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1. 发明申请

US20040085733A1 Heat pipe cooled electronics enclosure 失效
标题翻译：热管冷却电子外壳
公开(公告)号：US20040085733A1
公开(公告)日：2004-05-06
申请号：US10695712
申请日：2003-10-29
申请人： Charles Industries, Ltd.
发明人： Eduardo Leon , Walter Harwood , William Bond , Frank Hernandez , Avinash K. Vaidya
IPC分类号： H05K007/20
CPC分类号： H05K7/20336
摘要： An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.
摘要翻译：提供电子元件的外壳。外壳包括电子器件外壳，其具有用于接收一个或多个电子部件的至少一个插槽。槽由多个壁限定。热管热管理系统与槽相关联。热管系统包括热管，其具有嵌入到限定槽的一个壁中的第一部分，用于将热量从壁延伸到延伸出电子器件壳体的热管的第二部分。至少一个冷却翅片由热管的第二部分承载，使得来自热管的热量被传导到翅片中，散热片将热量散发到电子设备壳体外的环境大气。

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