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101. 发明申请

US20170102188A1 DEMAND-BASED CHARGING OF A HEAT PIPE 有权
公开(公告)号：US20170102188A1
公开(公告)日：2017-04-13
申请号：US14881413
申请日：2015-10-13
申请人： International Business Machines Corporation
发明人： William J. Anderl , Bret P. Elison , Phillip V. Mann , Arvind K. Sinha
IPC分类号： F28D15/06
CPC分类号： F28D15/06 , F28D15/0275 , F28D15/0283 , F28D15/046 , F28D2015/0216 , F28D2021/0028 , F28F3/02 , F28F21/085 , H01L23/3672 , H01L23/427
摘要： A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

102. 发明申请

US20160359246A1 PIN ATTACH CONVERTER 有权
标题翻译：引脚连接转换器
公开(公告)号：US20160359246A1
公开(公告)日：2016-12-08
申请号：US14733353
申请日：2015-06-08
申请人： International Business Machines Corporation
发明人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R12/70 , H01R4/02 , H01R4/18
CPC分类号： H01R12/58 , H01R4/02 , H01R4/18 , H01R12/585 , H01R12/7076 , H01R12/718
摘要： A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
摘要翻译：用于将电触点耦合到印刷电路板的引脚连接转换器可以包括具有适于横穿印刷电路板中的孔的第一长度的柔顺区域，并且提供与孔的至少一个壁的机械和电配准。引脚连接转换器还可以包括耦合到柔顺区域的适配器区域，并且具有第二长度的空腔并且适于接收电接触，其中第二长度沿与第一长度相同的纵向轴线延伸，并且腔适于提供与电接触的机械和电气注册。

103. 发明授权

US09414528B2 Thermal spreading for an externally pluggable electronic module 有权
公开(公告)号：US09414528B2
公开(公告)日：2016-08-09
申请号：US14549653
申请日：2014-11-21
申请人： International Business Machines Corporation
发明人： Phillip V. Mann , Kevin M. O'Connell , Arvind K. Sinha , Karl Stathakis
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H05K7/2039
摘要： A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.

104. 发明授权

US09177889B2 Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks 有权
标题翻译：为处理器和3D芯片堆栈实现微型热声热和功率控制
公开(公告)号：US09177889B2
公开(公告)日：2015-11-03
申请号：US13624051
申请日：2012-09-21
申请人： International Business Machines Corporation
发明人： Bret P. Elison , Phillip V. Mann , Arvind K. Sinha
IPC分类号： H01L23/34 , H01L23/467 , F03G7/00 , H01L23/367 , F25B9/14 , F28D21/00
CPC分类号： H01L23/467 , F02G2243/54 , F03G7/002 , F25B9/145 , F28D2021/0028 , F28D2021/0029 , H01L23/34 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.
摘要翻译：提供了一种用于对处理器和三维（3D）芯片堆栈进行微型热声热和功率控制的方法和装置。热声热发动机与3D芯片堆叠和高功率处理器集成。热声热发动机与与3D芯片堆叠相关联的散热器协同使用。预定义的连接层将3D芯片堆叠连接到热声热发动机的热声堆栈的冷却端，使谐振器的冷却端保持3D芯片堆叠内的温度并提高散热器的效率。

105. 发明申请

US20150214675A1 DYNAMIC KEYING ASSEMBLY 有权
公开(公告)号：US20150214675A1
公开(公告)日：2015-07-30
申请号：US14277961
申请日：2014-05-15
申请人： International Business Machines Corporation
发明人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R13/66 , H01R43/26
CPC分类号： H01R43/26 , H01R13/447 , H01R13/64 , H01R13/665 , Y10T29/49117
摘要： A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

106. 发明申请

US20150192219A1 AIR VALVE FOR ELECTRONICS ENCLOSURES 有权
标题翻译：用于电子外壳的气阀
公开(公告)号：US20150192219A1
公开(公告)日：2015-07-09
申请号：US14151097
申请日：2014-01-09
申请人： International Business Machines Corporation
发明人： William J. Anderl , Bret P. Elison , Phillip V. Mann , Arden L. Moore , Arvind K. Sinha
IPC分类号： F16K31/08 , F24F7/007 , F16K1/18
CPC分类号： F16K3/10 , F16K3/0245 , F16K3/03 , F16K31/086 , G06F1/20 , H05K7/20181 , H05K7/20727
摘要： An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.
摘要翻译：空气阀包括框架和薄材料片。框架可以具有安装在风扇壳体上的出口侧构件和可旋转地联接到出口侧构件的入口侧构件。材料可以具有顶部和底部边缘，以及垂直于顶部和底部侧边缘的多个折叠部，其将片材分成多个部分。该材料可以附接到出口侧构件和入口侧构件，并且可在折叠位置和扩展位置之间配置。入口侧构件上的磁性部件与旋转的风扇叶片上的磁性部件之间的吸引力可能导致入口侧部件旋转，将材料移动到折叠构型。当风扇叶片不旋转时，附接在枢转点处的弹簧可以使入口侧构件沿相反方向旋转，从而将材料移动到展开位置。

