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101. 发明授权

US09308618B2 Linear prediction for filtering of data during in-situ monitoring of polishing 有权
标题翻译：在抛光原位监测期间过滤数据的线性预测
公开(公告)号：US09308618B2
公开(公告)日：2016-04-12
申请号：US13456801
申请日：2012-04-26
申请人： Dominic J. Benvegnu
发明人： Dominic J. Benvegnu
IPC分类号： B24B37/00 , B24B37/013 , B24B49/10
CPC分类号： B24B37/013 , B24B49/10
摘要： A method of controlling polishing includes polishing a substrate, during polishing monitoring the substrate with an in-situ monitoring system, the monitoring including generating a signal from a sensor, and filtering the signal to generate a filtered signal. The signal includes a sequence of measured values, and the filtered signal including a sequence of adjusted values. The filtering includes for each adjusted value in the sequence of adjusted values, generating at least one predicted value from the sequence of measured values using linear prediction, and calculating the adjusted value from the sequence of measured values and the predicted value. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the filtered signal.
摘要翻译：控制抛光的方法包括在用原位监测系统对衬底进行抛光监测期间抛光衬底，所述监测包括从传感器产生信号，以及对信号进行滤波以产生滤波信号。信号包括测量值的序列，并且滤波的信号包括调节值的序列。过滤包括调整值序列中的每个调整值，使用线性预测从测量值序列生成至少一个预测值，以及根据测量值序列和预测值计算调整值。从滤波的信号确定抛光终点或抛光速率的调整中的至少一个。

102. 发明授权

US08562389B2 Thin polishing pad with window and molding process 有权
公开(公告)号：US08562389B2
公开(公告)日：2013-10-22
申请号：US12130670
申请日：2008-05-30
申请人： Dominic J. Benvegnu , Jimin Zhang , Thomas H. Osterheld , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Jimin Zhang , Thomas H. Osterheld , Boguslaw A. Swedek
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.

103. 发明申请

US20130167614A1 FRICTION SENSOR FOR POLISHING SYSTEM 有权
公开(公告)号：US20130167614A1
公开(公告)日：2013-07-04
申请号：US13714202
申请日：2012-12-13
申请人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： G01N19/02
CPC分类号： G01N19/02 , B24B37/013 , B24B49/16
摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

104. 发明申请

US20120289124A1 ENDPOINT DETECTION USING SPECTRUM FEATURE TRAJECTORIES 有权
标题翻译：使用光谱特征TRAJECTORIES进行端点检测
公开(公告)号：US20120289124A1
公开(公告)日：2012-11-15
申请号：US13103868
申请日：2011-05-09
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of polishing includes polishing a substrate, making a sequence of measurements of light reflected from the substrate while the substrate is being polished, at least some of the measurements of the sequence of measurements differing due to material being removed during polishing, for each measurement in the sequence, determining a first value of a first characteristic and a second value of a different second characteristic of the light to generate a sequence of first values and second values, storing a predetermined path in a coordinate space of the first characteristic and the second characteristic, for each measurement in the sequence, determining a position on the path based on the first value and the second value, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the position on the path.
摘要翻译：抛光方法包括：抛光衬底，在衬底被抛光的同时对从衬底反射的光进行一系列测量，对于每次测量，由于在抛光过程中材料被去除而导致的测量序列的至少一些测量值不同在该顺序中，确定光的第一特性的第一值和不同第二特性的第二值，以产生第一值和第二值的序列，将预定路径存储在第一特性的坐标空间中，并且第二值特征，对于序列中的每个测量，基于第一值和第二值确定路径上的位置，并且基于路径上的位置来确定抛光终点或抛光速率的调整中的至少一个。

105. 发明申请

US20120064801A1 Feedback Control of Polishing Using Optical Detection of Clearance 有权
标题翻译：使用光学检测清除的抛光反馈控制
公开(公告)号：US20120064801A1
公开(公告)日：2012-03-15
申请号：US13223159
申请日：2011-08-31
申请人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
发明人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
IPC分类号： B24B49/00
CPC分类号： B24B37/005 , B24B37/042 , B24B37/107 , B24B37/30 , B24B49/12 , G01B11/0683
摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
摘要翻译：控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。在抛光期间，用原位监测系统监测基底以产生测量序列。测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。使用至少一个调整的抛光压力来抛光第二基底。

106. 发明授权

US07264536B2 Polishing pad with window 有权
标题翻译：抛光垫与窗口
公开(公告)号：US07264536B2
公开(公告)日：2007-09-04
申请号：US10669544
申请日：2003-09-23
申请人： Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
发明人： Andreas Norbert Wiswesser , Ramiel Oshana , Kerry F. Hughes , Jay Rohde , David Datong Huo , Dominic J. Benvegnu
IPC分类号： B24B49/12
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.
摘要翻译：研磨抛光层具有窗构件，其顶表面位于抛光表面下方预定的距离处。透明层可以位于抛光层下方并支撑窗构件。

107. 发明申请

US20200070306A1 Polishing System with Capacitive Shear Sensor 审中-公开
公开(公告)号：US20200070306A1
公开(公告)日：2020-03-05
申请号：US16522287
申请日：2019-07-25
申请人： Nicholas Wiswell , Chih Chung Chou , Dominic J. Benvegnu
发明人： Nicholas Wiswell , Chih Chung Chou , Dominic J. Benvegnu
IPC分类号： B24B49/12 , B24B37/013 , B24B37/04
摘要： A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring system including a friction sensor. The friction sensor includes a pad portion having a substrate contacting portion with an upper surface to contact the lower surface of the substrate, and a pair of capacitive sensors positioned below and on opposing sides of the substrate contacting portion.

