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111. 发明申请

US20090173721A1 METHOD AND APPARATUS FOR WELDING ELECTRODE COLLECTORS AND TERMINALS OF ELECTRICAL STORAGE ELEMENT 审中-公开
标题翻译：焊接电极收集器和电气存储元件端子的方法和装置
公开(公告)号：US20090173721A1
公开(公告)日：2009-07-09
申请号：US12162907
申请日：2007-03-01
申请人： Kouji Ueoka , Teruhisa Miura
发明人： Kouji Ueoka , Teruhisa Miura
IPC分类号： B23K26/20 , B23P17/04
CPC分类号： G01N29/2418 , B23K26/03 , B23K26/282 , B23K2101/04 , B23K2101/38 , G01N29/11 , G01N29/14 , G01N2291/267 , H01G2/06 , H01G9/016 , H01G11/28 , H01G11/66 , H01G11/74 , H01G11/82 , H01G11/84 , H01G13/006 , H01M2/26 , H01M2/263 , Y02E60/13 , Y10T29/49002
摘要： In a welding method, at least one of a set of a first electrode collector and a first terminal and a set of second electrode collector and a second terminal is welded one another. At this time, a laser beam is irradiated to a portion to be welded, elastic waves generated due to the laser beam from the portion to be welded are detected, and the detected elastic waves are integrated to calculate an index corresponding to an amount of connection energy in order to check a welded state.
摘要翻译：在焊接方法中，将一组第一电极集电体和第一端子以及一组第二电极集电体和第二端子中的至少一个彼此焊接。此时，激光束被照射到待焊接的部分，检测由于待焊接部分的激光束产生的弹性波，并且检测到的弹性波被积分，以计算与连接量相对应的指数能量来检查焊接状态。

112. 发明授权

US07494272B2 Dynamic surface annealing using addressable laser array with pyrometry feedback 有权
标题翻译：使用具有高温测量反馈的可寻址激光器阵列进行动态表面退火
公开(公告)号：US07494272B2
公开(公告)日：2009-02-24
申请号：US11469684
申请日：2006-09-01
申请人： Timothy N. Thomas , Dean Jennings , Bruce E. Adams , Abhilash J. Mayur
发明人： Timothy N. Thomas , Dean Jennings , Bruce E. Adams , Abhilash J. Mayur
IPC分类号： G01N3/28 , G01J5/08 , H01L21/477
CPC分类号： F27B17/0025 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0665 , B23K26/0738 , H01L21/67115
摘要： Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor. The apparatus further includes a controller responsive to the pyrometry sensor and coupled to adjust individual optical outputs of respective columns of the laser array in accordance with outputs of corresponding portions of the pyrometry sensor.
摘要翻译：用于半导体晶片的动态表面退火的装置包括以激光波长发射的激光辐射源，并且包括排列成行和列的激光阵列，每个激光器的光功率是单独调节的，并且用于将来自激光器阵列在对应于工件表面的工件平面中变成窄线束，由此光学器件将激光阵列的相应列映射到窄线束的相应部分上。提供对高温计波长敏感的高温计传感器。调整光学器件的光路中的光学元件以将从工件平面发出的辐射转移到高温测量传感器。结果，光学器件将窄线束的各个部分的每一个图像映射到高温计传感器的相应部分上。该装置还包括响应于高温测量传感器并耦合以根据高温测量传感器的对应部分的输出调节激光器阵列的各列的各个光学输出的控制器。

113. 发明申请

US20090007933A1 Methods for stripping and modifying surfaces with laser-induced ablation 有权
标题翻译：用激光诱导消融剥离和修饰表面的方法
公开(公告)号：US20090007933A1
公开(公告)日：2009-01-08
申请号：US12077876
申请日：2008-03-21
申请人： James W. Thomas , Robert L. Cargill , Mitchell R. Wool
发明人： James W. Thomas , Robert L. Cargill , Mitchell R. Wool
IPC分类号： B23K26/36
CPC分类号： B23K26/36 , B08B7/0042 , B23K26/03 , B23K26/032 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/142 , B23K26/354 , B23K26/361 , B23K26/362 , G01B11/30 , G01B11/303
摘要： A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.
摘要翻译：涂层去除装置从表面去除涂层。该装置具有可移动扫描头和扫描光学器件。扫描头可以在一个维度上移动，并且扫描光学元件在两个维度上进行调整，以补偿扫描头的移动，以实现具有均匀扫描图案的长距离扫描。此外，通过以各种角度测量镜面反射和散射反射来确定表面粗糙度。对于复合表面，该设备利用紫外激光辐射和可控气氛来去除涂层并改变表面的化学特性。

