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121. 发明授权

US07220365B2 Devices using a medium having a high heat transfer rate 失效
标题翻译：使用具有高传热速率的介质的装置
公开(公告)号：US07220365B2
公开(公告)日：2007-05-22
申请号：US09928883
申请日：2001-08-13
申请人： YuZhi Qu , ZhiPeng Qu , Jason Chao , YuFu Li , Peng Chen , JunHua Yan , Hong Yuan Yang , Qi Feng Wei
发明人： YuZhi Qu , ZhiPeng Qu , Jason Chao , YuFu Li , Peng Chen , JunHua Yan , Hong Yuan Yang , Qi Feng Wei
IPC分类号： C09K5/14
CPC分类号： H05K7/20336 , B01J2208/00123 , B01J2208/00185 , B01J2219/00078 , B65D88/744 , C09K5/14 , F01K13/00 , F22B21/00 , F24S10/90 , F24S60/30 , F28D1/0213 , F28D7/10 , F28D15/00 , F28D15/0266 , F28D15/0275 , F28D21/0003 , F28F1/14 , F28F1/34 , F28F13/00 , H01L23/427 , H01L2924/0002 , Y02E10/44 , Y10S165/905 , Y10T428/1317 , H01L2924/00
摘要： Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Further disclosed are applications of the heat transfer element.
摘要翻译：公开了一种具有高传热速率的传热介质，可用于更宽的领域，结构简单，易于制造，无害环境，并且能够以高效率的方式快速传导热量并保持热量。还公开了传热面和利用该传热介质的传热元件。进一步公开了传热元件的应用。

122. 发明申请

US20060120035A1 Computer component protection 有权
公开(公告)号：US20060120035A1
公开(公告)日：2006-06-08
申请号：US11336102
申请日：2006-01-19
申请人： Nick Merz , John DiFonzo , Michael Prichard
发明人： Nick Merz , John DiFonzo , Michael Prichard
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

123. 发明授权

US07002802B2 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
标题翻译：冷却装置，电子设备，显示单元以及冷却装置的制造方法
公开(公告)号：US07002802B2
公开(公告)日：2006-02-21
申请号：US11073627
申请日：2005-03-08
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
摘要翻译：冷却装置包括由聚酰亚胺树脂制成的流路基板，中间基板和盖基板，以及并入由中间基板和蒸发器基板的孔的冷凝器基板，所述中空基板和蒸发器基板由具有高导热性，由此能够将来自热源的热量封入蒸发器基板和冷凝器基板，从而可以显着提高潜热量。

124. 发明授权

US06788537B2 Heat pipe circuit board 失效
标题翻译：热管电路板
公开(公告)号：US06788537B2
公开(公告)日：2004-09-07
申请号：US10431954
申请日：2003-05-08
申请人： Yukihiro Saita , Keiji Mashimo
发明人： Yukihiro Saita , Keiji Mashimo
IPC分类号： H05K720
CPC分类号： H05K7/20336 , F28D15/0233 , F28F2275/20 , H05K1/0272
摘要： A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.
摘要翻译：一种热管电路板，包括：热管; 至少一个绝缘层; 设置在所述至少一个绝缘层的表面上或内部的电路图案; 并且电子部件通过绝缘层安装在热管上。热管通过摩擦搅拌焊接接合两个板构件而形成，两个板构件中的至少一个设置有作为工作流体的流体通道的凹部。

125. 发明授权

US06785135B2 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
标题翻译：冷却装置，电子设备，显示单元以及冷却装置的制造方法
公开(公告)号：US06785135B2
公开(公告)日：2004-08-31
申请号：US10608153
申请日：2003-06-30
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： H05K720
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
摘要翻译：冷却装置包括由聚酰亚胺树脂制成的流路基板，中间基板和盖基板，以及并入由中间基板和蒸发器基板的孔的冷凝器基板，所述中空基板和蒸发器基板由具有高导热性，由此能够将来自热源的热量封入蒸发器基板和冷凝器基板，从而可以显着提高潜热量。

