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    • 94. 发明授权
    • Fatigue-resistant lead-free alloy
    • 耐疲劳无铅合金
    • US5938862A
    • 1999-08-17
    • US70070
    • 1998-04-03
    • Shing YehCurtis Wayne MelcherBradley Howard Carter
    • Shing YehCurtis Wayne MelcherBradley Howard Carter
    • B23K35/26C22C13/00C22C7/00
    • B23K35/262C22C13/00
    • A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.
    • 适用于形成表面贴装集成电路器件如倒装芯片的焊点的无铅焊料合金。 焊料合金具有足够低的液相线温度,以在240℃以下的温度下实现期望的回流性能,因此与集成电路工艺兼容。 焊料合金具有足够高的固相线温度,以确保当将组件安装到层压基板上时,由合金形成的焊点在高达150℃的应用温度下表现出适当的机械性能。 焊料合金通常含有约7至约11%的铟,约2.5至约3.5%的银和约0.5至约1.5%的铜,余量为锡和附带的杂质。