114. 发明申请

US20090004368A1 Systems and methods for curing a deposited layer on a substrate 审中-公开
标题翻译：用于固化衬底上的沉积层的系统和方法
公开(公告)号：US20090004368A1
公开(公告)日：2009-01-01
申请号：US11771722
申请日：2007-06-29
申请人： Edwin Hirahara , David L. Lee
发明人： Edwin Hirahara , David L. Lee
IPC分类号： B28B19/00 , B29C65/00
CPC分类号： B23K26/0622 , B05D3/06 , B23K26/03 , B23K26/082 , B23K2101/40 , H01L51/0027 , H05K1/095 , H05K3/0008 , H05K3/1283 , H05K3/22 , H05K2203/107
摘要： Curing systems are provided that include a planar support surface for supporting a substrate having at least one layer deposited thereon, at least one curing device for curing the at least one deposited layer, and a control system for controlling the overall curing process. The curing device includes at least one laser, a lens module, and an optional modulator. During curing, the beam of light emitted from the laser may be directed onto the deposited layer by 1) controlling the position of an X-Y beam deflecting module to direct the focused beam of laser light onto a desired illumination area of the deposited layer; 2) controlling the position of the laser via an X-Y table, or 3) controlling the position of the substrate via an X-Y table.
摘要翻译：提供固化系统，其包括用于支撑其上沉积有至少一层的基材的平面支撑表面，用于固化至少一个沉积层的至少一个固化装置，以及用于控制整个固化过程的控制系统。固化装置包括至少一个激光器，透镜模块和可选的调制器。在固化期间，从激光器发射的光束可以通过以下步骤被引导到沉积层上：1）控制X-Y光束偏转模块的位置，以将聚焦的激光束引导到沉积层的期望的照明区域上; 2）通过X-Y工作台控制激光器的位置，或3）通过X-Y工作台控制衬底的位置。

115. 发明授权

US07471384B2 Via hole depth detector 有权
标题翻译：通孔深度检测器
公开(公告)号：US07471384B2
公开(公告)日：2008-12-30
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.
摘要翻译：一种通孔深度检测器，用于检测形成在保持在卡盘台上的工件中的通孔的深度，包括：第一表面位置检测装置，包括第一检测激光束振荡装置，用于振荡具有预定基于第一检测激光束的反射光检测被照射部分的高度位置; 第二表面位置检测装置，其包括用于振荡具有与第一检测激光束的波长不同的波长的第二检测激光束的第二检测激光束振荡装置，并且基于该第二检测激光束振荡装置检测工件的被照射部分的高度位置第二检测激光束的反射光; 以及控制装置，用于基于由第一表面位置检测装置获得的检测值和由第二表面位置检测装置获得的检测值来获得形成在工件中的通孔的深度。

