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1. 发明授权

US08791494B2 Light emitting device and light emitting device package 有权
公开(公告)号：US08791494B2
公开(公告)日：2014-07-29
申请号：US14055675
申请日：2013-10-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00 , H01L33/36 , H01L33/44 , H01L33/40 , H01L33/42 , H01L33/10 , H01L33/22
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

2. 发明授权

US08471241B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08471241B2
公开(公告)日：2013-06-25
申请号：US13049126
申请日：2011-03-16
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/06
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/22 , H01L33/385 , H01L33/44 , H01L2924/0002 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。导电层设置在发光结构层的下方。接合层设置在导电层下方。支撑构件设置在接合层下方。第一衬垫设置在支撑构件的下方。第二垫片设置在支撑构件的下方距离第一垫片一定距离处。第一电极连接在第一导电类型半导体层和第一焊盘之间。第二电极连接在接合层和第二焊盘之间。

3. 发明授权

US08421112B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08421112B2
公开(公告)日：2013-04-16
申请号：US12986592
申请日：2011-01-07
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L31/0224
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。

4. 发明授权

US08963179B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08963179B2
公开(公告)日：2015-02-24
申请号：US13033264
申请日：2011-02-23
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/40 , H01L33/44 , H01L33/22 , H01L33/42 , B82Y20/00
CPC分类号： H01L33/42 , B82Y20/00 , F21K9/23 , F21W2131/103 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/145 , H01L33/22 , H01L33/40 , H01L33/44 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a nano-tube layer including a plurality of carbon nano tubes on the light emitting structure, and a second electrode on the light emitting structure.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括第一电极，在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构，在发光结构上包括多个碳纳米管的纳米管层，以及在发光结构上的第二电极。

5. 发明授权

US08803174B2 Light emitting device, light emitting device package 有权
标题翻译：发光装置，发光装置封装
公开(公告)号：US08803174B2
公开(公告)日：2014-08-12
申请号：US13040984
申请日：2011-03-04
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi , Dae Sung Kang
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi , Dae Sung Kang
IPC分类号： H01L33/00 , H01L33/62 , H01L33/36 , H01L33/44
CPC分类号： H01L33/0079 , H01L33/12 , H01L33/20 , H01L33/32 , H01L33/36 , H01L33/44 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method of manufacturing a light emitting device. The light emitting device includes a nitride semiconductor layer, an electrode on the nitride semiconductor layer, a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer under the nitride semiconductor layer, and a conductive layer under the light emitting structure. The nitride semiconductor layer has band gap energy lower than band gap energy of the first conductive type semiconductor layer.
摘要翻译：公开了一种制造发光器件的方法。发光器件包括氮化物半导体层，氮化物半导体层上的电极，在氮化物半导体层下面的包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，以及导电层下发光结构。氮化物半导体层具有比第一导电型半导体层的带隙能量低的带隙能量。

6. 发明申请

US20110210362A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE THEREOF 有权
标题翻译：发光器件及其发光器件封装
公开(公告)号：US20110210362A1
公开(公告)日：2011-09-01
申请号：US13102478
申请日：2011-05-06
申请人： Sang Youl Lee , Ji Hyung Moon , June O. Song , Kwang Ki Choi , Chung Song Kim , Hwan Hee Jeong
发明人： Sang Youl Lee , Ji Hyung Moon , June O. Song , Kwang Ki Choi , Chung Song Kim , Hwan Hee Jeong
IPC分类号： H01L33/60 , H01L33/58
CPC分类号： H01L33/38 , H01L33/0079 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： A light emitting device includes a light emitting structure including a second conduction type semiconductor layer, an active layer, and a first conduction type semiconductor layer, a second electrode layer arranged under the light emitting structure, a first electrode layer having at least portion extending to contact the first conduction type semiconductor layer passing the second conduction type semiconductor layer and the active layer, and an insulating layer arranged between the second electrode layer and the first electrode layer, between the second conduction type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer, wherein said at least one portion of the first electrode layer contacting the first conduction type semiconductor layer has a roughness.
摘要翻译：发光器件包括发光结构，其包括第二导电类型半导体层，有源层和第一导电类型半导体层，布置在发光结构下的第二电极层，第一电极层，至少部分延伸到接触通过第二导电类型半导体层和有源层的第一导电类型半导体层，以及布置在第二电极层和第一电极层之间，在第二导电类型半导体层和第一电极层之间以及介于所述有源层和所述第一电极层，其中所述与所述第一导电型半导体层接触的所述第一电极层的所述至少一部分具有粗糙度。

