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101. 发明授权

US07768225B2 Servo control system for movable body, and laser drilling machine 有权
标题翻译：移动体伺服控制系统，激光钻孔机
公开(公告)号：US07768225B2
公开(公告)日：2010-08-03
申请号：US11049706
申请日：2005-02-04
申请人： Souichi Toyama , Yaichi Okubo , Hiromu Hirai , Makoto Iwasaki , Motohiro Kawafuku , Noriaki Hirose
发明人： Souichi Toyama , Yaichi Okubo , Hiromu Hirai , Makoto Iwasaki , Motohiro Kawafuku , Noriaki Hirose
IPC分类号： G06F19/00 , B23K26/04
CPC分类号： B23K26/10 , B23K26/382 , B23K2103/50
摘要： A difference between each position command data outputted in a form of a step signal from a high-level controller and its corresponding detected position data of a movable body is integrated by an integral compensator to position the movable body. Assuming, for example, that the movable body is a steerable mirror, digital filters are arranged to compensate the value of an initial state of an angular displacement and the value of an initial state of an angular velocity, respectively, and respective impulse responses of the digital filters as additional input elements are added to an output terminal of the integral compensator. For higher effectiveness, internal state variables of the digital filters can desirably be cleared to zero whenever an angle (position) command data is received.
摘要翻译：通过积分补偿器将来自高级别控制器的步进信号输出的每个位置指令数据和可移动体的对应检测位置数据之间的差积分在一起，以定位移动体。假设例如可移动体是可转向反射镜，数字滤波器被布置成分别补偿角位移的初始状态的值和角速度的初始状态的值以及相应的脉冲响应作为附加输入元件的数字滤波器被添加到积分补偿器的输出端子。为了更高的有效性，每当接收到角度（位置）命令数据时，数字滤波器的内部状态变量可期望地被清除为零。

102. 发明申请

US20100027570A1 FIBER LASER BASED PRODUCTION OF LASER DRILLED MICROVIAS FOR MULTI-LAYER DRILLING, DICING, TRIMMING OR MILLING APPLICATIONS 有权
标题翻译：基于光纤激光器的激光钻孔微孔钻机，多层钻孔，定位，铣削或铣削应用
公开(公告)号：US20100027570A1
公开(公告)日：2010-02-04
申请号：US12509833
申请日：2009-07-27
申请人： Todd E. LIZOTTE , Orest OHAR
发明人： Todd E. LIZOTTE , Orest OHAR
IPC分类号： H01S3/30 , H01S5/00
CPC分类号： B23K26/0604 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/123 , B23K26/389 , B33Y30/00 , B33Y40/00 , G02B6/0008 , H01S3/005 , H01S3/0057 , H01S3/067 , H01S3/0804 , H01S3/0817 , H01S3/094011 , H01S3/094076 , H01S3/09415 , H01S3/10046 , H01S3/11 , H05K3/0026
摘要： Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components.
摘要翻译：光纤激光器和用于构造和使用光纤激光器的微/纳米加工的方法，输出光束包括堆叠脉冲以及连续波，伪连续波和脉冲序列分量的组合。

103. 发明申请

US20090111062A1 Pattern Formation Method 审中-公开
标题翻译：图案形成方法
公开(公告)号：US20090111062A1
公开(公告)日：2009-04-30
申请号：US12260546
申请日：2008-10-29
申请人： Masako Kato , Yoshihide Yamaguchi , Takehiko Hasebe , Masakazu Kishi , Tsuyoshi Yamaguchi
发明人： Masako Kato , Yoshihide Yamaguchi , Takehiko Hasebe , Masakazu Kishi , Tsuyoshi Yamaguchi
IPC分类号： G03F7/20
CPC分类号： G03F7/095 , G03F7/0952 , G03F7/2024 , H05K3/0023 , H05K3/0082 , H05K3/106 , H05K3/28 , H05K2203/0505 , H05K2203/0551
摘要： The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material.
摘要翻译：本发明提供了一种图案形成方法，包括以下步骤：在基板上形成具有低光敏性的第一感光材料的膜，所述第一感光材料具有从无掩模拉制曝光装置发射的h线处的主波长的光束，但是具有高的对含有紫外光的能量光束的敏感性; 在第一感光材料上形成对具有主要波长为h线的光束具有较高灵敏度的第二感光材料的膜; 用无掩模直接拉伸曝光装置在第二感光材料上绘制第二图案的步骤; 显影第二感光材料的步骤; 以及将第二感光材料以第二图案形成在第一感光材料上并分批照射第一感光材料以在第一感光材料上形成目标第一图案的步骤。

