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101. 发明授权

US5180436A Microwave plasma film deposition system 失效
标题翻译：微波等离子体膜沉积系统
公开(公告)号：US5180436A
公开(公告)日：1993-01-19
申请号：US809119
申请日：1991-12-18
申请人： Tetsuya Ueda , Naoki Suzuki , Kohsaku Yano
发明人： Tetsuya Ueda , Naoki Suzuki , Kohsaku Yano
IPC分类号： C23C16/511 , H01J37/32
CPC分类号： H01J37/32211 , C23C16/511 , H01J37/32192 , H01J37/32678
摘要： A microwave plasma film deposition system using the microwave plasma in a state in which a magnetic field is applied to a plasma cavity for generating the plasma. The microwave plasma film deposition system can stably deposit a metal thin film by separating an insulating window for supplying the microwave to the plasma cavity from a region to which the magnetic field is applied, limiting the form and the size of a waveguide and regulating the process conditions (mainly, the pressure of gases in the system).
摘要翻译：一种使用微波等离子体的状态的微波等离子体膜沉积系统，其中磁场被施加到等离子体腔以产生等离子体。微波等离子体膜沉积系统可以通过从施加磁场的区域分离用于向等离子体腔提供微波的绝缘窗口来稳定地沉积金属薄膜，限制波导的形式和尺寸并调节该过程条件（主要是系统中的气体压力）。

102. 发明授权

US5166099A Manufacturing method for semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US5166099A
公开(公告)日：1992-11-24
申请号：US759912
申请日：1991-09-13
申请人： Tetsuya Ueda , Osami Nakagawa , Haruo Shimamoto , Yasuhiro Teraoka , Seiji Takemura
发明人： Tetsuya Ueda , Osami Nakagawa , Haruo Shimamoto , Yasuhiro Teraoka , Seiji Takemura
IPC分类号： H01L21/56 , H01L21/60 , H01L23/495
CPC分类号： H01L24/86 , H01L21/56 , H01L21/565 , H01L23/49572 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , Y10T29/49121
摘要： A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.
摘要翻译：一种半导体器件的制造方法，其中半导体芯片的电极电连接到载带的内引线。使半导体芯片的电极与载带的内引线接触。内部引线下垂控制在不超过80m的情况下进行接合。

103. 发明授权

US5076877A Apparatus for dry etching 失效
标题翻译：干蚀刻设备
公开(公告)号：US5076877A
公开(公告)日：1991-12-31
申请号：US523422
申请日：1990-05-15
申请人： Tetsuya Ueda , Kohsaku Yano
发明人： Tetsuya Ueda , Kohsaku Yano
IPC分类号： H01L21/302 , H01L21/00
CPC分类号： H01L21/67069
摘要： An apparatus for dry etching, which comprises a stage for supporting a substrate, a rotor having a center shaft, the stage and an arm connecting the stage to the center shaft, and a driving means for turning the rotor at the center shaft as a turning center in the direction tangential to the circumference of a circle established by turning of the surface of the substrate at the center shaft as a turning center, the rotor being housed in a chamber, can make uniform perpendicular submicron etching with radicals or a reactive gas without using ions and without damages on the substrate.
摘要翻译：一种用于干蚀刻的装置，包括用于支撑基板的台，具有中心轴的转子，所述台和将所述台与所述中心轴连接的臂，以及用于在所述中心轴处转动所述转子作为转动的驱动装置中心在与通过在作为转动中心的中心轴处的基板的表面的转动而形成的圆的圆周方向上，转子被容纳在室中，可以进行具有自由基或反应气体的均匀的垂直亚微米蚀刻而没有在基板上使用离子而不损坏。

104. 发明授权

US5031026A Thin semiconductor card 失效
标题翻译：薄半导体卡
公开(公告)号：US5031026A
公开(公告)日：1991-07-09
申请号：US218804
申请日：1988-07-01
申请人： Tetsuya Ueda
发明人： Tetsuya Ueda
IPC分类号： B42D15/10 , G06K19/02 , G06K19/077
CPC分类号： G06K19/07728 , G06K19/02 , G06K19/077
摘要： The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.