7. 发明申请

US20110198991A1 LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION SYSTEM 有权
标题翻译：发光装置，其制造方法，发光装置包装和照明系统
公开(公告)号：US20110198991A1
公开(公告)日：2011-08-18
申请号：US13028686
申请日：2011-02-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01J1/62 , H01L33/32 , H01L33/26 , H01L33/40 , H01L33/22 , H01L33/60
CPC分类号： H01L33/62 , H01L33/08 , H01L33/20 , H01L33/42 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and an illumination system. The light emitting device includes a transmissive substrate, an ohmic layer on the transmissive substrate, a light emitting structure on the ohmic layer and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers, a electrode layer on a bottom surface of the transmissive substrate, and a conductive via electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.
摘要翻译：公开了发光器件，其制造方法，发光器件封装和照明系统。发光器件包括透射衬底，透射衬底上的欧姆层，欧姆层上的发光结构，并且包括第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层，透射基板的底面上的电极层，以及通过透射基板将发光结构与电极层电连接的导电通孔，其中透射基板的面积从下部向其上部增加。

8. 发明申请

US20110193113A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME 有权
标题翻译：发光装置和具有该发光装置的发光装置包装
公开(公告)号：US20110193113A1
公开(公告)日：2011-08-11
申请号：US12986592
申请日：2011-01-07
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O. Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O. Song , Kwang Ki Choi
IPC分类号： H01L33/08 , H01L33/38 , H01L33/58
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。

9. 发明申请

US20110089452A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20110089452A1
公开(公告)日：2011-04-21
申请号：US12797927
申请日：2010-06-10
申请人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon , Kwang Ki Choi
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01L2924/00014
摘要： A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, a reflective layer, a conductive support member, and a channel layer. The light-emitting structure may include a plurality of compound semiconductor layers. The electrode may be disposed on the compound semiconductor layer. The reflective layer may be disposed under the compound semiconductor layer. The conductive support member may be disposed under the reflective layer. The channel layer may be disposed along a bottom edge of the compound semiconductor layer.
摘要翻译：提供了一种半导体发光器件。半导体发光器件可以包括发光结构，电极，反射层，导电支撑构件和沟道层。发光结构可以包括多个化合物半导体层。电极可以设置在化合物半导体层上。反射层可以设置在化合物半导体层之下。导电支撑构件可以设置在反射层下方。沟道层可以沿着化合物半导体层的底部边缘设置。

10. 发明授权

US08525215B2 Light emitting device, method of manufacturing the same, light emitting device package, and lighting system 有权
标题翻译：发光器件，其制造方法，发光器件封装和照明系统
公开(公告)号：US08525215B2
公开(公告)日：2013-09-03
申请号：US13175424
申请日：2011-07-01
申请人： Kwang Ki Choi , Hwan Hee Jeong , Ji hyung Moon , Sang Youl Lee , June O Song , Se Yeon Jung , Tae-Yeon Seong
发明人： Kwang Ki Choi , Hwan Hee Jeong , Ji hyung Moon , Sang Youl Lee , June O Song , Se Yeon Jung , Tae-Yeon Seong
IPC分类号： H01L33/42
CPC分类号： H01L33/22 , H01L33/14 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes: a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an oxide protrusion disposed on at least a portion of the second conducive semiconductor layer; and a current spreading layer on the second conductive semiconductor layer and the oxide protrusion.
摘要翻译：提供了发光器件，其制造方法，发光器件封装和照明系统。发光器件包括：包括第一导电半导体层，有源层和第二导电半导体层的发光结构层; 设置在所述第二导电半导体层的至少一部分上的氧化物突起; 以及在第二导电半导体层和氧化物突起上的电流扩展层。

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