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    • 109. 发明授权
    • Dynamic holographic display with cantilever
    • 悬臂式动态全息显示
    • US5424866A
    • 1995-06-13
    • US107987
    • 1993-08-16
    • Dan Kikinis
    • Dan Kikinis
    • G03H1/02G03H1/22G02B26/00G03H1/08
    • G03H1/22G03H1/2294G03H2225/24
    • A dynamic holographic display has an array of reflective surfaces formed on cantilever structures substantially parallel to the surface of a substrate, such as a silicon wafer. A holographic image is formed by controlling electrical currents passed through the cantilever structures to position the reflective surfaces of the cells in the array so the topography forms a hologram, and reflected light interferes to form a holographic image. In a preferred embodiment, control is by computer and positions of reflective surfaces are determined by calculation from dimensional data available to the control computer.
    • 动态全息显示器具有形成在基本上平行于诸如硅晶片的基板的表面的悬臂结构上的反射表面的阵列。 通过控制通过悬臂结构的电流以将单元的反射表面定位在阵列中以形成全息图,并且反射光干涉以形成全息图像来形成全息图像。 在优选实施例中,通过计算机进行控制,并且通过从可用于控制计算机的尺寸数据的计算来确定反射表面的位置。
    • 110. 发明授权
    • Space-saving memory module
    • 节省空间的内存模块
    • US5412538A
    • 1995-05-02
    • US93774
    • 1993-07-19
    • Dan KikinisWilliam J. Seller
    • Dan KikinisWilliam J. Seller
    • G06F13/40H04M1/725H04M3/42H05K1/18H05K3/00H05K3/46H05K1/14
    • G06F13/409H05K1/182H04M1/725H04M3/42323H05K3/4611H05K3/4691
    • A low-profile printed circuit board has discrete components mounted within openings provided in a rigid substrate forming art of the board. The components are mounted with leads soldered to mounting pads on the surface of the board, and arranged around the periphery of the openings. The stand-off design of discrete components for mounting to the surfaces of boards allows such components to be mounted within openings simply by reversing the orientation of the components relative to the board. In a preferred embodiment a DRAM card is a four-level board with circuitry on each side of a thin, flexible substrate and each side of a rigid substrate, the two substrates spaced apart by a thin, insulating layer. The rigid substrate has openings with DRAM modules mounted within the openings, and further modules are mounted on the opposite surface in the conventional manner.
    • 薄型印刷电路板具有安装在设置在基板的刚性基板中的开口内的分立部件。 组件安装有焊接到板表面上的安装焊盘的引线,并且围绕开口的周边设置。 用于安装到板表面的分立组件的间隔设计允许这样的部件通过相对于板的反向取向而安装在开口内。 在优选实施例中,DRAM卡是四层电路板,其在薄的柔性衬底的每一侧上具有电路,并且刚性衬底的每一侧具有电路,所述两个衬底由薄的绝缘层隔开。 刚性基板具有安装在开口内的DRAM模块的开口,并且其它模块以常规方式安装在相对表面上。