116. 发明申请

US20080308534A1 PYROMETER FOR LASER ANNEALING SYSTEM COMPATIBLE WITH AMORPHOUS CARBON OPTICAL ABSORBER LAYER 有权
标题翻译：激光退火系统与不对称碳光吸收层兼容的紫外光
公开(公告)号：US20080308534A1
公开(公告)日：2008-12-18
申请号：US11764738
申请日：2007-06-18
申请人： Jiping Li , Bruce E. Adams , Timothy N. Thomas , Aaron Muir Hunter , Abhilash J. Mayur , Rajesh S. Ramanujam
发明人： Jiping Li , Bruce E. Adams , Timothy N. Thomas , Aaron Muir Hunter , Abhilash J. Mayur , Rajesh S. Ramanujam
IPC分类号： B23K26/08 , H01L21/66
CPC分类号： B23K26/0665 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/18 , B23K2101/40
摘要： In a laser annealing system for workpieces such as semiconductor wafers, a pyrometer wavelength response band is established within a narrow window lying between the laser emission band and a fluorescence emission band from the optical components of the laser system, the pyrometer response band lying in a wavelength region at which the optical absorber layer on the workpiece has an optical absorption coefficient as great as or greater than the underlying workpiece. A multi-layer razor-edge interference filter having a 5-8 nm wavelength cut-off edge transition provides the cut-off of the laser emission at the bottom end of the pyrometer response band.
摘要翻译：在用于诸如半导体晶片的工件的激光退火系统中，在位于激光发射带和来自激光系统的光学部件的荧光发射带之间的狭窄窗口内建立高温计波长响应带，高温计响应带位于工件上的光吸收层的光吸收系数大于或大于下面工件的波长区域。具有5-8nm波长截止边缘跃迁的多层剃刀边缘干涉滤光器提供在高温计响应带的底端处的激光发射的截止。

117. 发明申请

US20080296270A1 REAL-TIME IMPLEMENTATION OF GENERALIZED PREDICTIVE ALGORITHM FOR DIRECT METAL DEPOSITION (DMD) PROCESS CONTROL 有权
标题翻译：用于直接金属沉积（DMD）过程控制的广义预测算法的实时实现
公开(公告)号：US20080296270A1
公开(公告)日：2008-12-04
申请号：US12130351
申请日：2008-05-30
申请人： Lijun Song , Jyoti Mazumder
发明人： Lijun Song , Jyoti Mazumder
IPC分类号： B23K26/00
CPC分类号： B23K26/1411 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0344 , B23K26/123 , B23K26/144
摘要： A direct metal deposition (DMD) process is stabilized by monitoring the temperature and the shape of the melt pool during deposition, applying a recursive least square (RLS) model estimation algorithm to adaptively identify process characteristics in accordance with the temperature and the shape of the melt pool, and delivering the process characteristics to a generalized predictive controller with input constraints to control the process. The process may be controlled by adjusting laser power or by adjusting the speed of the movement of the laser. In the preferred embodiment the temperature is monitored using a two-color pyrometer, and the shape of the melt pool is monitored by detecting the edge of the melt pool with a camera and/or photodetector.
摘要翻译：通过在沉积期间监测熔池的温度和形状来稳定直接金属沉积（DMD）工艺，应用递归最小二乘（RLS）模型估计算法，以根据温度和形状来自适应地识别工艺特性熔池，并将过程特性提供给具有输入约束的广义预测控制器以控制过程。该过程可以通过调整激光功率或通过调节激光器的移动速度来控制。在优选实施例中，使用双色高温计监测温度，并且通过用照相机和/或光电检测器检测熔池的边缘来监测熔池的形状。

118. 发明申请

US20080223836A1 METHOD AND SYSTEM FOR LASER PROCESSING 审中-公开
标题翻译：用于激光加工的方法和系统
公开(公告)号：US20080223836A1
公开(公告)日：2008-09-18
申请号：US11684697
申请日：2007-03-12
申请人： William A. Miller
发明人： William A. Miller
IPC分类号： B23K26/02
CPC分类号： B23K26/032 , B23K26/03 , B23K26/042 , B23K26/351 , H05K3/0026
摘要： A laser processing system has a platform to support a work piece to be processed, a laser to operate on the work piece, a laser control system to control operation of the laser, and a system control to provide instructions to the laser control system based upon at least the work piece to be processed. A method of manufacture includes identifying at least a portion of a structure to be laser processed, creating a set of instructions to direct a laser to process the portion of the structure, operating the laser in accordance with the set of instructions to laser process the portion of the structure, measuring at least one of an electrical characteristic or a mechanical characteristic to obtain an actual electrical characteristic value, comparing the actual value to a target value to determine if further processing is needed, if further processing is needed, automatically adjusting operation of the laser to reprocess the portion of the structure, and repeating the measuring, comparing and adjusting until the actual value matches the target value within a given tolerance.
摘要翻译：激光处理系统具有支撑要处理的工件的平台，用于在工件上操作的激光器，用于控制激光器的操作的激光控制系统以及基于以下操作的系统控制以向激光控制系统提供指令至少要加工的工件。一种制造方法包括识别要被激光处理的结构的至少一部分，创建一组指令以指导激光器处理结构的该部分，根据该组指令来操作激光器以激光处理该部分测量电特性或机械特性中的至少一个以获得实际电特性值，将实际值与目标值进行比较以确定是否需要进一步处理，如果需要进一步处理，则自动调整操作激光器重新处理结构的部分，并重复测量，比较和调整，直到实际值与给定公差内的目标值匹配。

