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    • 131. 发明授权
    • Thermoelectric module with interarray bridges
    • 带电桥的热电模块
    • US06400013B1
    • 2002-06-04
    • US09709577
    • 2000-11-13
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • H01L2334
    • H01L35/325H01L35/32H01L2924/0002H01L2924/00
    • A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
    • 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片,以形成串联电路。 芯片被布置成给出至少三个芯片阵列,每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥,以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥,其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧,形成多个第二桥,每个第二桥整体地连接两个相邻的第二触点,以给出第二离散耦合,用于电连接每个芯片阵列中的两个相邻的芯片。 因此,阵列间桥仅形成在芯片的一侧,用于相邻芯片阵列之间的第一触点的互连。 因此,施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。
    • 136. 发明授权
    • Image device for forming an erected image
    • 用于形成竖立图像的图像装置
    • US06181473B2
    • 2001-01-30
    • US09219885
    • 1998-12-24
    • Kazuhiro FujitaIkuo MaedaHiroyuki Inoue
    • Kazuhiro FujitaIkuo MaedaHiroyuki Inoue
    • G02B2710
    • G02B3/005B41J2/451G02B5/045H04N1/0311
    • A plurality of first cylindrical lenses aligned in an array, having a collecting function with respect to an alignment direction parallel to the array, to collect luminous flux from a body to be imaged. A first reflective collector-surface having a reflective collecting function with respect to a perpendicular direction perpendicular to the alignment direction collects the luminous flux from the plurality of first cylindrical lenses, and provides a collected parallel luminous flux to a plurality of roof-mirror type reflective plane-pairs or to a plurality of right-angle prisms. The plurality of roof-mirror type reflective plane-pairs or right-angle prisms reflects the luminous flux toward a second reflective collector-surface disposed for convergence of the luminous flux with respect to the perpendicular direction. The second reflective collector-surface reflects the luminous flux toward a plurality of second cylindrical lenses disposed for convergence of the luminous flux with respect to the alignment direction. Further, the luminous flux from the plurality of second cylindrical lenses converges to form an image.
    • 多个第一柱面透镜阵列排列,具有相对于平行于该阵列的取向方向的收集功能,以从要成像的物体收集光通量。 具有相对于垂直于对准方向的垂直方向具有反射收集功能的第一反射集电极表面收集来自多个第一柱面透镜的光通量,并且将收集的平行光通量提供给多个屋顶反射镜型反射 平面对或多个直角棱镜。 多个屋顶镜型反射平面对或直角棱镜将光束反射到被设置成相对于垂直方向会聚光束的第二反射集电极表面。 第二反射集电体表面反射朝向相对于取向方向会聚光束的多个第二柱面透镜的光通量。 此外,来自多个第二柱面透镜的光通量会聚以形成图像。