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    • 92. 发明授权
    • Plasma etching of porous substrates
    • 多孔基材的等离子体蚀刻
    • US09595422B2
    • 2017-03-14
    • US15072141
    • 2016-03-16
    • IMEC VZWKatholieke Universiteit Leuven
    • Mikhaïl BaklanovLiping ZhangJean-Francois de Marneffe
    • B31D3/00H01J37/32H01L21/3105H01L21/311H01L21/768
    • H01J37/32009H01J2237/334H01L21/3105H01L21/31116H01L21/76814H01L21/76826
    • The disclosed technology generally relates to semiconductor fabrication, and more particularly to plasma etching of dielectric materials having pores. In one aspect, a method for etching a porous material in an environment includes contacting the porous material with an organic gas at a pressure and a temperature. The organic gas is such that at the pressure and the temperature, the organic gas remains in a gas state when outside of the porous material, while the organic gas condenses into an organic liquid upon contacting the porous material. Upon contacting the porous material, the organic gas thereby fills the pores of the porous material with the organic liquid. Subsequent to contacting the porous material, the method additionally includes plasma etch-treating of the porous material having filled pores, thereby evaporating a fraction of the organic liquid filling the pores of the porous material.
    • 所公开的技术通常涉及半导体制造,更具体地涉及具有孔的电介质材料的等离子体蚀刻。 一方面,在环境中蚀刻多孔材料的方法包括在压力和温度下使多孔材料与有机气体接触。 有机气体使得在压力和温度下,有机气体在多孔材料外部保持为气态,而有机气体在与多孔材料接触时冷凝成有机液体。 当接触多孔材料时,有机气体由此用有机液体填充多孔材料的孔隙。 在多孔材料接触之后,该方法另外包括等离子体蚀刻处理具有填充孔的多孔材料,由此蒸发填充多孔材料的孔的有机液体的一部分。
    • 97. 发明授权
    • Tray for CVD and method for forming film using same
    • 用于CVD的托盘和使用其形成膜的方法
    • US08685855B2
    • 2014-04-01
    • US13513610
    • 2010-11-29
    • Takashi NakayamaTomoyuki KabasawaTakayuki Kihara
    • Takashi NakayamaTomoyuki KabasawaTakayuki Kihara
    • H01L21/44B31D3/00C23C16/00
    • C23C16/4585
    • A tray for film formation by a CVD method includes a tray main body (2) and a supporting member (3) mounted on the tray main body (2) for supporting a silicon wafer (5). The supporting member (3) has a holding portion (3c), on which the silicon wafer (5) is directly placed. The holding portion (3c) has its lower surface (3d) apart from a surface (2a) of the tray main body that is opposed to and apart from the supported silicon wafer (5), whereby the thickness distribution of an oxide film formed on the silicon wafer can be made uniform. The tray has a structure for reducing a contact area between the supporting member (3) and the tray main body (2), with the holding portion (3c) having a tilted surface with its inner circumferential side closer to the tray main body surface (2a) that is opposed to the silicon wafer.
    • 用于通过CVD法成膜的托盘包括托盘主体(2)和安装在用于支撑硅晶片(5)的托盘主体(2)上的支撑构件(3)。 支撑构件(3)具有保持部(3c),硅晶片(5)直接放置在该保持部分上。 保持部(3c)的下表面(3d)与托盘主体的与支撑硅晶片(5)相对且分开的表面(2a)分开,由此形成在氧化膜上的厚度分布 可以使硅晶片均匀。 托盘具有用于减小支撑构件(3)和托盘主体(2)之间的接触面积的结构,其中保持部分(3c)具有倾斜表面,其内周侧更接近托盘主体表面( 2a),其与硅晶片相对。