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    • 114. 发明申请
    • Memory access circuits and layout of the same for cross-point memory arrays
    • 存储器访问电路和布局相同的交叉点存储器阵列
    • US20100157647A1
    • 2010-06-24
    • US12653898
    • 2009-12-18
    • Darrell RinersonChristophe J. ChevallierChang Hua Siau
    • Darrell RinersonChristophe J. ChevallierChang Hua Siau
    • G11C5/02H01L27/00G11C8/10
    • G11C8/10G11C5/02G11C5/025H01L27/0688
    • An integrated circuit includes a substrate including active circuitry fabricated on the substrate and a cross-point memory array formed above the substrate. The cross-point memory array can include conductive array lines arranged in different directions, and re-writable memory cells. Further, the integrated circuit can also include a memory access circuit configured to perform data operations on the cross-point memory array. The integrated circuit can include a cross-point memory array interface layer positioned between the substrate and the cross-point array and including conductive paths configured to electrically couple portions of the memory access circuit with a subset of the conductive array lines. At least one layer of cross-point memory arrays can be formed over the substrate. The memory cells can be two-terminal memory cells that store data as a plurality of conductivity profiles (e.g., resistive states) that can be non-destructively determined by applying a read voltage across the terminals.
    • 集成电路包括:衬底,其包括在衬底上制造的有源电路和形成在衬底上方的交叉点存储器阵列。 交叉点存储器阵列可以包括布置在不同方向的导电阵列线以及可重写存储器单元。 此外,集成电路还可以包括被配置为在交叉点存储器阵列上执行数据操作的存储器访问电路。 集成电路可以包括位于衬底和交叉点阵列之间的交叉点存储器阵列接口层,并且包括被配置为将存储器访问电路的一部分与导电阵列线的子集电耦合的导电路径。 可以在衬底上形成至少一层交叉点存储器阵列。 存储器单元可以是将数据存储为可以通过跨终端施加读取电压而非破坏性地确定的多个电导率分布(例如电阻状态)的两端存储单元。