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161. 发明授权

US08395182B2 Light emitting device, light emitting device package, method of manufacturing light emitting device and illumination system 有权
标题翻译：发光装置，发光装置封装，制造发光装置的方法和照明系统
公开(公告)号：US08395182B2
公开(公告)日：2013-03-12
申请号：US13030600
申请日：2011-02-18
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/385 , H01L24/24 , H01L33/62 , H01L2224/48091 , H01L2924/01012 , H01L2924/01029 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/00012 , H01L2924/00
摘要： A light emitting device according to the embodiment includes a substrate; a protective layer on the substrate; a electrode layer on the protective layer; a light emitting structure disposed on the electrode layer to generate light and provided with a first semiconductor layer, an active layer under the first semiconductor layer, and a second conductive semiconductor layer under the active layer; and a first electrode having a first end disposed on a top surface of the light emitting structure and a second end disposed on the protective layer. The protective layer comes into Schottky contact with at least one of the electrode layer and the first electrode.
摘要翻译：根据实施例的发光器件包括基板; 衬底上的保护层; 保护层上的电极层; 发光结构，设置在所述电极层上以产生光并具有第一半导体层，所述第一半导体层下的有源层和所述有源层下的第二导电半导体层; 以及第一电极，其具有设置在所述发光结构的顶表面上的第一端和设置在所述保护层上的第二端。保护层与电极层和第一电极中的至少一个进行肖特基接触。

162. 发明授权

US08354664B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08354664B2
公开(公告)日：2013-01-15
申请号：US13024883
申请日：2011-02-10
申请人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L29/06
CPC分类号： H01L33/58 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/20 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the first conductive type semiconductor layer includes a stepped structure having a second top surface stepped lower than the first top surface thereof; an insulating layer disposed on a lateral surface of the light emitting structure and the second top surface of the first conductive type semiconductor layer; an electrode electrically connected with the first conductive type semiconductor layer; an electrode layer under the second conductive type semiconductor layer; and a protective layer disposed on a periphery portion of a lower surface of the second conductive type semiconductor layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，其中第一导电类型半导体层包括阶梯式结构，其具有比第一顶表面低的第二顶表面; 绝缘层，设置在所述发光结构的侧表面和所述第一导电类型半导体层的所述第二顶表面上; 与第一导电型半导体层电连接的电极; 第二导电型半导体层下的电极层; 以及设置在所述第二导电型半导体层的下表面的周边部分上的保护层。

163. 发明授权

US08143639B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08143639B2
公开(公告)日：2012-03-27
申请号：US13011479
申请日：2011-01-21
申请人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
发明人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/22 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, an electrode on the first conductive type semiconductor layer, a reflective layer under the second conductive type semiconductor layer, a protective layer at outer peripheral portions of a lower surface of the second conductive type semiconductor layer, and a light extraction structure including a compound semiconductor on the protective layer.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，第一导电类型的电极半导体层，第二导电类型半导体层下面的反射层，在第二导电类型半导体层的下表面的外周部分处的保护层，以及在保护层上包括化合物半导体的光提取结构。

164. 发明申请

US20120050644A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20120050644A1
公开(公告)日：2012-03-01
申请号：US13219860
申请日：2011-08-29
申请人： Hwan Hee JEONG , Sang Youl Lee , Kwang Ki Choi , June O. Song
发明人： Hwan Hee JEONG , Sang Youl Lee , Kwang Ki Choi , June O. Song
IPC分类号： G02F1/13357 , H01L33/40 , G02F1/1335
CPC分类号： H01L33/40 , H01L21/28575 , H01L29/2003 , H01L33/025 , H01L33/30
摘要： A light emitting device includes a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; a first ohmic layer and a first electrode provided on the first conductivity type semiconductor layer; and a second electrode provided on the second conductivity type semiconductor layer, wherein a contact area between the first conductivity type semiconductor layer and the first ohmic layer comprises oxygen at 5% or more of an atomic ratio or nitrogen at 50% or more of an atomic ratio.
摘要翻译：发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层; 第一欧姆层和设置在第一导电类型半导体层上的第一电极; 以及设置在所述第二导电类型半导体层上的第二电极，其中所述第一导电类型半导体层和所述第一欧姆层之间的接触面积包含原子比为5％以上的氧或者为原子比为50％以上的氮比。

165. 发明申请

US20120018757A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE COMPRISING THE SAME AND LIGHTING SYSTEM 有权
标题翻译：发光装置，包含其的发光装置包装和照明系统
公开(公告)号：US20120018757A1
公开(公告)日：2012-01-26
申请号：US13189226
申请日：2011-07-22
申请人： Hwan Hee JEONG , Kwang Ki Choi , June O Song , Sang Youl Lee
发明人： Hwan Hee JEONG , Kwang Ki Choi , June O Song , Sang Youl Lee
IPC分类号： H01L33/40
CPC分类号： H01L33/38 , H01L33/0025 , H01L33/06 , H01L33/145 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/387 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a light emitting device including a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a first electrode disposed on the first conductive semiconductor layer, a reflective electrode disposed on the second conductive semiconductor layer, a channel layer disposed on the light emitting structure and surrounds the reflective electrode, and a support substrate connected to the channel layer through an adhesive layer.
摘要翻译：公开了一种发光器件，其包括发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，设置在第一导电半导体层上的第一电极，设置在第二导电半导体层上的反射电极，设置在所述发光结构上并且包围所述反射电极的沟道层，以及通过粘合剂层连接到所述沟道层的支撑衬底。

