17可以增加阻挡层13的厚度。 因此与阻挡层的厚度被设计为均匀的FET相比,可以实现常关模式和I 的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而改善gm和栅极漏电流的减小 可以实现。
    • 179. 发明授权
    • Semiconductor light emitting device and method for fabricating the same
    • 半导体发光器件及其制造方法
    • US07173277B2
    • 2007-02-06
    • US10717557
    • 2003-11-21
    • Satoshi TamuraTetsuzo Ueda
    • Satoshi TamuraTetsuzo Ueda
    • H01L29/04H01L29/24H01L27/15
    • H01L33/42H01L33/32
    • A semiconductor light emitting device includes a semiconductor multilayer structure comprising a plurality of Group III–V nitride semiconductor layers including two semiconductor layers of different conductivity types, and a transparent electrode formed on the semiconductor multilayer structure. The transparent electrode contains an impurity element developing the same conductivity type as that of an impurity element introduced into a semiconductor in the semiconductor multilayer structure, which semiconductor has an interface with the transparent electrode. Therefore, contact resistance between the transparent electrode and the semiconductor having the interface with the transparent electrode is decreased.
    • 半导体发光器件包括包括多个III-V族氮化物半导体层的半导体多层结构,所述III-V族氮化物半导体层包括不同导电类型的两个半导体层,以及形成在半导体多层结构上的透明电极。 透明电极含有与半导体层叠结构中的半导体中引入的杂质元素的导电类型相同的杂质元素,该半导体与透明电极具有界面。 因此,透明电极与具有与透明电极的界面的半导体之间的接触电阻降低。