专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

US10065288B2 Chemical mechanical polishing (CMP) platform for local profile control 有权
公开(公告)号：US10065288B2
公开(公告)日：2018-09-04
申请号：US14829995
申请日：2015-08-19
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Jiann Lih Wu , Chi-Ming Yang , James Jeng-Jyi Hwang
IPC分类号： B24B37/013 , B24B37/015 , B24B49/04 , B24B49/14 , H01L21/306 , H01L21/66 , H01L21/67 , B24B49/10 , B24B37/04 , B24B37/10
摘要： A localized chemical mechanical polishing (CMP) platform is provided. A table is configured to support a workpiece with a to-be-polished surface. A polishing pad is spaced from the table with a width less than about half that of the table. The polishing pad is configured to individually polish rough regions of hillocks or valleys on the to-be-polished surface. A slurry distribution system is configured to apply slurry to an interface between the polishing pad and the workpiece. A cleaning system is configured to clean the workpiece in situ on the table. A drying system is configured to dry the workpiece in situ on the table. A method for CMP with local profile control and a system with local profile control are also provided.

92. 发明授权

US09999956B2 Polishing device and polishing method 有权
公开(公告)号：US09999956B2
公开(公告)日：2018-06-19
申请号：US14672747
申请日：2015-03-30
申请人： Ebara Corporation
发明人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima , Shingo Togashi , Satoru Yamaki , Shintaro Isono
IPC分类号： B24B37/015 , B24B37/32 , B24B37/34 , B24B49/00 , B24B49/10 , B24B49/12
CPC分类号： B24B37/015 , B24B37/32 , B24B37/345 , B24B49/003 , B24B49/105 , B24B49/12
摘要： A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.

93. 发明申请

US20180021917A1 POLISHING METHOD AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20180021917A1
公开(公告)日：2018-01-25
申请号：US15697047
申请日：2017-09-06
申请人： EBARA CORPORATION
发明人： Toru MARUYAMA , Hisanori MATSUO , Yasuyuki MOTOSHIMA
IPC分类号： B24B37/015 , B24B49/14 , G01J5/02 , G01J5/00
CPC分类号： B24B37/015 , B24B49/14 , B24B55/02 , G01J5/025 , G01J2005/0085
摘要： A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

94. 发明授权

US09855637B2 Thermographic characterization for surface finishing process development 有权
公开(公告)号：US09855637B2
公开(公告)日：2018-01-02
申请号：US14638892
申请日：2015-03-04
申请人： Apple Inc.
发明人： Lucas Allen Whipple , Simon Regis Louis Lancaster-Larocque , Collin D. Chan , Christopher R. Fagan , Vincent Yan , Ian S. Theilacker , Brian K. Miehm , Shravan Bharadwaj
IPC分类号： B24B49/14 , B24B49/12 , B24B49/16 , B24B49/00 , B24B37/015
CPC分类号： B24B49/14 , B24B5/00 , B24B7/00 , B24B29/00 , B24B37/015 , B24B41/061 , B24B49/006 , B24B49/12 , B24B49/16
摘要： A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

95. 发明授权

US09707659B2 Method and apparatus for polishing workpiece 有权
公开(公告)号：US09707659B2
公开(公告)日：2017-07-18
申请号：US13976205
申请日：2011-10-19
申请人： Shinichi Ogata , Ryuichi Tanimoto , Keiichi Takanashi
发明人： Shinichi Ogata , Ryuichi Tanimoto , Keiichi Takanashi
IPC分类号： B24B37/005 , B24B37/015 , B24B37/08 , B24B37/14 , B24B49/14
CPC分类号： B24B37/005 , B24B37/015 , B24B37/08 , B24B49/14
摘要： In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.