166. 发明申请

US20120001218A1 LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20120001218A1
公开(公告)日：2012-01-05
申请号：US13175549
申请日：2011-07-01
申请人： Kwang Ki CHOI , Hwan Hee JEONG , Sang Youl LEE , June O. SONG , Ji hyung MOON , Se Yeon JUNG , Tae-Yeon SEONG
发明人： Kwang Ki CHOI , Hwan Hee JEONG , Sang Youl LEE , June O. SONG , Ji hyung MOON , Se Yeon JUNG , Tae-Yeon SEONG
IPC分类号： H01L33/60 , H01L33/44 , H01L33/36
CPC分类号： H01L33/14 , H01L33/16 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Provided are a light emitting device and a method of fabricating the same. The light emitting device includes a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, the active layer being formed of a semiconductor material. Also, the light emitting device further includes a current spreading layer comprising a plurality of carbon nanotube bundles physically connected to each other on one of the first and second conductive type semiconductor layers.
摘要翻译：提供一种发光器件及其制造方法。发光器件包括第一导电类型半导体层，第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层，有源层由半导体材料形成。此外，发光器件还包括电流扩展层，其包括在第一和第二导电类型半导体层中的一个上彼此物理连接的多个碳纳米管束。

167. 发明申请

US20110291140A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 审中-公开
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110291140A1
公开(公告)日：2011-12-01
申请号：US13116192
申请日：2011-05-26
申请人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
发明人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
IPC分类号： H01L33/10 , H01L33/26
CPC分类号： H01L33/40 , H01L33/0079 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/405 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a gallium barrier layer on the light emitting structure layer, and a metal electrode layer on the gallium barrier layer.
摘要翻译：提供了一种发光装置。发光器件包括发光结构层，该发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层，发光结构层上的镓阻挡层，以及镓势垒上的金属电极层层。

168. 发明申请

US20110248237A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110248237A1
公开(公告)日：2011-10-13
申请号：US13049126
申请日：2011-03-16
申请人： Kwang Ki CHOI , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki CHOI , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/06
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/22 , H01L33/385 , H01L33/44 , H01L2924/0002 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。导电层设置在发光结构层的下方。接合层设置在导电层下方。支撑构件设置在接合层下方。第一衬垫设置在支撑构件的下方。第二垫片设置在支撑构件的下方距离第一垫片一定距离处。第一电极连接在第一导电类型半导体层和第一焊盘之间。第二电极连接在接合层和第二焊盘之间。

169. 发明申请

US20110220944A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110220944A1
公开(公告)日：2011-09-15
申请号：US13033264
申请日：2011-02-23
申请人： Kwang Ki CHOI , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki CHOI , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/60 , B82Y99/00
CPC分类号： H01L33/42 , B82Y20/00 , F21K9/23 , F21W2131/103 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/145 , H01L33/22 , H01L33/40 , H01L33/44 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a nano-tube layer including a plurality of carbon nano tubes on the light emitting structure, and a second electrode on the light emitting structure.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括第一电极，在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构，在发光结构上包括多个碳纳米管的纳米管层，以及在发光结构上的第二电极。

170. 发明申请

US20110193123A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110193123A1
公开(公告)日：2011-08-11
申请号：US13024874
申请日：2011-02-10
申请人： Ji Hyung MOON , Hwan Hee Jeong , Sang Youl Lee , June O. Song , Kwang Ki Choi
发明人： Ji Hyung MOON , Hwan Hee Jeong , Sang Youl Lee , June O. Song , Kwang Ki Choi
IPC分类号： H01L33/42 , H01L33/46
CPC分类号： H01L33/382 , H01L33/385 , H01L33/486 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer under the first conductive type semiconductor layer, and a second conductive type semiconductor layer under the active layer; a conductive layer under the second conductive type semiconductor layer; an adhesive layer under the conductive layer; a support member under the adhesive layer; a contact electrode connected to the first conductive type semiconductor layer; a first lead electrode under the support member; a first electrode connecting the contact electrode to the first lead electrode on a first region of the support member; a second electrode connected to at least one of the conductive layer and the adhesive layer on a second region of the support member; a second lead electrode connected to the second electrode under the support member; and a first insulating layer between the contact electrode and the light emitting structure layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构层，该发光结构层包括第一导电类型半导体层，第一导电类型半导体层下面的有源层和有源层下面的第二导电类型半导体层; 第二导电类型半导体层下的导电层; 导电层下方的粘合剂层; 在粘合剂层下面的支撑构件; 连接到所述第一导电类型半导体层的接触电极; 在支撑构件下方的第一引线电极; 在所述支撑构件的第一区域上将所述接触电极连接到所述第一引线电极的第一电极; 在所述支撑构件的第二区域上连接到所述导电层和所述粘合剂层中的至少一个的第二电极; 第二引线电极，其在所述支撑构件的下方连接到所述第二电极; 以及在所述接触电极和所述发光结构层之间的第一绝缘层。

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