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141. 发明申请

US20050247444A1 Tube for heat exchanger 有权
标题翻译：管换热器
公开(公告)号：US20050247444A1
公开(公告)日：2005-11-10
申请号：US10520404
申请日：2003-06-25
申请人： Hajime Ohata , Jun Akaike , Naoto Takayanagi , Shoji Akiyama , Yoshihisa Eto
发明人： Hajime Ohata , Jun Akaike , Naoto Takayanagi , Shoji Akiyama , Yoshihisa Eto
IPC分类号： F28D1/03 , F28D1/053 , F28F3/02 , F28F9/02 , F28F1/00
CPC分类号： F28D1/05391 , F28D1/0391 , F28F3/025 , F28F9/0202 , F28F9/0224 , Y10T29/49391
摘要： In a tube (4) for a heat exchanger comprising a flat pipe (16) whose both ends are opened and in which a flow path (15) for a heat exchanging medium is formed, and an inner fin (17) arranged in the flow path (15), wherein said flat pipe (16) is constituted of a sheet of material for a flat pipe, the inner fin is constituted of two opposing flat plate portions (17b, 17c) connected along one of side edges of said flat pipe (16) and formed in a flat plate shape so as to be in contact with an inner surface of the said flat pipe (16), and projection portions (17d) which are projected from at least one of the flat plate portions (17b, 17c) and whose tops are in contact with the other opposing flat plate portion (17b, 17c). It is preferred that the projection portions (17d) are projected from both of the flat plate portions (17b, 17c) toward the opposing flat plate portion, and the opposing tops are made come in contact with each other. The tube for a heat exchanger which can prevent significant deformation of the inner fin from occurring when the inner fin included in the flat pipe is cut in a width direction thereof together with the flat pipe can be provided.
摘要翻译：在一种用于热交换器的管（4）中，该管（4）包括一个扁平管（16），其两端开口，其中形成有用于热交换介质的流路（15）和布置在流体中的内翅片路径（15），其中所述扁平管（16）由用于扁平管的材料片构成，所述内翅片由两个相对的平板部分（17b，17c）构成，所述相对的平板部分（17b，17c）沿着所述扁平管16形成为与所述扁平管16的内表面接触的平板形状，以及从所述平板部中的至少一个突出的突出部（17d）（17b，17c），并且其顶部与另一个相对的平板部分（17b，17c）接触。优选的是，突出部分（17d）从两个平板部分（17b，17c）朝向相对的平板部分突出，并使相对的顶部彼此接触。可以提供一种热交换器用管，其能够防止在包含在扁平管内的内翅片与扁平管一起在其宽度方向上切断内翅片的显着变形。

142. 发明授权

US06944368B2 Waveguide-to-semiconductor device coupler 有权
标题翻译：波导到半导体器件耦合器
公开(公告)号：US06944368B2
公开(公告)日：2005-09-13
申请号：US10733977
申请日：2003-12-11
申请人： Lionel C. Kimerling , Kazumi Wada , Shoji Akiyama
发明人： Lionel C. Kimerling , Kazumi Wada , Shoji Akiyama
IPC分类号： G02B6/12 , G02B6/28 , G02B6/42 , G02B6/26
CPC分类号： G02B6/2813 , G02B6/12002 , G02B6/12004 , G02B6/42 , G02B2006/12159 , G02B2006/12195
摘要： A waveguide-semiconductor coupling device includes a waveguide structure that includes a multimode interferometer (MMI) structure so as to minimize the reflections of TE modes in the coupling device. A mesa structure is coupled to the waveguide structure so as to minimize the reflections of TM modes in the coupling device.
摘要翻译：波导 - 半导体耦合器件包括包括多模干涉仪（MMI）结构的波导结构，以便使耦合器件中TE模的反射最小化。台面结构耦合到波导结构，以便使耦合装置中TM模的反射最小化。

