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101. 发明申请

US20070186424A1 Multi-layer coating for razor blades 审中-公开
标题翻译：刀片多层涂层
公开(公告)号：US20070186424A1
公开(公告)日：2007-08-16
申请号：US11704541
申请日：2007-02-09
申请人： Sandra Becker , Scott Camphausen , Randy Nicolosi , Jochen Thoene , Matthias Niggemann
发明人： Sandra Becker , Scott Camphausen , Randy Nicolosi , Jochen Thoene , Matthias Niggemann
IPC分类号： B26B29/00
CPC分类号： B26B21/60 , C23C14/021 , C23C14/022 , C23C14/024 , C23C14/027 , C23C14/028 , C23C14/0605 , C23C14/325 , C23C28/00 , C23C30/005
摘要： A razor blade is provided that includes a substrate with a cutting edge defined by a sharpened tip and an adjacent facet, a layer of titanium containing material on the cutting edge, a layer of hard carbon material on the titanium containing layer, and an outer layer of polytetrafluoroethylene.
摘要翻译：提供了一种剃刀刀片，其包括具有由尖锐尖端和相邻小面限定的切割边缘的基底，在所述切割边缘上的含钛材料层，所述含钛层上的硬碳材料层以及外层的聚四氟乙烯。

102. 发明授权

US07252745B2 Filtered cathodic arc deposition method and apparatus 有权
标题翻译：过滤阴极电弧沉积方法和装置
公开(公告)号：US07252745B2
公开(公告)日：2007-08-07
申请号：US10713529
申请日：2003-11-13
申请人： Vladimir I. Gorokhovsky
发明人： Vladimir I. Gorokhovsky
IPC分类号： C23C14/34
CPC分类号： C23C14/0605 , C23C14/022 , C23C14/0641 , C23C14/0647 , C23C14/16 , C23C14/325 , C23C14/355 , C23C14/48 , C23C16/36 , H01J37/32055 , H01J37/3266
摘要： An apparatus for the application of coatings in a vacuum comprising a plasma duct surrounded by a magnetic deflecting system communicating with a first plasma source and a coating chamber in which a substrate holder is arranged off of an optical axis of the plasma source, has at least one deflecting electrode mounted on one or more walls of the plasma duct. In one embodiment an isolated repelling or repelling electrode is positioned in the plasma duct downstream of the deflecting electrode where the tangential component of a deflecting magnetic field is strongest, connected to the positive pole of a current source which allows the isolated electrode current to be varied independently and increased above the level of the anode current. The deflecting electrode may serve as a getter pump to improve pumping efficiency and divert metal ions from the plasma flow. In a further embodiment a second arc source is activated to coat the substrates while a first arc source is activated, and the magnetic deflecting system for the first arc source is deactivated to confine plasma to the cathode chamber but permit electrons to flow into the coating chamber for plasma immersed treatment of the substrates. A load lock shutter may be provided between the plasma duct and the coating chamber further confine the plasma from the first arc source.
摘要翻译：一种用于在真空中施加涂层的装置，包括由与第一等离子体源连通的磁偏转系统所围绕的等离子体管道和其中衬底保持器布置在等离子体源的光轴之外的涂覆室，至少具有一个偏转电极安装在等离子体管道的一个或多个壁上。在一个实施例中，隔离的排斥或排斥电极位于偏转电极下游的等离子体管道中，其中偏转磁场的切向分量最强，连接到电流源的正极，其允许隔离电极电流变化独立地增加到高于阳极电流的水平。偏转电极可以用作吸气泵，以提高泵送效率并从金属离子流中转移金属离子。在另一实施例中，激活第二电弧源以在第一电弧源被激活时涂覆基板，并且用于第一电弧源的磁偏转系统被去激活以将等离子体限制到阴极室，但允许电子流入涂覆室用于等离子体浸渍处理的基板。可以在等离子体管道和涂覆室之间设置负载锁定闸门，进一步限制来自第一电弧源的等离子体。

