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    • 102. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY AND FABRICATION METHOD FOR THE SAME
    • 非易失性半导体存储器及其制造方法
    • US20090239365A1
    • 2009-09-24
    • US12480383
    • 2009-06-08
    • Yasuhiko MATSUNAGA
    • Yasuhiko MATSUNAGA
    • H01L21/71H01L21/28
    • H01L27/115H01L27/11526H01L27/11529
    • A nonvolatile semiconductor memory that allows simultaneous implementation of high performance transistors in a low-voltage circuit region and transistors with high withstand voltages in a high-voltage circuit region. The nonvolatile semiconductor memory includes a cell array region that comprises aligned memory cell transistors, each including a control gate electrode, which includes a metal silicide film, an inter-gate insulating film below the control gate electrode, a floating gate electrode below the inter-gate insulating film, and a tunnel insulating film under the floating gate electrode; a high-voltage circuit region arranged in a periphery of the cell array region and including a high voltage transistor, which includes a first gate insulating film thicker than the tunnel insulating film; and a low-voltage circuit region that is arranged in a different position than the high-voltage circuit region arranged in the periphery of the cell array region and that includes a low-voltage transistor, which includes a gate electrode and a second gate insulating film thinner than the first gate insulating film below the gate electrode.
    • 一种非易失性半导体存储器,其允许在高压电路区域中同时实现低电压电路区域中的高性能晶体管和在高压电路区域中具有高耐受电压的晶体管。 非易失性半导体存储器包括:单元阵列区域,其包括排列的存储单元晶体管,每个存储单元晶体管包括控制栅电极,其包括金属硅化物膜,位于控制栅极电极下方的栅极间绝缘膜, 栅极绝缘膜和在浮栅电极下方的隧道绝缘膜; 布置在电池阵列区域的外围并包括高压晶体管的高压电路区域,其包括比隧道绝缘膜厚的第一栅极绝缘膜; 以及低压电路区域,其布置在与布置在电池阵列区域周围的高电压电路区域不同的位置,并且包括低电压晶体管,该低压晶体管包括栅极电极和第二栅极绝缘膜 比栅电极下方的第一栅绝缘膜薄。
    • 105. 发明申请
    • SEMICONDUCTOR MEMORY
    • 半导体存储器
    • US20080290396A1
    • 2008-11-27
    • US12125546
    • 2008-05-22
    • Yasuhiko MATSUNAGAYuji TakeuchiTakashi Shigeoka
    • Yasuhiko MATSUNAGAYuji TakeuchiTakashi Shigeoka
    • H01L29/00
    • H01L27/105H01L27/0207H01L27/11519H01L27/11526H01L27/11529
    • A semiconductor memory according to an aspect of this invention comprises a semiconductor substrate which includes a memory cell array region and an interconnect line region adjoining the memory cell array region, memory cells which are provided in the memory cell array region, contact plugs which are provided in the interconnect line region, and control gate lines which are provided so as to extend from the interconnect line region to the memory cell array region and which connect the contact plugs with the memory cells, wherein the control gate lines provided in the memory cell array region include metal silicide and the control gate lines provided in the interconnect line region include no metal silicide at any part of the interconnect line region.
    • 根据本发明的一个方面的半导体存储器包括半导体衬底,其包括存储单元阵列区域和与存储单元阵列区域相邻的互连线区域,设置在存储单元阵列区域中的存储单元,提供的接触插头 以及控制栅极线,其设置为从互连线区域延伸到存储单元阵列区域,并将接触插头与存储器单元连接,其中设置在存储单元阵列中的控制栅极线 区域包括金属硅化物,并且设置在互连线区域中的控制栅极线在互连线区域的任何部分不包括金属硅化物。
    • 106. 发明申请
    • SEMICONDUCTOR DEVICE WITH DOUBLE BARRIER FILM
    • 具有双屏障膜的半导体器件
    • US20080251881A1
    • 2008-10-16
    • US12143597
    • 2008-06-20
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L29/00
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 109. 发明授权
    • Ion implantation method, SOI wafer manufacturing method and ion implantation system
    • 离子注入法,SOI晶片制造方法和离子注入系统
    • US07064049B2
    • 2006-06-20
    • US10630293
    • 2003-07-30
    • Hiroyuki ItoYasuhiko Matsunaga
    • Hiroyuki ItoYasuhiko Matsunaga
    • H01L21/26
    • H01J37/08H01J2237/0817H01J2237/31701H01L21/26506H01L21/76254
    • The present invention provides an ion implantation method which can achieve sufficient throughput by increasing a beam current even in the case of ions with a small mass number or low-energy ions, an SOI wafer manufacturing method, and an ion implantation system. When ions are implanted by irradiating a semiconductor substrate with an ion beam, predetermined gas is excited in a pressure-reduced chamber to generate plasma containing predetermined ions, a magnetic field is formed by a solenoid coil or the like along an extraction direction when the ions are extracted to the outside of the chamber, and the ions are extracted from the chamber with predetermined extraction energy. The formation of the magnetic field promotes ion extraction, but this magnetic field has no influence on an advancing direction of the extracted ions. Therefore, the ion beam current can be kept at a high level-to contribute to the ion implantation.
    • 本发明提供了一种离子注入方法,其即使在具有小质量或低能量离子的离子,SOI晶片制造方法和离子注入系统的情况下也可以通过增加射束电流来实现足够的通过量。 当通过用离子束照射半导体衬底来注入离子时,在减压室中激发预定的气体以产生含有预定离子的等离子体,当离子的离子沿着提取方向由螺线管线圈等形成磁场时 被提取到室的外部,并且以预定的提取能从室抽出离子。 磁场的形成促进离子提取,但是该磁场对提取的离子的前进方向没有影响。 因此,离子束电流可以保持在高水平 - 有助于离子注入。