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    • 102. 发明申请
    • Non-Volatile Resistive Oxide Memory Cells And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells
    • 非挥发性电阻氧化物记忆单元和形成非易失性电阻氧化物记忆单元的方法
    • US20120241714A1
    • 2012-09-27
    • US13488190
    • 2012-06-04
    • Bhaskar SrinivasanGurtej SandhuJohn Smythe
    • Bhaskar SrinivasanGurtej SandhuJohn Smythe
    • H01L47/00
    • H01L45/04H01L27/2463H01L27/2472H01L45/1233H01L45/146H01L45/147H01L45/1675
    • A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. The first conductive electrode has an elevationally outermost surface and opposing laterally outermost edges at the elevationally outermost surface in one planar cross section. Multi-resistive state metal oxide-comprising material is formed over the first conductive electrode. Conductive material is deposited over the multi-resistive state metal oxide-comprising material. A second conductive electrode of the memory cell which comprises the conductive material is received over the multi-resistive state metal oxide-comprising material. The forming thereof includes etching through the conductive material to form opposing laterally outermost conductive edges of said conductive material in the one planar cross section at the conclusion of said etching which are received laterally outward of the opposing laterally outermost edges of the first conductive electrode in the one planar cross section.
    • 形成非易失性电阻氧化物存储单元的方法包括:形成存储单元的第一导电电极作为衬底的一部分。 第一导电电极在一个平面横截面中具有垂直最外表面和在最外表面处的相对的横向最外边缘。 在第一导电电极上形成包含多电阻态金属氧化物的材料。 导电材料沉积在多电阻状态的含金属氧化物的材料上。 包含导电材料的存储单元的第二导电电极被接收在多电阻状态的含金属氧化物的材料上。 其形成包括通过导电材料的蚀刻,以在所述蚀刻结束时在一个平面截面中形成所述导电材料的相对的横向最外面的导电边缘,其在第一导电电极的相对的横向最外边缘的横向外侧接收 一个平面截面。
    • 103. 发明授权
    • Methods of forming non-volatile memory cells having multi-resistive state material between conductive electrodes
    • 在导电电极之间形成具有多电阻状态材料的非易失性存储单元的方法
    • US08211743B2
    • 2012-07-03
    • US12114096
    • 2008-05-02
    • Bhaskar SrinivasanGurtej SandhuJohn Smythe
    • Bhaskar SrinivasanGurtej SandhuJohn Smythe
    • H01L21/00
    • H01L45/04H01L27/2463H01L27/2472H01L45/1233H01L45/146H01L45/147H01L45/1675
    • A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. The first conductive electrode has an elevationally outermost surface and opposing laterally outermost edges at the elevationally outermost surface in one planar cross section. Multi-resistive state metal oxide-comprising material is formed over the first conductive electrode. Conductive material is deposited over the multi-resistive state metal oxide-comprising material. A second conductive electrode of the memory cell which comprises the conductive material is received over the multi-resistive state metal oxide-comprising material. The forming thereof includes etching through the conductive material to form opposing laterally outermost conductive edges of said conductive material in the one planar cross section at the conclusion of said etching which are received laterally outward of the opposing laterally outermost edges of the first conductive electrode in the one planar cross section.
    • 形成非易失性电阻氧化物存储单元的方法包括:形成存储单元的第一导电电极作为衬底的一部分。 第一导电电极在一个平面横截面中具有垂直最外表面和在最外表面处的相对的横向最外边缘。 在第一导电电极上形成包含多电阻态金属氧化物的材料。 导电材料沉积在多电阻状态的含金属氧化物的材料上。 包含导电材料的存储单元的第二导电电极被接收在多电阻状态的含金属氧化物的材料上。 其形成包括通过导电材料的蚀刻,以在所述蚀刻结束时在一个平面截面中形成所述导电材料的相对的横向最外面的导电边缘,其在第一导电电极的相对的横向最外边缘的横向外侧接收 一个平面截面。