104. 发明申请

US20090086009A1 Laser Direct Imaging Apparatus and Imaging Method 有权
标题翻译：激光直接成像设备和成像方法
公开(公告)号：US20090086009A1
公开(公告)日：2009-04-02
申请号：US12191901
申请日：2008-08-14
申请人： Yoshitatsu Naito , Mitsuhiro Suzuki , Tomotsugu Katoh
发明人： Yoshitatsu Naito , Mitsuhiro Suzuki , Tomotsugu Katoh
IPC分类号： B41J2/47
CPC分类号： H05K3/0082 , G03F7/2053 , G03F9/00 , H05K1/0269 , H05K3/0008 , H05K2201/091 , H05K2201/09918 , H05K2203/082 , H05K2203/107 , H05K2203/1563 , H05K2203/1572 , H05K2203/167
摘要： A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins 20 project over the surface of the table by a predetermined distance. The workpiece is sucked onto the table so that indentations (indentations by the tips of the hollow pins) are formed on the back surface of the workpiece. When a pattern is imaged on the back surface, imaging is performed with reference to the indentations.
摘要翻译：即使使用任何种类的感光材料，也可以精确地确定相对于前表面侧位置的背面侧位置的激光束直接成像装置和成像方法。在激光直接成像装置中，激光束朝向主扫描方向（X轴方向）偏转，同时安装在工作台上的工件沿副扫描方向（Y轴方向）移动，使得图案被成像在工件表面。空心销设置在桌子上，使得中空销20的尖端在桌子的表面上突出预定距离。工件被吸入工作台上，使得在工件的后表面上形成有凹陷（由中空销的顶端压入）。当在背面上成像图案时，参考凹痕进行成像。

105. 发明授权

US07499207B2 Beam shaping prior to harmonic generation for increased stability of laser beam shaping post harmonic generation with integrated automatic displacement and thermal beam drift compensation 失效
标题翻译：谐波产生之前的光束成形，以提高激光束成形后谐波发生的稳定性，并具有集成的自动位移和热束偏移补偿
公开(公告)号：US07499207B2
公开(公告)日：2009-03-03
申请号：US11517923
申请日：2006-09-07
申请人： Todd E. Lizotte
发明人： Todd E. Lizotte
IPC分类号： G02F1/35
CPC分类号： H01S3/005 , G02B27/0927 , G02F1/37 , G02F2001/372
摘要： A harmonic generation/beam shaping system to generate a shaped beam having a harmonic relationship with a beam generated by a laser, including a first harmonic generation element and a second harmonic generation element arranged sequentially along an axial beam path extending between an input from the laser and an output of the harmonic generation/beam shaping system and at least two beam shaping elements located along the axial beam path. At least one of the least two beam shaping elements is located between the second harmonic generation element and the laser to transform the beam energy profile into a preferred profile to distribute the beam energy across a larger cross sectional area of at least one harmonic generation element or to reduce peaks in the energy distribution profile of the beam, or both, wherein the preferred profile may be a flat-top profile or a Bessel function profile.
摘要翻译：一种谐波发生/光束整形系统，用于产生与由激光器产生的光束具有谐波关系的成形光束，包括一个第一谐波发生元件和二次谐波产生元件，该元件沿着沿着激光输入端的轴向光束路径顺序排列以及谐波产生/光束成形系统的输出和沿轴向光束路径定位的至少两个光束成形元件。至少两个光束整形元件中的至少一个位于第二谐波产生元件和激光器之间，以将光束能量分布转换成优选的分布，以将光束能量分布在至少一个谐波产生元件的较大截面面积上，或以减小光束或两者的能量分布轮廓中的峰值，其中优选的轮廓可以是平顶轮廓或贝塞尔函数轮廓。

