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1. 发明申请

US20080055588A1 Via hole depth detector 有权
公开(公告)号：US20080055588A1
公开(公告)日：2008-03-06
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

2. 发明授权

US07471384B2 Via hole depth detector 有权
标题翻译：通孔深度检测器
公开(公告)号：US07471384B2
公开(公告)日：2008-12-30
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.
摘要翻译：一种通孔深度检测器，用于检测形成在保持在卡盘台上的工件中的通孔的深度，包括：第一表面位置检测装置，包括第一检测激光束振荡装置，用于振荡具有预定基于第一检测激光束的反射光检测被照射部分的高度位置; 第二表面位置检测装置，其包括用于振荡具有与第一检测激光束的波长不同的波长的第二检测激光束的第二检测激光束振荡装置，并且基于该第二检测激光束振荡装置检测工件的被照射部分的高度位置第二检测激光束的反射光; 以及控制装置，用于基于由第一表面位置检测装置获得的检测值和由第二表面位置检测装置获得的检测值来获得形成在工件中的通孔的深度。

3. 发明申请

US20080037596A1 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US20080037596A1
公开(公告)日：2008-02-14
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , A61N5/01
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

4. 发明授权

US08487208B2 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US08487208B2
公开(公告)日：2013-07-16
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： B23K26/00
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

5. 发明申请

US20080205458A1 LASER BEAM IRRADIATION APPARATUS AND LASER BEAM MACHINING APPARATUS 审中-公开
标题翻译：激光束辐射装置和激光束加工装置
公开(公告)号：US20080205458A1
公开(公告)日：2008-08-28
申请号：US12028395
申请日：2008-02-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru
IPC分类号： H01S3/10
CPC分类号： H01L21/67092 , B23K26/0622 , B23K26/082 , B23K26/0853
摘要： A laser beam irradiation apparatus including: a laser beam oscillation unit having a pulsed laser beam oscillator for oscillating a pulsed laser beam, and a repetition frequency setter; an acousto-optical deflector by which the pulsed laser beam oscillated by the laser beam oscillation unit is deflected and the output is adjusted; and a controller for controlling the acousto-optical deflector. The controller outputs to the acousto-optical deflector a driving pulse signal having a predetermined time width including the pulse width of the pulsed laser beam oscillated by the pulsed laser beam oscillator, based on a repetition frequency setting signal from the repetition frequency setter, and outputs a correction pulse signal to the acousto-optical deflector between the driving pulses.
摘要翻译：一种激光束照射装置，包括：激光束振荡单元，具有用于振荡脉冲激光束的脉冲激光束振荡器和重复频率设定器; 通过激光束振荡单元振荡的脉冲激光束偏转并输出输出的声光偏转器; 以及用于控制声光偏转器的控制器。控制器基于来自重复频率设定器的重复频率设置信号向声光偏转器输出包括由脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号，并且输出对驱动脉冲之间的声光偏转器的校正脉冲信号。

6. 发明申请

US20080011722A1 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US20080011722A1
公开(公告)日：2008-01-17
申请号：US11822972
申请日：2007-07-11
申请人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
IPC分类号： B23K26/08 , B23K26/02 , B23K26/067
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/705 , B23K2101/40
摘要： Disclosed a laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.
摘要翻译：公开了一种能够识别在脉冲激光束照射过程中脉冲激光束照射失败并采取适当措施的激光加工装置。第一判断部分和第二判断部分分别监视在从脉冲信号输出部分输出脉冲信号的时刻脉冲激光束是否被激光振荡器的振荡实际照射，以及脉冲信号输出部分是否输出脉冲信号作为在基于预设脉冲数输出脉冲信号的定时的激光振荡器的设置。当在处理期间发生脉冲激光束照射失败时，识别故障的发生，并且可以识别是否由激光束照射单元或包括脉冲信号输出部的控制器引起故障。

7. 发明授权

US07732729B2 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US07732729B2
公开(公告)日：2010-06-08
申请号：US11822972
申请日：2007-07-11
申请人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
IPC分类号： B23K26/36
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/705 , B23K2101/40
摘要： A laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.
摘要翻译：一种激光处理装置，其能够识别在脉冲激光束照射过程中脉冲激光束照射的故障并采取适当的措施。第一判断部分和第二判断部分分别监视在从脉冲信号输出部分输出脉冲信号的时刻脉冲激光束是否被激光振荡器的振荡实际照射，以及脉冲信号输出部分是否输出脉冲信号作为在基于预设脉冲数输出脉冲信号的定时的激光振荡器的设置。当在处理期间发生脉冲激光束照射失败时，识别故障的发生，并且可以识别是否由激光束照射单元或包括脉冲信号输出部的控制器引起故障。