103. 发明申请

US20070157668A1 Method for cleaning a substrate 有权
标题翻译：清洗基材的方法
公开(公告)号：US20070157668A1
公开(公告)日：2007-07-12
申请号：US10586967
申请日：2005-01-21
申请人： Nicolas Nadaud , Eric Mattman , Jean-Paul Rousseau , Marcus Loergen
发明人： Nicolas Nadaud , Eric Mattman , Jean-Paul Rousseau , Marcus Loergen
IPC分类号： C03C17/00 , B32B3/00 , B05D3/10
CPC分类号： C23C14/022 , C03C23/006 , C03C23/0075 , C03C2218/31 , C23C16/0245 , Y10T428/24612
摘要： Method for the continuous vacuum cleaning of a substrate, characterized in that: a species is chosen that has a low sputtering efficiency and is chemically active with regard to the soiling matter; using at least one linear ion source, a plasma is generated from a gas mixture comprising predominantly the species having a low sputtering efficiency, especially one based on oxygen; and at least one surface portion of said substrate is subjected to said plasma so that said ionized species at least partly eliminates, by chemical reaction, the soiling matter possibly adsorbed or located on said surface portion.
摘要翻译：用于基材的连续真空清洁的方法，其特征在于：选择具有低溅射效率并且在污染物质上具有化学活性的物质; 使用至少一个线性离子源，从主要是具有低溅射效率的物质，特别是基于氧的物质的气体混合物产生等离子体; 并且所述衬底的至少一个表面部分经受所述等离子体，使得所述离子化物质通过化学反应至少部分地消除可能吸附或位于所述表面部分上的污染物质。

104. 发明申请

US20070087034A1 DRUG DELIVERY SYSTEM AND METHOD OF MANUFACTURING THEREOF 有权
标题翻译：药物递送系统及其制造方法
公开(公告)号：US20070087034A1
公开(公告)日：2007-04-19
申请号：US11550069
申请日：2006-10-17
申请人： Stephen Blinn , Richard Svrluga
发明人： Stephen Blinn , Richard Svrluga
IPC分类号： A61F2/02
CPC分类号： A61L31/16 , A61F2/82 , A61F2250/0067 , A61L31/12 , A61L2300/406 , A61L2300/416 , A61L2300/42 , A61L2300/426 , A61L2300/61 , A61L2300/62 , A61L2400/18 , C23C14/022 , C23C14/221 , C23C14/505 , H01J2237/0812 , Y10T428/249988 , Y10T428/31504
摘要： In one embodiment, a drug delivery system and method provide a member including a combination of a drug substance and a polymer or other material, and an encapsulating layer formed in an outer surface of the member by gas cluster ion beam irradiation of the outer surface of the member, which encapsulating layer is adapted to determine one or more characteristics of the drug delivery system.
摘要翻译：在一个实施方案中，药物递送系统和方法提供包括药物物质和聚合物或其他材料的组合的构件，以及通过气体团离子束照射外壳的外表面形成在构件的外表面中的封装层该成员，该封装层适于确定药物递送系统的一个或多个特征。

105. 发明授权

US07182880B2 Process for reducing particle formation during etching 有权
标题翻译：在蚀刻期间减少颗粒形成的方法
公开(公告)号：US07182880B2
公开(公告)日：2007-02-27
申请号：US10813785
申请日：2004-03-30
申请人： Wen-Chi Chou , Kuang-Ya Li
发明人： Wen-Chi Chou , Kuang-Ya Li
IPC分类号： B44C1/22
CPC分类号： H01L21/67069 , B08B7/0035 , C23C14/022 , H01J37/32082 , H01J2237/022 , H01L21/67253
摘要： A process for reducing the formation of potential device-contaminating particles in a process chamber, particularly an etch chamber or a pre-clean chamber used to pre-clean substrates prior to a PVD or other process. The process chamber conventionally includes multiple antennae, the purpose of which is to conduct bias power from a bias power source to a substrate supported on a pedestal assembly. According to the process of the invention, the antennae are removed from the pedestal assembly. Accordingly, the antennae, no longer present in the chamber during substrate processing, are capable of neither generating potential device-contaminating particles nor causing electrical arcing between the pedestal assembly and the chamber wall or other elements in the process chamber, leading to operational power loss.
摘要翻译：一种用于减少处理室中的潜在器件污染颗粒形成的方法，特别是用于在PVD或其它工艺之前预清洁衬底的蚀刻室或预清洁室。处理室通常包括多个天线，其目的是将偏置功率从偏压电源传导到支撑在基座组件上的基板。根据本发明的方法，天线从基座组件移除。因此，在衬底处理期间不再存在于腔室中的天线能够既不会产生潜在的器件污染粒子，也不会在基座组件与腔室壁或处理室中的其它元件之间产生电弧，导致操作功率损耗。

