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    • 114. 发明授权
    • Static semiconductor memory device and fabricating method thereof
    • 静态半导体存储器件及其制造方法
    • US06288926B1
    • 2001-09-11
    • US09535871
    • 2000-03-27
    • Du-Eung KimByung-Gil ChoiSang-Jib HanChoong-Keun KwakSoon-Moon JungSung-Bong Kim
    • Du-Eung KimByung-Gil ChoiSang-Jib HanChoong-Keun KwakSoon-Moon JungSung-Bong Kim
    • G11C506
    • G11C5/063G11C11/412
    • A semiconductor memory device is disclosed. The device is comprised of a plurality of word lines; a plurality of bit lines arranged in perpendicular to the word lines. In addition, a plurality of supply voltage lines extend in the same direction as the bit lines. Also, a plurality of first ground voltage lines are arranged in the same direction as the bit lines. Further, a plurality of second ground voltage lines are arranged in the same direction as the word lines. A plurality of memory cells are each connected between one of the word lines and one of the bit lines. Here, the ground voltage lines are arranged in a matrix shape to reduce the resistance of the ground voltage line and secure the margin between the supply voltage level and the ground voltage level of the data latched by the memory cells to thereby prevent an operational failure of the device.
    • 公开了一种半导体存储器件。 该装置由多条字线组成; 垂直于字线布置的多个位线。 此外,多个电源电压线沿与位线相同的方向延伸。 此外,多个第一接地电压线被布置在与位线相同的方向上。 此外,多个第二接地电压线布置在与字线相同的方向上。 多个存储单元分别连接在一条字线和一条位线之间。 这里,接地电压线被布置成矩阵形状以减小接地电压线的电阻并且确保由存储器单元锁存的数据的电源电压电平和接地电压电平之间的裕度,从而防止 装置。
    • 117. 发明授权
    • Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储单元的方法
    • US08179711B2
    • 2012-05-15
    • US12273225
    • 2008-11-18
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • G11C11/00
    • G11C13/003G11C5/02G11C7/18G11C11/15G11C11/56G11C11/5678G11C13/0004G11C13/0023G11C13/0026G11C13/0064G11C13/0069G11C2013/0071G11C2213/71G11C2213/74G11C2213/79H01L27/24
    • In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
    • 在半导体存储器件和方法中,提供了电阻变化存储单元,每个包括形成在不同层上的多个控制晶体管和包括电阻变化存储器的可变电阻器件。 每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个电阻变化存储单元组。 每个电阻变化存储单元组中的每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个电阻变化存储单元的电流量。
    • 118. 发明授权
    • Nonvolatile memory device and method of driving the same
    • 非易失存储器件及其驱动方法
    • US08085575B2
    • 2011-12-27
    • US12585728
    • 2009-09-23
    • Byung-Gil ChoiDu-Eung KimHye-Jin Kim
    • Byung-Gil ChoiDu-Eung KimHye-Jin Kim
    • G11C11/00
    • G11C13/0023G11C7/02G11C7/12G11C7/18G11C13/00G11C13/0004G11C13/0026
    • A nonvolatile memory device and a method of driving the same are provided, which adopt an improved write operation. The method of driving a nonvolatile memory device includes providing the nonvolatile memory device including a plurality of memory banks each having a plurality of local bit lines and a plurality of variable resistance memory cells; selectively connecting read global bit lines for reading data with the local bit lines, and firstly discharging the selectively connected local bit lines by turning on local bit line discharge transistors coupled to the read global bit lines; and selectively connecting write global bit lines for writing data with the local bit lines, and secondly discharging the selectively connected local bit lines by turning on global bit line discharge transistors.
    • 提供一种非易失性存储器件及其驱动方法,其采用改进的写入操作。 驱动非易失性存储器件的方法包括提供包括多个存储体的非易失性存储器件,每个存储器组具有多个局部位线和多个可变电阻存储器单元; 选择性地连接读取全局位线用于与局部位线一起读取数据,并且首先通过连接耦合到读出的全局位线的局部位线放电晶体管来放电选择性连接的局部位线; 并选择性地连接用于将数据写入本地位线的写入全局位线,以及其次通过导通全局位线放电晶体管对选择连接的局部位线进行放电。