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    • 125. 发明授权
    • Semiconductor device with extension structure and method for fabricating the same
    • 具有延伸结构的半导体器件及其制造方法
    • US07781848B2
    • 2010-08-24
    • US11704924
    • 2007-02-12
    • Takayuki ItoKyoichi SuguroKouji Matsuo
    • Takayuki ItoKyoichi SuguroKouji Matsuo
    • H01L29/78
    • H01L21/823857H01L21/823814H01L21/823842
    • A semiconductor device includes a semiconductor region, a source region, a drain region, a source extension region a drain extension region, a first gate insulation film, a second gate insulation film, and a gate electrode. The source region, drain region, source extension region and drain extension region are formed in a surface portion of the semiconductor region. The first gate insulation film is formed on the semiconductor region between the source extension region and the drain extension region. The first gate insulation film is formed of a silicon oxide film or a silicon oxynitride film having a nitrogen concentration of 15 atomic % or less. The second gate insulation film is formed on the first gate insulation film and contains nitrogen at a concentration of between 20 atomic % and 57 atomic %. The gate electrode is formed on the second gate insulation film.
    • 半导体器件包括半导体区域,源极区域,漏极区域,源极延伸区域,漏极延伸区域,第一栅极绝缘膜,第二栅极绝缘膜和栅极电极。 源极区域,漏极区域,源极延伸区域和漏极延伸区域形成在半导体区域的表面部分中。 第一栅极绝缘膜形成在源极延伸区域和漏极延伸区域之间的半导体区域上。 第一栅极绝缘膜由氮浓度为15原子%以下的氧化硅膜或氮氧化硅膜形成。 第二栅极绝缘膜形成在第一栅极绝缘膜上,并且含有浓度为20原子%至57原子%之间的氮。 栅电极形成在第二栅绝缘膜上。
    • 126. 发明申请
    • SEMICONDUCTOR DEVICE WITH EXTENSION STRUCTURE AND METHOD FOR FABRICATING THE SAME
    • 具有延伸结构的半导体器件及其制造方法
    • US20100193874A1
    • 2010-08-05
    • US12757658
    • 2010-04-09
    • Takayuki ItoKyoichi SuguroKouji Matsuo
    • Takayuki ItoKyoichi SuguroKouji Matsuo
    • H01L27/092
    • H01L21/823857H01L21/823814H01L21/823842
    • A semiconductor device includes a semiconductor region, a source region, a drain region, a source extension region a drain extension region, a first gate insulation film, a second gate insulation film, and a gate electrode. The source region, drain region, source extension region and drain extension region are formed in a surface portion of the semiconductor region. The first gate insulation film is formed on the semiconductor region between the source extension region and the drain extension region. The first gate insulation film is formed of a silicon oxide film or a silicon oxynitride film having a nitrogen concentration of 15 atomic % or less. The second gate insulation film is formed on the first gate insulation film and contains nitrogen at a concentration of between 20 atomic % and 57 atomic %. The gate electrode is formed on the second gate insulation film.
    • 半导体器件包括半导体区域,源极区域,漏极区域,源极延伸区域,漏极延伸区域,第一栅极绝缘膜,第二栅极绝缘膜和栅极电极。 源极区域,漏极区域,源极延伸区域和漏极延伸区域形成在半导体区域的表面部分中。 第一栅极绝缘膜形成在源极延伸区域和漏极延伸区域之间的半导体区域上。 第一栅极绝缘膜由氮浓度为15原子%以下的氧化硅膜或氮氧化硅膜形成。 第二栅极绝缘膜形成在第一栅极绝缘膜上,并且含有浓度为20原子%至57原子%之间的氮。 栅电极形成在第二栅绝缘膜上。