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    • 102. 发明申请
    • METHOD FOR FORMING AND STRUCTURE OF A RECESSED SOURCE/DRAIN STRAP FOR A MUGFET
    • 用于形成和结构的用于大量生长的源/排水带的方法
    • US20120056264A1
    • 2012-03-08
    • US12876343
    • 2010-09-07
    • Brent A. AndersonAndres BryantEdward J. NowakJed H. Rankin
    • Brent A. AndersonAndres BryantEdward J. NowakJed H. Rankin
    • H01L29/78H01L21/336
    • H01L29/66795H01L29/7848H01L29/785H01L2029/7858
    • A method and semiconductor structure includes an insulator layer on a substrate, a plurality of parallel fins above the insulator layer, relative to a bottom of the structure. Each of the fins comprises a central semiconductor portion and conductive end portions. At least one conductive strap may be positioned within the insulator layer below the fins, relative to the bottom of the structure. The conductive strap can be perpendicular to the fins and contact the fins. The conductive strap further includes recessed portions disposed within the insulator layer, below the plurality of fins, relative to the bottom of the structure, and between each of the plurality of fins, and projected portions disposed above the insulator layer, collinear with each of the plurality of fins, relative to the bottom of the structure. The conductive strap is disposed in at least one of a source and a drain region of the semiconductor structure. A gate insulator contacts and covers the central semiconductor portion of the fins, and a gate conductor covers and contacts the gate insulator.
    • 一种方法和半导体结构包括在衬底上的绝缘体层,相对于该结构的底部在绝缘体层之上的多个平行的鳍。 每个翅片包括中心半导体部分和导电端部。 至少一个导电带可以相对于结构的底部定位在翅片下方的绝缘体层内。 导电带可以垂直于翅片并接触翅片。 导电带还包括设置在绝缘体层内的凹陷部分,相对于结构的底部在多个翅片之下,并且在多个翅片中的每一个之间,以及设置在绝缘体层上方的突出部分, 多个翅片相对于结构的底部。 导电带设置在半导体结构的源极和漏极区域中的至少一个中。 栅极绝缘体接触并覆盖翅片的中心半导体部分,并且栅极导体覆盖并接触栅极绝缘体。
    • 103. 发明授权
    • Recessed gate channel with low Vt corner
    • 嵌入门通道低Vt角
    • US08115251B2
    • 2012-02-14
    • US11741898
    • 2007-04-30
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/66
    • H01L29/665H01L29/1083H01L29/4236H01L29/517H01L29/66621H01L29/78
    • A recessed gate FET device includes a substrate having an upper and lower portions, the lower portion having a reduced concentration of dopant material than the upper portion; a trench-type gate electrode defining a surrounding channel region and having a gate dielectric material layer lining and including a conductive material having a top surface recessed to reduce overlap capacitance with respect to the source and drain diffusion regions formed at an upper substrate surface at either side of the gate electrode. There is optionally formed halo implants at either side of and abutting the gate electrode, each halo implants extending below the source and drain diffusions into the channel region. Additionally, highly doped source and drain extension regions are formed that provide a low resistance path from the source and drain diffusion regions to the channel region. The recessed gate FET device suppresses short channel effects and exhibits improved threshold voltage (Vt) characteristics at corners of the trench bottom.
    • 凹陷栅极FET器件包括具有上部和下部的衬底,下部具有比上部更低的掺杂剂材料的浓度; 限定周围通道区域并且具有衬底的栅介质材料层的沟槽型栅电极,并且包括具有凹陷的顶表面的导电材料,以减少相对于在上基板表面处形成的源极和漏极扩散区域的重叠电容 侧电极。 在栅电极的任一侧和邻接栅电极处可选地形成卤素植入物,每个卤素注入物延伸到源极和漏极扩散到沟道区域之内。 此外,形成高掺杂的源极和漏极延伸区域,其提供从源极和漏极扩散区域到沟道区域的低电阻路径。 凹陷栅极FET器件抑制短沟道效应并且在沟槽底部的拐角处表现出改进的阈值电压(Vt)特性。
    • 106. 发明授权
    • Metal-gate thermocouple
    • 金属栅极热电偶
    • US07902625B2
    • 2011-03-08
    • US12106557
    • 2008-04-21
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L31/058
    • H01L35/32H01L22/34H01L2924/0002H01L2924/00
    • A metal gate thermocouple is provided. The thermocouple is configured to measure local temperatures of a device. The thermocouple is a passive device which senses temperature using the thermoelectric principle that when two dissimilar electrically conductive materials are joined, an electrical potential (voltage) is developed between the two materials. The voltage between the materials varies with the temperature of the junction (joint) between the materials. The thermocouple device includes a first conductor comprising a first material formed over a thin oxide layer or a shallow trench isolation (STI) structure and a second conductor comprising a second material formed over the thin oxide layer or the STI structure. The second conductor overlaps with the first conductor to form a thermocouple junction or dimension at least more than an alignment tolerance. The first and second materials are chosen such that the thermocouple junction formed between them exhibits a non-zero Seebeck coefficient. A conductive film formed over the first conductor and the second conductor and a non-conductive void or film is formed over the thermocouple junction.
    • 提供金属栅极热电偶。 热电偶被配置为测量设备的局部温度。 热电偶是使用热电原理感应温度的无源器件,当两种不同的导电材料接合时,两种材料之间产生电位(电压)。 材料之间的电压随着材料之间的接头(接头)的温度而变化。 热电偶装置包括第一导体,其包括在薄氧化物层或浅沟槽隔离(STI)结构上形成的第一材料,以及包括在薄氧化物层或STI结构上形成的第二材料的第二导体。 第二导体与第一导体重叠以形成至少大于对准公差的热电偶结或尺寸。 选择第一和第二材料使得它们之间形成的热电偶结点呈现非零塞贝克系数。 形成在第一导体和第二导体上的导电膜和不导电的空隙或膜形成在热电偶结上。