专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

111. 发明授权

US07492452B2 Defect inspection method and system 失效
标题翻译：缺陷检查方法和系统
公开(公告)号：US07492452B2
公开(公告)日：2009-02-17
申请号：US11626925
申请日：2007-01-25
申请人： Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
发明人： Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
IPC分类号： G01N21/00 , G01N21/88 , H01L27/00
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/4788 , G01N21/94 , G01N21/956
摘要： An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably.
摘要翻译：检查系统包括：使用具有不同波长的宽带照明光和单波长光的设备，在具有透明膜的表面上的多个照明中对被检查对象进行暗场照明多个照明角度的方向; 检测从重复图案反射或散射的光和从彼此分离的波长的非重复图案反射或散射的光的设备; 有效地检测异物反射或散射的光或重复图案或非重复图案中的缺陷或透明膜表面上的异物或缺陷的设备; 以及通过重复图案衍射的光从实际图案的衍射光图像或表示图案的设计数据中去除的设施。因此，能够稳定地检测出更微细的缺陷。

112. 发明授权

US07369223B2 Method of apparatus for detecting particles on a specimen 失效
标题翻译：用于检测样品上的颗粒的装置的方法
公开(公告)号：US07369223B2
公开(公告)日：2008-05-06
申请号：US11086442
申请日：2005-03-23
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
IPC分类号： G01N21/00
CPC分类号： G01N21/956
摘要： An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.
摘要翻译：用于检查图案以检测小图案缺陷的装置具有照明光源，作为具有多个照明部的照明光学系统，所述照明光学系统具有多个照明部分，用于将照明光束的光路从多个照明部分切换到构成被检查物体的板的表面方向不同的检测光学系统，使用用于聚焦来自照明板的反射衍射光的物镜具有可变放大倍数的检测光学系统，具有可变倍率的聚焦光学系统，其能够通过会聚的反射衍射光聚焦光学图像，具有期望的聚焦放大率和用于检测由聚焦光学系统聚焦的光学图像以将其转换成图像信号的光学检测器，用于将图像信号转换为数字图像信号的A / D转换器和用于处理数字图像信号的图像信号处理器图像信号来检测缺陷。

113. 发明申请

US20070206184A1 DEFECT INSPECTION METHOD AND SYSTEM 失效
标题翻译：缺陷检查方法和系统
公开(公告)号：US20070206184A1
公开(公告)日：2007-09-06
申请号：US11626925
申请日：2007-01-25
申请人： Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
发明人： Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/4788 , G01N21/94 , G01N21/956
摘要： An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably.
摘要翻译：检查系统包括：使用具有不同波长的宽带照明光和单波长光的设备，在具有透明膜的表面上的多个照明中对被检查对象进行暗场照明多个照明角度的方向; 检测从重复图案反射或散射的光和从彼此分离的波长的非重复图案反射或散射的光的设备; 有效地检测异物反射或散射的光或重复图案或非重复图案中的缺陷或透明膜表面上的异物或缺陷的设备; 以及通过重复图案衍射的光从实际图案的衍射光图像或表示图案的设计数据中去除的设施。因此，能够稳定地检测出更微细的缺陷。

114. 发明授权

US07248352B2 Method for inspecting defect and apparatus for inspecting defect 有权
标题翻译：检查缺陷的方法和缺陷检查装置
公开(公告)号：US07248352B2
公开(公告)日：2007-07-24
申请号：US10724750
申请日：2003-12-02
申请人： Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
发明人： Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
IPC分类号： G01N21/00
CPC分类号： G01N21/8806 , G01N21/94 , G01N21/9501 , G01N21/95623
摘要： The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.
摘要翻译：本发明是用于检查异物的缺陷的装置，包括照明光学系统，检测光学系统，屏蔽单元，其设置在所述检测光学系统中，以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案以及算术处理系统，其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶，或将屏蔽图案转印到光学透明基板或基板或蚀刻以留下屏蔽图案的薄膜，或通过加热，突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板，或圆柱形的屏蔽板或板形。

115. 发明申请

US20060124874A1 Defect detector and defect detecting method 有权
标题翻译：缺陷检测器和缺陷检测方法
公开(公告)号：US20060124874A1
公开(公告)日：2006-06-15
申请号：US10536715
申请日：2003-11-27
申请人： Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
发明人： Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
IPC分类号： G01N21/00 , G01N21/88
CPC分类号： G01N21/00 , G01N21/9501 , G06T7/0004 , G06T2207/30148
摘要： A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.
摘要翻译：一种缺陷检查装置，具有：在其上安装检查对象基板的同时沿预定方向行进的扫描台; 照明光学系统，用于以与其倾斜的预定角度将照明光束照射在检查对象基板的表面上; 检测光学系统，包括：用于接收从检查对象基板向上发射的上方反射/散射光的上方光检测器，从而将其转换为高定向图像信号;以及侧向光检测器，将检测对象基板发射的侧向反射/散射光倾斜到倾斜方向，以与照明光束平坦地相交，从而转换为侧向图像信号; 以及信号处理系统 - 用于基于上限图像信号和侧向图像信号来检测缺陷。

116. 发明授权

US07061602B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US07061602B2
公开(公告)日：2006-06-13
申请号：US11117336
申请日：2005-04-29
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method of inspecting a sample in which the sample is inspected under a plurality of inspection conditions and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：检查在多个检查条件下检查样品的样品的检查方法以及根据多个检查条件中的每一个检查样品而获得的检查数据以及与检查日期对应的检查日期的样品的位置信息的方法条件被存储。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

117. 发明申请

US20060091332A1 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
公开(公告)号：US20060091332A1
公开(公告)日：2006-05-04
申请号：US11302847
申请日：2005-12-13
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N21/86
CPC分类号： G01N21/4738 , G01N21/8806 , G01N21/93 , G01N21/94 , G01N21/9501 , G01N2015/1486 , G01N2015/1493
摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

118. 发明申请

US20050264798A1 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
标题翻译：用于检查半导体器件的颗粒或缺陷的方法及其装置
公开(公告)号：US20050264798A1
公开(公告)日：2005-12-01
申请号：US11190838
申请日：2005-07-28
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N21/27 , G01N21/47 , G01N21/88 , G01N21/94 , G01N21/95
CPC分类号： G01N21/274 , G01N21/47 , G01N21/4738 , G01N21/8806 , G01N21/94 , G01N21/95 , G01N21/956 , G01N2021/8854
摘要： An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
摘要翻译：用于光学检查颗粒和/或缺陷的装置将颗粒和/或缺陷的尺寸与检查结果中的故障原因相关联。数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

119. 发明申请

US20050196033A1 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US20050196033A1
公开(公告)日：2005-09-08
申请号：US11117336
申请日：2005-04-29
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/956 , G06T7/00 , H01L21/66 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method of inspecting a sample in which the sample is inspected under a plurality of inspection conditions and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：检查在多个检查条件下检查样品的样品的检查方法以及根据多个检查条件中的每一个检查样品而获得的检查数据以及与检查日期对应的检查日期的样品的位置信息的方法条件被存储。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

120. 发明授权

US06797975B2 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
标题翻译：用于检查半导体器件的颗粒或缺陷的方法及其装置
公开(公告)号：US06797975B2
公开(公告)日：2004-09-28
申请号：US09931997
申请日：2001-08-17
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N2188
CPC分类号： G01N21/4738 , G01N21/8806 , G01N21/93 , G01N21/94 , G01N21/9501 , G01N2015/1486 , G01N2015/1493
摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
摘要翻译：通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式