106. 发明授权

US07476065B2 Printed board drilling method and printed board machining apparatus 失效
标题翻译：印刷板钻孔方法和印刷板加工装置
公开(公告)号：US07476065B2
公开(公告)日：2009-01-13
申请号：US11139588
申请日：2005-05-31
申请人： Nobuhiko Suzuki , Katsuhiro Nagasawa
发明人： Nobuhiko Suzuki , Katsuhiro Nagasawa
IPC分类号： B23B35/00
CPC分类号： H05K3/0047 , B23Q17/2233 , H05K2203/0207 , Y10T408/03 , Y10T408/175 , Y10T408/36 , Y10T408/50 , Y10T408/5623
摘要： A printed board drilling method and a printed board machining apparatus capable of improving machining quality, such as improving positional accuracy of holes and true roundness of machined holes, and improving work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out of a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle holds the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.
摘要翻译：一种能够改善加工质量的印刷板钻孔方法和印刷板加工装置，例如提高孔的位置精度和加工孔的真实圆度，并且通过最小化钻头尖端的跳动来提高加工效率。当钻头由主轴保持时，从主轴延伸出来的钻头的延伸部分是根据每个钻头的类型或使用方式进行预先确定的。在对应于在印刷板中要钻孔的孔的形状的多个钻孔中选择一个钻头，并且主轴保持钻头，使得所选择的钻头通过对应于所选钻头的延伸而从主轴延伸出轴。然后，控制主轴相对于印刷电路板的移动，所选择的钻头由主轴旋转驱动以钻出印刷电路板。

107. 发明申请

US20080314625A1 Printed Circuit Board and Method of Manufacturing the Same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080314625A1
公开(公告)日：2008-12-25
申请号：US12143214
申请日：2008-06-20
申请人： Kazunori HAMADA , Hiroshi Kawasaki , Tomoaki Ozaki
发明人： Kazunori HAMADA , Hiroshi Kawasaki , Tomoaki Ozaki
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K3/0047 , H05K1/0237 , H05K1/0268 , H05K3/429 , H05K2203/0207 , H05K2203/0242 , Y10T29/49124 , Y10T29/49156 , Y10T29/49167
摘要： The present invention relates to a method of manufacturing a printed circuit board and to a printed circuit board, the method comprising the steps of: preliminarily forming a plurality of test pattern layers 3 and 4 for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer 2; applying a voltage between the surface conductor layer 2 and the test pattern layers 3 and 4; performing drilling toward one selected test pattern layer 3 by use of a drill 7 for drilling, and detecting a current produced when the drill comes into contact with the test pattern 3 to measure the depth of the layer (D1); performing drilling toward the other test pattern layer 4 by use of the drill 7, and measuring the depth of the layer (D2); and performing drilling by use of the drill 7 up to just before the conductor-wiring layer 10a with reference to a depth calculated from D1 and D2.
摘要翻译：本发明涉及一种制造印刷电路板和印刷电路板的方法，所述方法包括以下步骤：预先形成用于检测多层印刷中的内层的深度的多个测试图案层3和4 电路板，使得当从钻入口侧观察时，下测试图案层的至少一部分不与任何上测试图案层重叠，并且预先形成表面导体层2; 在表面导体层2和测试图案层3和4之间施加电压; 通过使用用于钻孔的钻头7对一个所选择的测试图案层3进行钻孔，并且检测当钻头与测试图案3接触以测量层（D1）的深度时产生的电流; 通过使用钻头7对另一测试图案层4进行钻孔，并测量层（D2）的深度; 并且参照从D1和D2计算的深度，使用钻头7直到刚好在导体布线层10a之前进行钻孔。

108. 发明申请

US20080244158A1 Drawing Apparatus 有权
标题翻译：绘图仪
公开(公告)号：US20080244158A1
公开(公告)日：2008-10-02
申请号：US12033549
申请日：2008-02-19
申请人： Terunobu FUNATSU , Yoshihisa OSAKA , Hitoshi IKEGAMI
发明人： Terunobu FUNATSU , Yoshihisa OSAKA , Hitoshi IKEGAMI
IPC分类号： G06F12/00
CPC分类号： G06F12/0804 , G09G5/36 , G09G5/393 , G09G2340/02 , G09G2360/121
摘要： A drawing apparatus which can create an exposure pattern rapidly. The drawing apparatus has a raster conversion processing module for converting vector images as wiring patterns into bitmap image data, an image cache module for temporarily storing a predetermined-size cached image supplied from the raster conversion processing module, a first compression module for compressing the cached image stored in the image cache module, a second compression module for compressing the cached image stored in the image cache module in a compression ratio differing from that of the first compression module, a comparison module for comparing data sizes of compressed data generated by the first and second compression modules and selecting one having a smaller data size, a memory access module for writing the compressed data selected by the comparison module, into a storage module, and a cache region control module for controlling a compression status of the cached image.
摘要翻译：可以快速创建曝光图案的绘图装置。绘图装置具有用于将作为布线图案的矢量图像转换为位图图像数据的光栅转换处理模块，用于临时存储从光栅转换处理模块提供的预定大小的缓存图像的图像高速缓存模块，用于压缩缓存的第一压缩模块存储在图像缓存模块中的图像，用于以与第一压缩模块不同的压缩比压缩存储在图像缓存模块中的高速缓存图像的第二压缩模块，用于比较由第一压缩模块生成的压缩数据的数据大小的比较模块和第二压缩模块，并且选择具有较小数据大小的存储器访问模块，用于将由比较模块选择的压缩数据写入存储模块的存储器访问模块，以及用于控制缓存图像的压缩状态的高速缓存区域控制模块。