126. 发明申请

US20040085733A1 Heat pipe cooled electronics enclosure 失效
标题翻译：热管冷却电子外壳
公开(公告)号：US20040085733A1
公开(公告)日：2004-05-06
申请号：US10695712
申请日：2003-10-29
申请人： Charles Industries, Ltd.
发明人： Eduardo Leon , Walter Harwood , William Bond , Frank Hernandez , Avinash K. Vaidya
IPC分类号： H05K007/20
CPC分类号： H05K7/20336
摘要： An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.
摘要翻译：提供电子元件的外壳。外壳包括电子器件外壳，其具有用于接收一个或多个电子部件的至少一个插槽。槽由多个壁限定。热管热管理系统与槽相关联。热管系统包括热管，其具有嵌入到限定槽的一个壁中的第一部分，用于将热量从壁延伸到延伸出电子器件壳体的热管的第二部分。至少一个冷却翅片由热管的第二部分承载，使得来自热管的热量被传导到翅片中，散热片将热量散发到电子设备壳体外的环境大气。

127. 发明授权

US06597573B2 Vacuum feedthrough heatpipe assembly 失效
公开(公告)号：US06597573B2
公开(公告)日：2003-07-22
申请号：US10067590
申请日：2002-02-04
申请人： Mark A. Gummin
发明人： Mark A. Gummin
IPC分类号： H05K720
CPC分类号： H05K7/20336
摘要： A vacuum feedthrough heatpipe assembly includes a heatpipe having an inner end coupled to a heat generating device within a vacuum chamber, and an outer end disposed externally of the vacuum chamber. A vacuum flange seals the heatpipe to an opening in the chamber wall. The invention also includes an articulated arm assembly, each arm being a sealed heat pipe, the arms joined by angularly adjustable elbow joints. The heatpipe may comprise an electrically insulating construction formed of quartz or ceramic tube.

128. 发明授权

US06418017B1 Heat dissipating chassis member 有权
标题翻译：散热底盘部件
公开(公告)号：US06418017B1
公开(公告)日：2002-07-09
申请号：US09539724
申请日：2000-03-30
申请人： Chandrakant D. Patel , Marvin S. Keshner
发明人： Chandrakant D. Patel , Marvin S. Keshner
IPC分类号： H05K720
CPC分类号： H05K7/20336 , G06F1/203 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a chassis member, which may be made of a cast material such as magnesium, aluminum, or plastic, for mechanically supporting a heat producing electronic device in which the chassis member has a base and a cavity integral to the chassis member. In a preferred embodiment, the cavity is in the form of a channel that is created by boring. The channel may be evacuated and has an evaporator section, a condenser section, and a working fluid confined therein by a seal. The channel receives heat from an electronic device in an evaporator section of the channel and dissipates heat from the condenser section of the channel. Different types of wicks may be employed. In one embodiment, a completely fabricated heat pipe is inserted into the integrated channel. In other embodiments, a cavity in the form of a heat dissipating channel matrix, serpentine shape, flat shape, or in other forms or shapes are provided.
摘要翻译：本发明提供了一种底盘构件，其可以由诸如镁，铝或塑料的铸造材料制成，用于机械地支撑其中底盘构件具有底座和与底座构件成一体的空腔的发热电子装置。在优选实施例中，空腔是通过钻孔产生的通道的形式。通道可以被抽真空并且具有通过密封限制在其中的蒸发器部分，冷凝器部分和工作流体。通道从通道的蒸发器部分中的电子设备接收热量，并且从通道的冷凝器部分散发热量。可以使用不同类型的灯芯。在一个实施例中，将完全制造的热管插入集成通道中。在其它实施例中，提供了散热通道矩阵，蛇形形状，扁平形状或其它形式或形状形式的空腔。