96. 发明授权

US09463546B1 System and method for dissipating heat from a rotary power tool 有权
标题翻译：用于从旋转电动工具散热的系统和方法
公开(公告)号：US09463546B1
公开(公告)日：2016-10-11
申请号：US13862025
申请日：2013-04-12
申请人： Jack M. King, Jr.
发明人： Jack M. King, Jr.
IPC分类号： B24B7/18 , B24B55/10 , B24B37/015
CPC分类号： B24B7/186 , B23D59/006 , B23D59/02 , B24B37/015 , B24B55/02 , B24B55/102 , B25F5/008 , B28D7/02 , Y10T29/49826 , Y10T83/207 , Y10T408/50
摘要： A device for dissipating heat from a rotary power tool is disclosed. The rotary power tool comprises a hollow disc housing. On the top planar surface of the hollow disc housing, a plurality of hollow bolts traverse the surface of the hollow disc housing into the interior of the hollow disc housing. In the interior of the hollow disc housing, the hollow bolts create a substantially angled plane relative to the top planar surface of the hollow disc housing. The hollow disc housing encloses a heatsink. When the heatsink spins, it creates a vacuum, thereby drawing exterior air through the hollow bolts. The angled plane created by the hollow bolts directs the flow of air through the heatsink. The combination of the heatsink and the directed air flow serves to cool the rotary power tool and prevent overheating.
摘要翻译：公开了一种用于从旋转电动工具散热的装置。旋转动力工具包括中空盘壳体。在中空盘壳体的顶部平坦表面上，多个中空螺栓将中空盘壳体的表面穿过中空盘壳体的内部。在中空盘壳体的内部，空心螺栓相对于中空盘壳体的顶部平坦表面形成基本成角度的平面。中空盘壳体包围散热器。当散热器旋转时，它产生真空，从而通过中空螺栓吸引外部空气。由空心螺栓产生的倾斜平面将空气流引导通过散热器。散热器和定向空气流的组合用于冷却旋转电动工具并防止过热。

97. 发明授权

US09174322B2 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US09174322B2
公开(公告)日：2015-11-03
申请号：US14193774
申请日：2014-02-28
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Yukiteru Matsui , Akifumi Gawase , Hajime Eda
IPC分类号： B24B37/00 , B24B37/04 , B24B53/017 , B24B37/015 , B24B49/00 , B24B49/16
CPC分类号： B24B37/042 , B24B37/015 , B24B49/006 , B24B49/16 , B24B53/017
摘要： In accordance with an embodiment, a manufacturing method of a semiconductor device includes forming a polish target film on a substrate and conducting a CMP process for the polish target film. The conducting the CMP process includes bringing a surface of the polish target film into contact with a surface of a polishing pad with a negative Rsk value, and adjusting friction dependency on polishing speed between the polish target film and the polishing pad to a value that restrains the occurrence of a stick slip to polish the polish target film.
摘要翻译：根据实施例，半导体器件的制造方法包括在衬底上形成抛光目标膜并对抛光目标膜进行CMP处理。进行CMP工艺包括使抛光目标膜的表面与抛光垫的表面接触，具有负Rsk值，并且将抛光目标膜和抛光垫之间的研磨速度的摩擦依赖性调节到抑制的值发生粘滑擦擦抛光目标胶片。

98. 发明申请

US20150196988A1 POLISH APPARATUS AND POLISH METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20150196988A1
公开(公告)日：2015-07-16
申请号：US14301713
申请日：2014-06-11
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takashi WATANABE
IPC分类号： B24B37/015 , B24B37/34 , H01L21/304 , B24B49/14 , B24B55/03 , B24B37/04 , B24B49/12
CPC分类号： B24B37/015 , B24B37/042 , B24B37/34 , B24B49/12 , B24B49/14 , B24B55/03 , H01L21/3212 , H01L21/7684
摘要： A polish apparatus including a polish pad including a polish surface configured to contact a polish object; and a coolant injector configured to inject a coolant to the polish surface and cool the polish pad by a vaporization heat.
摘要翻译：一种抛光装置，包括抛光垫，其包括配置成接触抛光物体的抛光表面; 以及冷却剂喷射器，其构造成将冷却剂喷射到抛光表面并通过蒸发热来冷却抛光垫。

99. 发明授权

US09067296B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US09067296B2
公开(公告)日：2015-06-30
申请号：US13454146
申请日：2012-04-24
申请人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
发明人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
IPC分类号： B24B37/015 , B24B37/04 , B24B37/10 , B24B57/02
CPC分类号： B24B37/015 , B24B37/042 , B24B37/105 , B24B57/02
摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
摘要翻译：提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。抛光方法包括事先确定抛光液的供给流量与抛光基板时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

100. 发明申请

US20150093968A1 POLISHING APPARATUS AND METHOD 审中-公开
公开(公告)号：US20150093968A1
公开(公告)日：2015-04-02
申请号：US14563358
申请日：2014-12-08
申请人： EBARA CORPORATION
发明人： Makoto FUKUSHIMA , Katsuhide WATANABE , Hozumi YASUDA , Satoru YAMAKI
IPC分类号： B24B37/015 , H01L21/67 , B24B37/30 , H01L21/683
CPC分类号： B24B37/005 , B24B37/015 , B24B37/10 , B24B37/30 , H01L21/67017 , H01L21/67092 , H01L21/6838
摘要： A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式