119. 发明申请

US20080223832A1 REAL TIME IMPLEMENTATION OF GENERALIZED PREDICTIVE CONTROL ALGORITHM FOR THE CONTROL OF DIRECT METAL DEPOSITION (DMD) PROCESS 审中-公开
标题翻译：用于控制直接金属沉积（DMD）工艺的通用预测控制算法的实时实现
公开(公告)号：US20080223832A1
公开(公告)日：2008-09-18
申请号：US11941664
申请日：2007-11-16
申请人： Lijun Song , Jyoti Mazumder
发明人： Lijun Song , Jyoti Mazumder
IPC分类号： B23K26/34 , G01J5/00
CPC分类号： B23K26/34 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0344 , B23K26/123 , B23K26/32 , B23K35/0244 , B23K2103/50 , G01J5/004 , G01J5/0044 , G01J5/02 , G01J5/025 , G01J5/60
摘要： A linear model based generalized predictive control system controls the molten pool temperature during a Direct Metal Deposition (DMD) process. The molten pool temperature is monitored by a two-color pyrometer. A single-input single-output linear system that describes the dynamics between the molten pool temperature and the laser power is identified and validated. The incremental generalized predictive control algorithm with Kalman filter estimation is used to control the molten pool temperature.
摘要翻译：基于线性模型的广义预测控制系统控制直接金属沉积（DMD）过程中的熔池温度。熔池温度由双色高温计监测。描述熔池温度和激光功率之间的动态特性的单输入单输出线性系统被识别和验证。使用卡尔曼滤波估计的增量广义预测控制算法来控制熔池温度。

120. 发明申请

US20080200012A1 Wafer processing method and laser processing apparatus 有权
标题翻译：晶圆加工方法和激光加工装置
公开(公告)号：US20080200012A1
公开(公告)日：2008-08-21
申请号：US12068459
申请日：2008-02-06
申请人： Ryugo Oba
发明人： Ryugo Oba
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , B23K26/03 , B23K26/032 , B23K26/40 , B23K2103/50 , H01L21/78 , H01L22/12
摘要： In a wafer processing method for penetrating a wafer by use of a laser processing apparatus including a chuck table for holding the wafer, laser beam irradiation means for irradiating the wafer held on the chuck table with a laser beam, and imaging means for imaging the wafer held on the chuck table, the chuck table includes a chuck table main body, a holding member disposed on an upper surface of the chuck table main body and having a holding surface for holding an entire surface of the wafer, the holding member comprising a transparent or translucent member, and a light emitting body disposed laterally of a side of the holding member opposite to the holding surface. The wafer processing method comprises irradiating a predetermined processing region of the wafer held on the chuck table with the laser beam to perform the penetration in a predetermined manner, then lighting the light emitting body, with the wafer being held on the chuck table, imaging the processing region by the imaging means, and determining acceptance or rejection of the penetration based on whether or not light has passed through the processing region.
摘要翻译：在通过使用包括用于保持晶片的卡盘台的激光加工装置贯穿晶片的晶片处理方法中，用激光束照射保持在卡盘台上的晶片的激光束照射装置，以及用于对晶片进行成像的成像装置卡盘台包括卡盘台主体，设置在卡盘台主体的上表面上并具有用于保持晶片整个表面的保持表面的保持件，保持件包括透明的或半透明构件，以及发光体，其布置在与保持表面相对的保持构件的侧面的侧面。晶片处理方法包括用激光束照射保持在卡盘台上的晶片的预定处理区域，以预定方式进行穿透，然后点亮发光体，晶片保持在卡盘台上，对通过成像装置处理区域，并且基于光是否通过处理区域来确定穿透的接受或拒绝。

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