105. 发明授权

US5025307A Modular semiconductor device 失效
标题翻译：模块化半导体器件
公开(公告)号：US5025307A
公开(公告)日：1991-06-18
申请号：US501276
申请日：1990-03-29
申请人： Tetsuya Ueda , Toru Tachikawa , Masataka Takehara
发明人： Tetsuya Ueda , Toru Tachikawa , Masataka Takehara
IPC分类号： H05K7/20 , H01L23/467 , H01L23/50 , H01L25/00 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/14 , H05K7/02 , H05K7/14
CPC分类号： H05K1/145 , H01L25/117 , H05K7/023 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K2201/09709 , H05K2201/10946
摘要： A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.
摘要翻译：模块化半导体器件包括一对大体上平行的电子电路板和安装在电子电路板之间的多个IC封装。两个或更多个模块化半导体器件可以彼此堆叠，使得可以容易地扩大存储器容量并且可以容易地改善功能水平。可以提供与IC封装近接触的平面或蜂窝结构的加热散热片。

106. 发明授权

US4949158A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US4949158A
公开(公告)日：1990-08-14
申请号：US217975
申请日：1988-07-12
申请人： Tetsuya Ueda
发明人： Tetsuya Ueda
IPC分类号： H01L21/60 , H01L23/495 , H01L23/498
CPC分类号： H01L23/49572 , H01L23/49827 , H01L2224/73253 , H01L2924/15173
摘要： A semiconductor device provided with a film having an opening and first and second surfaces; a semiconductor chip having first and second surfaces corresponding to the first and second surfaces of the film and positioned inside the opening along the film; a plurality of first leads fixed to the first surface of the film, a tip of each first lead being electrically connected to a first electrode provided on the first surface of the semiconductor chip; at least one second lead fixed to the first surface of the film; an electroconductive member in the form of, e.g., a film, fixed to the second surface of the film and electrically connected to a second electrode provided on the second surface of the semiconductor chip; and a connection member passing through the film and electrically connecting the second lead and the electroconductive member to each other. The second electrode on the second surface of the semiconductor chip is connected to the second lead on the first surface of the film via the electroconductive member and the connection member. There is also provided a method of manufacturing this type of semiconductor device.
摘要翻译：一种具有膜的半导体器件，具有开口和第一和第二表面; 半导体芯片，其具有与薄膜的第一和第二表面对应的第一和第二表面，并且沿着薄膜定位在开口内部; 多个第一引线固定在该膜的第一表面上，每个第一引线的末端电连接到设置在该半导体芯片的第一表面上的第一电极; 至少一个第二引线固定在该膜的第一表面上; 固定到膜的第二表面并且电连接到设置在半导体芯片的第二表面上的第二电极的例如薄膜形式的导电构件; 以及通过所述膜并将所述第二引线和所述导电构件彼此电连接的连接构件。半导体芯片的第二表面上的第二电极经由导电构件和连接构件连接到膜的第一表面上的第二引线。还提供了制造这种类型的半导体器件的方法。

107. 发明授权

US4926034A Connector in external device for connection to IC card 失效
标题翻译：外部设备连接器用于连接IC卡
公开(公告)号：US4926034A
公开(公告)日：1990-05-15
申请号：US173167
申请日：1988-03-25
申请人： Toshinobu Banjo , Tetsuya Ueda , Shigeo Onoda
发明人： Toshinobu Banjo , Tetsuya Ueda , Shigeo Onoda
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07 , H01R13/447 , H01R33/76 , H05K1/11
CPC分类号： H01R13/447
摘要： A connector provided in an external device for an IC card having a card shutter provided with slide members, the shutter being capable of advancing and retreating and adapted to cover and protect external terminals of the IC card when the card is not used. This connector is provided with electroconductive pins adapted to move the shutter in the direction opposite to that of the insertion of the IC card so as to open the shutter of the IC card by contacting the slide member of the card shutter when the IC card is inserted into the connector, and an earth line for grounding the pin.
摘要翻译：一种用于IC卡的外部装置的连接器，具有设置有滑动构件的卡闸，所述挡板能够前进和后退，并且适用于在不使用卡时覆盖和保护IC卡的外部端子。该连接器设置有导电销，其适于沿与IC卡的插入方向相反的方向移动快门，以便当IC卡插入时通过接触卡闸的滑动构件来打开IC卡的快门连接器和接地线。

108. 发明授权

US4764803A Thin semiconductor card 失效
标题翻译：薄半导体卡
公开(公告)号：US4764803A
公开(公告)日：1988-08-16
申请号：US26873
申请日：1987-03-17
申请人： Tetsuya Ueda
发明人： Tetsuya Ueda
IPC分类号： B42D15/10 , G06K19/02 , G06K19/077 , H01L23/18 , H01L23/04 , H01L23/10 , H01L23/30
CPC分类号： G06K19/07728 , G06K19/02 , G06K19/077
摘要： The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.
摘要翻译：诸如IC卡的薄半导体卡的可靠性由用于吸收外部施加的应力的可变形部分的应力吸收部分增强，从而防止应力损坏卡主体，半导体模块或半导体元件。或者，通过位于远离半导体模块的较弱部分提供保护，其在应力可破坏半导体模块之前在外部应力下断开。

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