108. 发明申请

US20150194356A1 FEEDBACK OF LAYER THICKNESS TIMING AND CLEARANCE TIMING FOR POLISHING CONTROL 有权
标题翻译：反馈厚度时间和间隔时间的抛光控制
公开(公告)号：US20150194356A1
公开(公告)日：2015-07-09
申请号：US14665889
申请日：2015-03-23
申请人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
发明人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
IPC分类号： H01L21/66 , H01L21/306
CPC分类号： H01L22/26 , B24B37/005 , B24B37/013 , B24B49/12 , C01G9/00 , G01B11/0625 , G01B11/0683 , H01L21/30625 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： During polishing of a first substrate at a first polishing station, a sequence of measurements by a first in-situ monitoring system is monitored to determining a first time at which the first sequence exhibits a first predefined feature indicating a predetermined thickness of an overlying layer, and during polishing of the first substrate at a second polishing station, a sequence of measurements by a second in-situ monitoring system is monitored to determine a second time indicating clearance of the overlying layer and exposure of the underlying layer. The first time is used to calculate a first adjusted polishing pressure for a second substrate at the first polishing station, and the second time is used to calculate a second adjusted polishing pressure for the second substrate at the second polishing station.
摘要翻译：在第一抛光站抛光第一衬底期间，监测由第一原位监测系统进行的测量序列，以确定第一次序列呈现指示上覆层的预定厚度的第一预定义特征的第一时间，并且在第二抛光站抛光第一基板期间，监测由第二原位监测系统进行的测量序列，以确定第二次指示上覆层的间隙和下层的曝光。第一次用于计算在第一抛光站处的第二基板的第一调整抛光压力，并且第二次用于计算在第二抛光站处的第二基板的第二调整抛光压力。

109. 发明授权

US08657646B2 Endpoint detection using spectrum feature trajectories 有权
标题翻译：使用频谱特征轨迹的端点检测
公开(公告)号：US08657646B2
公开(公告)日：2014-02-25
申请号：US13103868
申请日：2011-05-09
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of polishing includes polishing a substrate, making a sequence of measurements of light reflected from the substrate while the substrate is being polished, at least some of the measurements of the sequence of measurements differing due to material being removed during polishing, for each measurement in the sequence, determining a first value of a first characteristic and a second value of a different second characteristic of the light to generate a sequence of first values and second values, storing a predetermined path in a coordinate space of the first characteristic and the second characteristic, for each measurement in the sequence, determining a position on the path based on the first value and the second value, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the position on the path.
摘要翻译：抛光方法包括：抛光衬底，在衬底被抛光的同时对从衬底反射的光进行一系列测量，对于每次测量，由于在抛光过程中材料被去除而导致的测量序列的至少一些测量值不同在该顺序中，确定光的第一特性的第一值和不同第二特性的第二值，以产生第一值和第二值的序列，将预定路径存储在第一特性的坐标空间中，并且第二值特征，对于序列中的每个测量，基于第一值和第二值确定路径上的位置，并且基于路径上的位置来确定抛光终点或抛光速率的调整中的至少一个。

110. 发明申请

US20130280827A1 METHOD OF CONTROLLING POLISHING USING IN-SITU OPTICAL MONITORING AND FOURIER TRANSFORM 有权
标题翻译：使用现场光学监测和FOURIER变换控制抛光的方法
公开(公告)号：US20130280827A1
公开(公告)日：2013-10-24
申请号：US13454002
申请日：2012-04-23
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , G01N21/359 , H01L22/26
摘要： A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra applying a Fourier transform to the measured spectrum to generate a transformed spectrum thus generating a sequence of transformed spectra, for each transformed spectrum identifying a peak of interest from a plurality of peaks in the transformed spectrum, for each transformed spectrum determining a position value for the peak of interest in the transformed spectrum thus generating a sequence of position values, and determining at least one of a polishing endpoint or an adjustment of a pressure to the substrate from the sequence of position values.
摘要翻译：一种控制抛光操作的方法包括：在抛光期间，利用原位光学监测系统从基底测量的光谱获得随时间变化的序列，对基底进行抛光，从测量光谱序列中应用傅里叶变换到测量的频谱，以产生变换的频谱，从而为每个变换的频谱，对于每个变换的频谱，从变换的频谱中的多个峰中识别感兴趣的峰，对于每个转化的谱，确定转化的峰中的感兴趣的峰的位置值从而产生位置值序列，并根据位置值序列确定抛光终点或对衬底的压力的调整中的至少一个。

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