143. 发明授权

US06860324B2 Heat exchanger 失效
标题翻译：热交换器
公开(公告)号：US06860324B2
公开(公告)日：2005-03-01
申请号：US10466917
申请日：2002-01-23
申请人： Soichi Kato , Shoji Akiyama
发明人： Soichi Kato , Shoji Akiyama
IPC分类号： F28F9/02 , B23K1/00 , B23K1/008 , B23K33/00 , B23K101/14 , F28F9/04 , F28F9/26 , F28F9/16
CPC分类号： B23K1/0012 , B23K1/008 , B23K33/00 , B23K33/008 , B23K2101/14 , B23K2103/10 , F25B2339/0446 , F28F9/0246 , F28F9/0251 , Y10T29/49393
摘要： A heat exchanger for performing heat exchange of a medium by heat conducted to tubes (210) and fins (220), the heat exchanger is configured by assembling the tubes, the fins, tanks (300) and a connector (400) and heating them in a furnace to be brazed into one body, wherein the connector is made of aluminum or its alloy and has a seating face to be brazed to the outer surface of the tank, and when it is determined that the connector has a surface area of X [cm2] and a volume of Y [cm3], they have a relation of X≧1.5·(36πY2)1/3, Y≦30.
摘要翻译：一种用于通过传导到管（210）和翅片（220）的热进行介质热交换的热交换器，热交换器通过组装管，翅片，罐（300）和连接器（400）来构造并加热它们在要被钎焊成一体的炉中，其中连接器由铝或其合金制成并且具有待钎焊到罐的外表面的就座面，并且当确定连接器的表面积为X [cm 2]和体积Y [cm 3]，它们具有X> = 1.5的关系（36piY 2）<1/3>，Y <= 30。

144. 发明授权

US06467170B2 Tube for heat exchangers and method of manufacturing same 失效
标题翻译：热交换器用管及其制造方法
公开(公告)号：US06467170B2
公开(公告)日：2002-10-22
申请号：US09463190
申请日：2000-01-21
申请人： Soichi Kato , Muneo Sakurada , Shin Kurihara , Sadao Haiya , Takashi Sugita , Shoji Akiyama , Takahumi Umehara
发明人： Soichi Kato , Muneo Sakurada , Shin Kurihara , Sadao Haiya , Takashi Sugita , Shoji Akiyama , Takahumi Umehara
IPC分类号： B23P1526
CPC分类号： F28D1/0391 , Y10T29/49384 , Y10T29/49391
摘要： A tube for a heat exchanger which is formed to have beads for dividing passages for a medium in the tube by roll forming, wherein base portions of the beads are formed to have a thickness (B) greater than a thickness of a plate material for the tube. The roll forming has a first step of sequentially bending the plate to have a depressed shape to form portions-to-be-bead which are to be intermediate forms of the beads, a second step of performing a width drawing of the portions-to-be-bead and a third step of compressing the portions-to-be-bead, after the second step, in a direction of the height of the beads, wherein a width (w′) of the depressions of the portions-to-be-bead (21a) in the first step is larger than a width (w) of depressions of beads (21) after forming, and a height (h′) of portions-to-be-bead (21b) after the second step is determined to be higher than a height (h) of the beads (21) after forming. Thus, the tube for a heat exchanger having a pressure resistance of the base portions of the beads improved and a method for producing the tube for a heat exchanger which can decrease an uneven thickness of the plate when the beads are formed are obtained.
摘要翻译：一种用于热交换器的管，其形成为具有用于通过辊轧成型在管中分配用于介质的通道的珠，其中，所述珠的基部形成为具有大于所述板的材料的厚度的厚度（B）管。辊成型具有顺序地弯曲板以具有凹陷形状以形成为珠的中间形式的部分珠的第一步骤，第二步是进行部分 - 并且在第二步骤之后，在珠的高度方向上压缩部分待珠的第三步骤，其中待部分的凹陷的宽度（w'）为第一步骤中的胎圈（21a）大于成形后的胎圈（21）的凹部的宽度（w），第二工序后的部分胎圈（21b）的高度（h'）为确定为高于成形后的珠粒（21）的高度（h）。因此，获得了具有小珠基部的耐压性的热交换器的管，并且获得了当形成珠时能够减小板的不均匀厚度的用于热交换器的管的制造方法。