8. 发明授权

US07630421B2 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US07630421B2
公开(公告)日：2009-12-08
申请号：US11888487
申请日：2007-08-01
申请人： Yutaka Kobayashi , Kouichi Nehashi
发明人： Yutaka Kobayashi , Kouichi Nehashi
IPC分类号： H01S3/13
CPC分类号： B23K26/0665 , B23K26/032 , B23K26/064 , B23K26/0648 , B23K26/0853 , B23K26/0884 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser beam irradiation apparatus includes an oscillation unit, an acousto-optic deflection unit for deflecting a laser beam oscillated by the oscillation unit, a condenser for condensing the deflected laser beam, and a control unit. The control unit determines an actual output power of the laser beam based on a light reception signal received from laser beam output detection means in response to a control signal for controlling a deflection angle adjustment unit of the deflection unit. Then, the control unit arithmetically operates the ratio of an actual output power corresponding to the control signal with reference to the lowest value of the actual output power. Further, the control unit arithmetically operates a correction value corresponding to the ratio of the actual output power to produce a control map and controls the output adjustment unit based on the control map.
摘要翻译：激光束照射装置包括振荡单元，用于偏转由振荡单元振荡的激光束的声光偏转单元，用于聚焦偏转的激光束的聚光器和控制单元。控制单元响应于用于控制偏转单元的偏转角调节单元的控制信号，基于从激光束输出检测装置接收的光接收信号来确定激光束的实际输出功率。然后，控制单元参照实际输出功率的最低值，算出与控制信号对应的实际输出功率的比值。此外，控制单元对与实际输出功率的比例对应的校正值进行运算，以产生控制图，并且基于控制图来控制输出调整单元。

9. 发明申请

US20080031291A1 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US20080031291A1
公开(公告)日：2008-02-07
申请号：US11888487
申请日：2007-08-01
申请人： Yutaka Kobayashi , Kouichi Nehashi
发明人： Yutaka Kobayashi , Kouichi Nehashi
IPC分类号： G02B26/08
CPC分类号： B23K26/0665 , B23K26/032 , B23K26/064 , B23K26/0648 , B23K26/0853 , B23K26/0884 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser beam irradiation apparatus includes an oscillation unit, an acousto-optic deflection unit for deflecting a laser beam oscillated by the oscillation unit, a condenser for condensing the deflected laser beam, and a control unit. The control unit determines an actual output power of the laser beam based on a light reception signal received from laser beam output detection means in response to a control signal for controlling a deflection angle adjustment unit of the deflection unit. Then, the control unit arithmetically operates the ratio of an actual output power corresponding to the control signal with reference to the lowest value of the actual output power. Further, the control unit arithmetically operates a correction value corresponding to the ratio of the actual output power to produce a control map and controls the output adjustment unit based on the control map.
摘要翻译：激光束照射装置包括振荡单元，用于偏转由振荡单元振荡的激光束的声光偏转单元，用于聚焦偏转的激光束的聚光器和控制单元。控制单元响应于用于控制偏转单元的偏转角调节单元的控制信号，基于从激光束输出检测装置接收的光接收信号来确定激光束的实际输出功率。然后，控制单元参照实际输出功率的最低值，算出与控制信号对应的实际输出功率的比值。此外，控制单元对与实际输出功率的比例对应的校正值进行运算，以产生控制图，并且基于控制图来控制输出调整单元。

10. 发明申请

US20080128396A1 Laser beam machining system 审中-公开
标题翻译：激光束加工系统
公开(公告)号：US20080128396A1
公开(公告)日：2008-06-05
申请号：US11985353
申请日：2007-11-14
申请人： Koichi Shigematsu , Kouichi Nehashi
发明人： Koichi Shigematsu , Kouichi Nehashi
IPC分类号： B23K26/38
CPC分类号： B23K26/702
摘要： A laser beam machining system includes a chuck table for holding a work, a laser beam irradiation unit for irradiating the work held on the chuck table with a laser beam, a machining feeding unit for effecting relative machining feed of the chuck table and the laser beam irradiation unit, and a control unit for controlling the laser beam irradiation unit and the machining feeding unit according to control programs, wherein a safety unit is provided which interrupts a gate signal, which is outputted from the control unit to the laser beam irradiation unit, upon generation of an abnormal condition in execution of the control programs in the control unit.
摘要翻译：一种激光束加工系统，包括：用于保持工件的卡盘台;激光束照射单元，用于用激光束照射夹持台上的工件;加工进给单元，用于实现卡盘台和激光束的相对加工进给照射单元和用于根据控制程序控制激光束照射单元和加工进给单元的控制单元，其中提供了一个安全单元，其将从控制单元输出的门信号中断到激光束照射单元，在控制单元中执行控制程序时产生异常状态。

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