109. 发明申请

US20080237204A1 Laser Beam Machining Method for Printed Circuit Board 审中-公开
标题翻译：印刷电路板激光束加工方法
公开(公告)号：US20080237204A1
公开(公告)日：2008-10-02
申请号：US12031232
申请日：2008-02-14
申请人： Goichi Ohmae , Hiroshi Aoyama , Masayuki Shiga , Shigenobu Maruyama
发明人： Goichi Ohmae , Hiroshi Aoyama , Masayuki Shiga , Shigenobu Maruyama
IPC分类号： B23K26/38
CPC分类号： H05K3/0026 , B23K26/066 , B23K26/0732 , B23K26/361 , B23K2101/42 , H05K2203/0557
摘要： A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam 4, which is shaped into a rectangular having a length sufficiently larger than its width, in a cross-section perpendicular to a central axis thereof; executing a belt-like machining on a certain region of the printed circuit board 6, while moving a mask 1 and the printed circuit board 6 in opposite directions, in a direction of the width of the line beam 4 (i.e., X-direction); and thereafter moving the mask 1 and the printed circuit board 6, relatively, into a direction perpendicular to the belt-like machining direction, and repeating the belt-like machining upon other region, newly, thereby machining a groove on the printed circuit board 6, wherein when repeating the machining overlapping the regions, the machining is conducted with using the line beam 4 being shaped to be oblique on its overlapping side, to be overlapped on that region.
摘要翻译：一种用于印刷电路板的激光束加工方法，其能够使被激光束照射的重叠区域内的凹槽的底面的深度重复地与槽的底面的深度相等在其他区域内，包括以下步骤：在垂直于其中心轴线的横截面中固定成形为具有足够大于其宽度的长度的矩形的线束4; 在沿着线束4的宽度方向（即X方向）移动掩模1和印刷电路板6的相反方向上，在印刷电路板6的某个区域上执行带状加工， ; 然后将掩模1和印刷电路板6相对地移动到垂直于带状加工方向的方向上，并且重新进行其他区域的带状加工，从而在印刷电路板6上加工凹槽其中，当重复所述加工与所述区域重叠时，使用在其重叠侧成形为倾斜的线束4进行加工，以在该区域上重叠。

110. 发明申请

US20080232421A1 Method and Apparatus for Forming a Plurality of Laser Beams With Ultraviolet Wavelength, and Laser Machining Apparatus 审中-公开
标题翻译：用紫外线波长形成多个激光束的方法和装置以及激光加工装置
公开(公告)号：US20080232421A1
公开(公告)日：2008-09-25
申请号：US12111224
申请日：2008-04-29
申请人： Goichi Ohmae , Hiroshi Aoyama
发明人： Goichi Ohmae , Hiroshi Aoyama
IPC分类号： H01S3/08
CPC分类号： G02F1/37 , B23K26/064 , B23K26/0673
摘要： The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter. An ultraviolet laser beam whose wavelength is ⅓ of the near infrared wavelength of the laser beam is formed out of the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength by another wavelength converter, both the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength being output from the wavelength converter. The ultraviolet laser beam is extracted and supplied to a portion to be machined, by a wavelength separator.
摘要翻译：本发明提供一种用于形成多个紫外波长激光束的方法和装置，以及激光加工装置，其中由于易于维护和检查而可以提高加工效率，同时可以防止波长转换装置的劣化降低运行成本。从激光振荡器输出的具有近红外波长的激光束通过激光分配单元分支成多个激光束。每个分支的激光束被波长转换器部分地转换成其波长为近红外波长的1/2的激光束。波长为激光束的近红外波长的1/3的紫外激光束由分支激光束和波长为近红外波长的1/2的激光束由另一波长转换器形成，激光束和波长为近红外波长1/2的波长的激光束从波长转换器输出。通过波长分离器将紫外线激光束提取并供给到待加工的部分。

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