106. 发明授权

US07160635B2 Protective Ti-Al-Cr-based nitrided coatings 失效
标题翻译：保护性Ti-Al-Cr基氮化涂层
公开(公告)号：US07160635B2
公开(公告)日：2007-01-09
申请号：US10984725
申请日：2004-11-09
申请人： Christoph Leyens , Papken Ehiasar Hovsepian , Wolf-Dieter Munz
发明人： Christoph Leyens , Papken Ehiasar Hovsepian , Wolf-Dieter Munz
IPC分类号： B32B15/04 , B32B18/00
CPC分类号： C23C30/00 , C23C14/022 , C23C14/0641 , C23C28/044 , C23C28/048 , Y02T50/67 , Y10T428/31678
摘要： This invention relates to coatings for the protection of substrates operating at moderately elevated temperatures, and, more particularly, for the protection of titanium-alloy aircraft and stationary gas turbine components as well as engine components for automotive applications, articles having such coatings and a method for their production.
摘要翻译：本发明涉及用于保护在适度升高的温度下操作的基材的涂层，更具体地说，涉及用于汽车应用的钛合金飞机和固定式燃气涡轮机部件以及发动机部件的保护，以及具有这种涂层的制品为他们的生产。

107. 发明申请

US20060280934A1 Flame-resistant coated polycarbonate mouldings 审中-公开
标题翻译：耐火涂层聚碳酸酯模制品
公开(公告)号：US20060280934A1
公开(公告)日：2006-12-14
申请号：US11446751
申请日：2006-06-05
申请人： Eckhard Wenz , Thomas Eckel , Bernhard Schartel , Uwe Beck , Andreas Hertwig , Matthias Weise , Johannes Strumpfel , Ekkehart Reinhold
发明人： Eckhard Wenz , Thomas Eckel , Bernhard Schartel , Uwe Beck , Andreas Hertwig , Matthias Weise , Johannes Strumpfel , Ekkehart Reinhold
IPC分类号： B32B15/08 , B32B15/082 , B32B15/085 , B32B15/088 , B32B15/09 , B32B15/095
CPC分类号： C23C14/10 , C08L25/04 , C08L69/00 , C08L69/005 , C23C14/022 , C23C14/025 , C23C14/20 , C23C14/30 , Y10T428/12562 , Y10T428/12569 , Y10T428/265 , Y10T428/31504 , Y10T428/31507 , Y10T428/31605 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31699 , C08L2666/02
摘要： The present invention relates to a multilayer product (composite material), wherein the first layer is a layer which is optically dense in the infrared range, and wherein the second layer contains a polymer (plastics) as substrate. The invention additionally relates to a method of improving the flame resistance of mouldings made from polymers and to a method of producing the multilayer products as well as to components which contain the above-mentioned multilayer products.
摘要翻译：本发明涉及一种多层产品（复合材料），其中第一层是在红外范围内光致密度的层，其中第二层含有作为基底的聚合物（塑料）。本发明还涉及提高由聚合物制成的模制品的阻燃性的方法以及制备多层产品的方法以及含有上述多层产品的组分。

108. 发明申请

US20060249847A1 Substrate with bonding metallization 有权
标题翻译：基材与粘合金属化
公开(公告)号：US20060249847A1
公开(公告)日：2006-11-09
申请号：US11120885
申请日：2005-05-03
申请人： Odd Eriksen , Kimiko Childress
发明人： Odd Eriksen , Kimiko Childress
IPC分类号： H01L29/40 , H01L21/44
CPC分类号： C23C14/022 , C23C14/021 , C23C14/025 , C23C14/0682 , C23C14/5806 , C23C14/5846 , C23C14/5873 , H01L24/13 , H01L2224/05171 , H01L2224/05181 , H01L2224/05186 , H01L2224/05644 , H01L2924/00014 , H01L2924/0496 , H01L2924/01032
摘要： A metallization layer that includes a tantalum layer located on the component, a tantalum silicide layer located on the tantalum layer, and a platinum silicide layer located on the tantalum silicide layer. In another embodiment the invention is a component having a metallization layer on the component. In another embodiment, the metallization layer has a post-annealing adhesive strength to silicon of at least about 100 MPa as measured by a mechanical shear test after exposure to a temperature of about 600° C. for about 30 minutes, and the metallization layer remains structurally intact after exposure to a temperature of about 600° C. for about 1000 hours. The metallization is useful for bonding with brazing alloys.
摘要翻译：包括位于组件上的钽层，位于钽层上的硅化钽层和位于硅化硅层上的铂硅化物层的金属化层。在另一个实施方案中，本发明是在组分上具有金属化层的组分。在另一个实施方案中，金属化层在暴露于约600℃的温度约30分钟后通过机械剪切试验测量的具有至少约100MPa的硅的后退火粘合强度，并且金属化层保留在约600℃的温度下暴露约1000小时后，其结构完整。金属化可用于与钎焊合金接合。