107. 发明申请

US20150138731A1 COOLING APPARATUS WITH DYNAMIC LOAD ADJUSTMENT 有权
公开(公告)号：US20150138731A1
公开(公告)日：2015-05-21
申请号：US14082560
申请日：2013-11-18
申请人： International Business Machines Corporation
发明人： Phillip V. Mann , Kevin M. O'Connell , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/20409 , G06F1/206 , H01L23/4006 , H01L23/4093 , H01L23/42 , H01L23/427 , H01L23/433 , H01L2924/0002 , H05K7/20336 , H01L2924/00
摘要： A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.

108. 发明申请

US20150136365A1 COOLING APPARATUS WITH DYNAMIC LOAD ADJUSTMENT 有权
标题翻译：冷却装置与动态负载调整
公开(公告)号：US20150136365A1
公开(公告)日：2015-05-21
申请号：US14250425
申请日：2014-04-11
申请人： International Business Machines Corporation
发明人： Phillip V. Mann , Kevin M. O'Connell , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/20409 , G06F1/206 , H01L23/4006 , H01L23/4093 , H01L23/42 , H01L23/427 , H01L23/433 , H01L2924/0002 , H05K7/20336 , H01L2924/00
摘要： A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.
摘要翻译：公开了一种冷却装置，其可以包括多个发热单元。冷却装置还可以具有热界面材料（TIM），以便于远离发热单元的热传递。冷却装置还可以具有位于上方的多个散热器柱，并且被设计成通过与TIM层的相应部分的导热接触将热量从对应的发热单元传导出去。冷却装置还可以具有位于散热器列上方的负载板，其设计成将散热器支柱保持在发热单元上方相对固定的位置。 TIM层可以在散热器列和相应的发热单元之间具有初始压缩状态。每个散热器列可以被设计成使得在操作中，TIM层的相应部分可以具有进一步的压缩状态。

109. 发明申请

US20150057829A1 Managing Cooling Operations In A Parallel Computer Comprising A Plurality Of Compute Nodes 有权
标题翻译：在并行计算机中管理包含多个计算节点的冷却操作
公开(公告)号：US20150057829A1
公开(公告)日：2015-02-26
申请号：US13973608
申请日：2013-08-22
申请人： International Business Machines Corporation
发明人： Charles J. Archer , Bin Cao , Phillip V. Mann
IPC分类号： G05D23/19
CPC分类号： G06F1/206
摘要： Managing cooling operations in a parallel computer comprising a plurality of compute nodes, including: receiving, by a target compute node from an origin compute node, a message; identifying, by the target compute node, one or more characteristics of the message; and controlling, by the target compute node, cooling operations in dependence upon the one or more characteristics of the message.
摘要翻译：在包括多个计算节点的并行计算机中管理冷却操作，包括：目标计算节点从原始计算节点接收消息; 由所述目标计算节点识别所述消息的一个或多个特征; 以及由所述目标计算节点根据所述消息的一个或多个特性来控制冷却操作。

110. 发明申请

US20140083094A1 IMPLEMENTING MICROSCALE THERMOACOUSTIC HEAT AND POWER CONTROL FOR PROCESSORS AND 3D CHIPSTACKS 有权
标题翻译：执行微处理器热处理器和三维显示器的功率控制
公开(公告)号：US20140083094A1
公开(公告)日：2014-03-27
申请号：US13624051
申请日：2012-09-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bret P. Elison , Phillip V. Mann , Arvind K. Sinha
IPC分类号： F01B19/00
CPC分类号： H01L23/467 , F02G2243/54 , F03G7/002 , F25B9/145 , F28D2021/0028 , F28D2021/0029 , H01L23/34 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.
摘要翻译：提供了一种用于对处理器和三维（3D）芯片堆栈进行微型热声热和功率控制的方法和装置。热声热发动机与3D芯片堆叠和高功率处理器集成。热声热发动机与与3D芯片堆叠相关联的散热器协同使用。预定义的连接层将3D芯片堆叠连接到热声热发动机的热声堆栈的冷却端，使谐振器的冷却端保持3D芯片堆叠内的温度并提高散热器的效率。

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