145. 发明授权

US06245647B1 Method for fabrication of thin film 失效
标题翻译：薄膜制造方法
公开(公告)号：US06245647B1
公开(公告)日：2001-06-12
申请号：US09253763
申请日：1999-02-22
申请人： Shoji Akiyama , Toru Otsuka , Hitoshi Habuka
发明人： Shoji Akiyama , Toru Otsuka , Hitoshi Habuka
IPC分类号： H01L2176
CPC分类号： C23C16/4411 , C23C16/22 , C23C16/24 , C30B25/02 , C30B25/10 , H01L21/02381 , H01L21/02532 , H01L21/02579 , H01L21/0262
摘要： The invention provides a method for forming a thin film uniform in resistivity distribution on a semiconductor substrate. The temperature of the inside wall (6) of the reaction vessel (2) of vapor phase growth equipment is controlled to below the thermal decomposition temperature of a dopant gas such as diborane, for example, to within a range of room temperature to 250° C. The region of this temperature range is defined so as to range from the upstream-side end of the semiconductor substrate (1) to at least an upstream-side {fraction (1/3 )} point of the substrate diameter along the direction of flow of the dopant gas supplied from one end of the reaction vessel (2), desirably, over the entire region just above the semiconductor substrate (1).
摘要翻译：本发明提供一种在半导体衬底上形成电阻率分布薄膜均匀的方法。将气相生长设备的反应容器（2）的内壁（6）的温度控制在低于诸如乙硼烷的掺杂剂气体的热分解温度，例如在室温至250℃的范围内该温度范围的区域被定义为从半导体基板（1）的上游侧端部至基板直径的至少上游侧（分数（1/3））点的方向从反应容器（2）的一端提供的掺杂剂气体的流动优选地在半导体衬底（1）正上方的整个区域上。

146. 发明授权

US5857367A Brazing method 失效
标题翻译：钎焊法
公开(公告)号：US5857367A
公开(公告)日：1999-01-12
申请号：US761383
申请日：1996-12-09
申请人： Shoji Akiyama
发明人： Shoji Akiyama
IPC分类号： B23K1/00 , B23K1/19 , B23K1/20 , B23K3/00 , B23K35/363 , F28D1/03 , B21D5/14
CPC分类号： B23K1/203 , F28D1/0391 , B23K2203/10
摘要： In a brazing method, a flux-mixed liquid is prepared by mixing a brazing flux with a quick-drying oil. The flux-mixed liquid, when it is spread to an aluminum or aluminum alloy work, fixes the brazing flux to the work by a quick-drying character of the quick-drying oil within a short time. Also, in the brazing method, the flux-mixed liquid is prepared by mixing the brazing flux with an aqueous solution in which a solid lubricant is melted in water. The solid lubricant melts in water at or above a prescribed temperature, and forms a film when the temperature is below the prescribed temperature. The flux-mixed liquid, when it is spread to the work, immediately forms the film due to a drop in temperature below the prescribed temperature and fixes the brazing flux to the work by the film within a short time.
摘要翻译：在钎焊方法中，通过将钎焊助熔剂与快干油混合来制备助熔剂混合液。助熔剂混合液在扩散到铝或铝合金工件时，可以在短时间内通过快干油的快干特性将钎焊剂固定在工件上。此外，在钎焊方法中，通过将钎焊助熔剂与其中固体润滑剂在水中熔融的水溶液混合来制备助熔剂混合液。固体润滑剂在规定温度以上的水中熔融，当温度低于规定温度时，形成膜。助熔剂混合液体在扩散到工件时，由于温度低于预定温度而立即形成膜，并在短时间内将薄膜固定在工件上。

147. 发明授权

US09176042B2 Microchip and particulate analyzing device 有权
标题翻译： Microchip和微粒分析装置
公开(公告)号：US09176042B2
公开(公告)日：2015-11-03
申请号：US13580912
申请日：2011-02-18
申请人： Tatsumi Ito , Shoji Akiyama , Masaya Kakuta , Takeshi Yamasaki
发明人： Tatsumi Ito , Shoji Akiyama , Masaya Kakuta , Takeshi Yamasaki
IPC分类号： G01N1/00 , G01N15/14 , B01L3/00 , G01N15/10
CPC分类号： B01L3/502707 , B01L3/502776 , B01L2200/10 , B01L2200/12 , B01L2300/0867 , B01L2300/0887 , G01N1/28 , G01N15/1056 , G01N15/1404 , G01N15/1484 , G01N2015/1413
摘要： A microchip is provided which includes a first introduction channel, second introduction channels arranged to sandwich the first introduction channel and merged with the first introduction channel from both sides, and a merge channel connected to the first introduction channel and the second introduction channels, where fluids fed from the first and the second introduction channels are merged and flow, wherein the merge channel has a tapered portion formed so that a channel width in a sandwiching direction along which the first introduction channel is sandwiched by the second introduction channels gradually increases along a fluid feeding direction.
摘要翻译：提供了一种微芯片，其包括第一引入通道，布置成夹住第一引入通道并与两侧与第一引入通道并入的第二引入通道，以及连接到第一引入通道和第二引入通道的合流通道，其中流体从第一和第二引入通道供给的第一引入通道和第二引入通道相互合流并流动，其中合流通道具有锥形部分，其形成为使得第一引入通道夹在第二引入通道之间的夹持方向上的通道宽度沿着流体逐渐增加喂养方向。