129. 发明授权

US06408935B1 Heat sink assembly with over-molded cooling fins 失效
标题翻译：带散热片散热片组件
公开(公告)号：US06408935B1
公开(公告)日：2002-06-25
申请号：US09639165
申请日：2000-08-16
申请人： Robert E. DeHoff , Jason Allen Brehm , Kevin A. Grubb
发明人： Robert E. DeHoff , Jason Allen Brehm , Kevin A. Grubb
IPC分类号： H05K720
CPC分类号： H05K7/20336 , H01L23/3737 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly having a base formed through an injection molding process utilizing high conductivity plastic in which both the heat pipe and the cooling fins are over-molded into the base to form an integral assembly. The heat pipe is of known construction that operates to transfer heat from a source to a remote location for dissipation. The cooling fins are preferably of the folded fin array configuration and are embedded into the top surface of the heat sink base. A cooling fan can be mounted to the assembly to draw air across the folded fin array for dissipation of the heat conducted efficiently from the heat pipe into the heat sink, including the folded fin array. The thermal resistance of the heat sink is improved as the interface resistance and the spreading resistance between the heat pipe and the cooling fins are substantially reduced.
摘要翻译：一种散热器组件，其具有通过使用高导电性塑料的注射成型工艺形成的基座，其中热管和冷却翅片都被模制到基座中以形成整体组件。热管是已知的结构，其操作以将热量从源传输到远程位置用于耗散。散热片优选为折叠翅片阵列构造，并且嵌入散热器基座的顶表面中。冷却风扇可以安装到组件上，以将空气吸引到折叠的翅片阵列上，以便有效地从热管传导到散热器（包括折叠翅片阵列）中散热。随着热管和散热片之间的界面电阻和扩散阻力大大降低，散热器的热阻得到改善。

130. 发明授权

US5985111A Water evaporation type cooling apparatus by means of electrolytic reaction 失效
标题翻译：水蒸发式冷却装置采用电解反应
公开(公告)号：US5985111A
公开(公告)日：1999-11-16
申请号：US952984
申请日：1997-11-25
申请人： Tetsuo Moriguchi
发明人： Tetsuo Moriguchi
IPC分类号： F25B15/14 , F25B41/02 , H05K7/20 , C25B9/00
CPC分类号： H05K7/20336 , F25B15/14 , F25B41/02 , Y02B30/62
摘要： It is an object of the present invention to provide a water-evaporation type cooling apparatus which uses a solid-state electrolytic element, is free from an environmental protection problem, is soundless, and has a small size. An solid-state electrolytic element 50 is arranged to partition an airtight can 51 into spaces 51a, 51b, water 53 is reserved in the space 51a, and a condenser 55 is arranged to communicate with the space 51b. A water-reservation portion of the space 51a communicates with a water-reservation portion of the condenser 55 through a water path 57, and gas-phase portions of the spaces 51a, 51b communicate with each other through a ventilation path 58. A power is supplied from a DC power supply 52 to the solid-state electrolytic element 50 to make water decomposition reaction on an anode side and water generation reaction on a cathode side. A thermal connection surface 59 of a bottom portion of the space 51a is shaped into an outer surface shape along the outer surface shape of a target object 54.
摘要翻译： PCT No.PCT / JP96 / 02952 Sec。 371日期：1997年11月25日 102（e）日期1997年11月25日PCT 1996年10月11日PCT公布。出版物WO97 / 39294 日期：1997年10月23日本发明的目的是提供一种使用固态电解元件的水蒸发式冷却装置，没有环境保护问题，无声，尺寸小。固体电解元件50被布置成将气密罐51分隔成空间51a，51b，水53被保留在空间51a中，并且冷凝器55布置成与空间51b连通。空间51a的保水部通过水路57与冷凝器55的保水部连通，空间51a，51b的气相部通过通气路58相互连通。电力为从直流电源52供给到固体电解元件50，以在阳极侧进行水分解反应，并在阴极侧产生水分生成反应。空间51a的底部的热连接表面59沿着目标物体54的外表面形状成形为外表面形状。

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