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    • 2. 发明授权
    • Light emitting device, light emitting device package, and lighting system
    • 发光装置,发光装置封装和照明系统
    • US08471241B2
    • 2013-06-25
    • US13049126
    • 2011-03-16
    • Kwang Ki ChoiHwan Hee JeongSang Youl LeeJune O SongJi Hyung Moon
    • Kwang Ki ChoiHwan Hee JeongSang Youl LeeJune O SongJi Hyung Moon
    • H01L33/06
    • H01L33/62H01L33/0079H01L33/22H01L33/385H01L33/44H01L2924/0002H01L2924/00
    • Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.
    • 提供了一种发光器件,发光器件封装和照明系统。 发光器件包括发光结构层,导电层,接合层,支撑构件,第一和第二焊盘以及第一和第二电极。 发光结构层包括第一导电类型半导体层,有源层和第二导电类型半导体层。 导电层设置在发光结构层的下方。 接合层设置在导电层下方。 支撑构件设置在接合层下方。 第一衬垫设置在支撑构件的下方。 第二垫片设置在支撑构件的下方距离第一垫片一定距离处。 第一电极连接在第一导电类型半导体层和第一焊盘之间。 第二电极连接在接合层和第二焊盘之间。