148. 发明申请

US20140174206A1 MICROCHIP AND PARTICLE ANALYZING APPARATUS 有权
标题翻译：微孔和颗粒分析装置
公开(公告)号：US20140174206A1
公开(公告)日：2014-06-26
申请号：US14234469
申请日：2012-06-29
申请人： Yuji Akiyama , Shoji Akiyama , Takeshi Yamasaki
发明人： Yuji Akiyama , Shoji Akiyama , Takeshi Yamasaki
IPC分类号： G01N1/00 , G01N21/01
CPC分类号： B01L3/0268 , B01L3/502707 , B01L3/502761 , B01L3/502776 , B01L2200/0652 , B01L2200/12 , B01L2300/0816 , B01L2300/0887 , B01L2400/0433 , B01L2400/0487 , G01N1/00 , G01N15/1484 , G01N21/01 , G01N2015/149
摘要： There is provided a microchip including a flow channel, an ejection portion, and a cutout portion. The flow channel is configured to convey a fluid therein. The ejection portion includes an opening directed toward an end face of a substrate layer, and the ejection portion is configured to eject the fluid flowing through the flow channel to outside. The substrate layer is laminated to each other. The cutout portion is formed between the opening of the ejection portion and the end face of the substrate layer. The cutout portion has a larger diameter than that of the opening.
摘要翻译：提供了一种包括流路，喷射部和切口部的微芯片。流动通道构造成在其中输送流体。喷射部包括朝向基板层的端面的开口部，喷出部构成为将流过流路的流体喷出到外部。基板层彼此层叠。切口部形成在喷射部的开口部与基板层的端面之间。切口部的直径比开口的直径大。

149. 发明授权

US08716106B2 Method for producing a bonded substrate 有权
标题翻译：键合衬底的制造方法
公开(公告)号：US08716106B2
公开(公告)日：2014-05-06
申请号：US12744567
申请日：2008-11-27
申请人： Shoji Akiyama
发明人： Shoji Akiyama
IPC分类号： H01L21/30
CPC分类号： H01L21/187 , H01L21/76254 , H01L29/1054
摘要： A method for producing a bonded substrate having a Si1-xGex (0
摘要翻译：一种具有Si1-xGex（0＆lt; x＆lt; 1E; 1）膜的键合衬底的制造方法，其中已经引入了比以往任何时候的双轴应变。具体地说，该方法至少包括以下步骤：提供施主晶片和具有低于施主晶片的热膨胀系数的处理晶片，将氢和惰性气体中的任何一种或两者的离子注入到供体晶片中以形成离子注入层，在施主晶片和处理晶片的至少一个接合表面上执行等离子体激活处理，将施主晶片接合到处理晶片，通过对离子注入施加机械冲击来分裂供体晶片层，在施主晶片的分割面上进行表面处理，并在分割面上外延生长Si1-xGex（0

150. 发明授权

US08657121B2 Microparticle sorting apparatus, microchip and microchip module 有权
标题翻译：微粒分选装置，微芯片和微芯片模块
公开(公告)号：US08657121B2
公开(公告)日：2014-02-25
申请号：US13096434
申请日：2011-04-28
申请人： Masataka Shinoda , Takeshi Matsui , Akiko Tsuji , Takeshi Yamasaki , Shoji Akiyama
发明人： Masataka Shinoda , Takeshi Matsui , Akiko Tsuji , Takeshi Yamasaki , Shoji Akiyama
IPC分类号： B07C5/00 , B01L3/00
CPC分类号： B01L3/502761 , B01L3/0268 , B01L3/502715 , B01L3/502776 , B01L9/527 , B01L2200/141 , B01L2300/0816 , B01L2300/0887 , B01L2300/089 , B01L2400/0415 , B01L2400/049 , G01N15/1404 , G01N15/1484 , G01N2015/1418 , G01N2015/149
摘要： Disclosed herein is a microchip including a substrate and a sample flow path within the substrate. The sample flow path includes a changing flow path and a microtube connected to the changing flow path. The changing flow path is configured to change a cross sectional shape of the sample flow path from a quadrangular shape at a first end to a circular shape at a second end. The microtube is connected to the second end of the changing flow path and is disposed within the substrate.
摘要翻译：本文公开了一种微芯片，其包括衬底和衬底内的样品流动路径。样品流路包括改变的流动路径和连接到变化的流动路径的微管。变化的流动路径被配置为将样品流动通道的横截面形状从第一端的四边形变为第二端的圆形。微管连接到变化流路的第二端并设置在衬底内。

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