109. 发明申请

US20060231389A1 Insulated pallet in cleaning chamber 审中-公开
标题翻译：绝缘托盘在清洁室内
公开(公告)号：US20060231389A1
公开(公告)日：2006-10-19
申请号：US11107111
申请日：2005-04-14
申请人： Ravi Mullapudi , Dean Smith
发明人： Ravi Mullapudi , Dean Smith
IPC分类号： C23C14/00
CPC分类号： C23C14/022 , C23C14/505 , C23C14/56 , H01J37/32743 , H01L21/67069 , H01L21/67109
摘要： A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process. Various shields are described to prevent cross-contamination from the targets and prevent the sputtered target material from entering gaps in the chamber and shorting out insulators.
摘要翻译：描述了用于在真空室中一次在多个工件（晶片，显示面板或任何其他工件）上沉积材料的多室处理系统。该系统包括溅射室和单独的预清洁室，其中晶片可以通过机器臂在两个室之间传递而不破坏真空。将晶片一个接一个地安装在预清洁室和溅射室中的旋转托盘上。托盘牢固地固定在溅射室中的可旋转工作台上。表中的铜管将RF能量耦合到晶片，并且穿过铜管的液体控制晶片的温度。相同或不同材料的多个目标可以在托盘旋转的同时将材料沉积在晶片上。在溅射室中的磁控管组件中的多个磁体（一个用于每个靶）在其各自的靶上摆动，以均匀的目标腐蚀和在晶片上的均匀沉积。在每个磁体和靶之间的电绝缘的目标背板具有通过其的液体通道用于控制温度。通过浸焊法将固定在目标背板底部的薄铝板，将磁体和靶材之间的距离做得非常小。描述了各种屏蔽，以防止目标的交叉污染，并防止溅射的目标材料进入腔室中的间隙并使绝缘体短路。

110. 发明授权

US07112370B2 Vapor-deposited film 有权
标题翻译：蒸镀膜
公开(公告)号：US07112370B2
公开(公告)日：2006-09-26
申请号：US10760483
申请日：2004-01-21
申请人： Hiroshi Suzuki , Takeshi Kanetaka , Miki Oohashi , Noboru Sasaki , Takayuki Nakajima , Ryoji Ishii
发明人： Hiroshi Suzuki , Takeshi Kanetaka , Miki Oohashi , Noboru Sasaki , Takayuki Nakajima , Ryoji Ishii
IPC分类号： B32B18/00 , B32B27/00
CPC分类号： C04B35/14 , C04B35/03 , C04B35/057 , C04B35/10 , C23C14/0021 , C23C14/022 , C23C14/08 , Y10T428/31504 , Y10T428/31507 , Y10T428/31609 , Y10T428/31663 , Y10T428/31667 , Y10T428/31765 , Y10T428/31786 , Y10T428/31931 , Y10T428/31935 , Y10T428/31938 , Y10T428/31971
摘要： A vapor-deposited film having a substrate consisting essentially of a polymer material and a vapor-deposited layer consisting essentially of a ceramic, the substrate being subjected to plasma pre-treatment using a hollow anode plasma treatment device, prior to vapor deposition of the vapor-deposited layer.
摘要翻译：一种气相沉积膜，其基底由聚合物材料和基本上由陶瓷组成的气相沉积层组成，该衬底在气相沉积之前使用空心阳极等离子体处理装置进行等离子体预处理沉积层。

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