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    • 92. 发明授权
    • Stripping liquid for use in separating paper from plaster/paper laminate
    • 剥离纸用于从石膏/纸层压板中分离纸张
    • US08137503B2
    • 2012-03-20
    • US12223461
    • 2007-02-05
    • Shingo HiranakaGenji Taga
    • Shingo HiranakaGenji Taga
    • B29C41/14
    • B32B43/006B32B2315/18B32B2317/12C11D7/10C11D7/265Y10T156/1111Y10T156/1174Y10T156/1184Y10T156/1928
    • A stripping liquid of the present invention is used for separating the paper from a plaster/paper laminate such as waste plasterboard, and comprises an aqueous solution of an alkali metal salt or an ammonium salt of carboxylic acid. The stripping liquid is fed onto the surface (paper surface) of the plaster/paper laminate so as to infiltrate into the bonding surface between the plaster and the paper, so that the carboxylate is made present on the bonding surface. Upon stripping off the paper in the presence of the carboxylate, it is allowed to entirely separate the paper from the plaster. Upon mixing the stripping liquid and a nonionic surfactant or a water-soluble organic solvent together, further, the stripping liquid can be quickly and reliably infiltrated into the bonding surface between the plaster and the paper.
    • 本发明的剥离液用于从诸如废石膏板的石膏/纸层压材料中分离纸,并且包含碱金属盐或羧酸铵盐的水溶液。 将剥离液供给到石膏/纸层压板的表面(纸面)上,以便渗透到石膏和纸之间的粘合表面中,使得羧酸盐存在于粘合表面上。 在羧酸盐存在下剥离纸时,允许纸与石膏完全分离。 在将剥离液与非离子表面活性剂或水溶性有机溶剂混合在一起的同时,剥离液可以快速可靠地渗透到石膏和纸之间的粘合表面中。
    • 95. 发明申请
    • SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE
    • 支撑板,剥离支撑板的装置和方法
    • US20110146899A1
    • 2011-06-23
    • US13036761
    • 2011-02-28
    • Akihiko NAKAMURAAtsushi MIYANARIYoshihiro INAO
    • Akihiko NAKAMURAAtsushi MIYANARIYoshihiro INAO
    • B32B38/10B32B38/04
    • B29C63/0013B29L2031/3425Y10T156/1111Y10T156/1132Y10T156/1928
    • A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.
    • 一种从其厚度方向的大致中央部形成有第一贯通孔的板剥离由基板的电路形成面与粘接剂抵接的支撑板的方法,第二贯通孔 在其厚度方向的周边部分形成有用于吸引形成在板的径向方向上的第一贯通孔和第二贯通孔之间的支撑板的孔。 该方法包括从外部向板的第一穿透孔和形成在支撑板的大致中心部分中的相关联的第一穿透孔提供溶剂; 从支撑板的第一贯通孔通过形成在支撑板的表面上的与粘合剂接触并与支撑板的第一穿透孔连接的槽分配溶剂; 用溶剂溶解粘合剂; 并且从与所述槽连接的第二贯通孔排出溶剂,并形成在所述支撑板的周边部分和形成在所述板中的所述第二贯通孔。
    • 100. 发明授权
    • Thin film removing device and thin film removing method
    • 薄膜去除装置和薄膜去除方法
    • US07332056B2
    • 2008-02-19
    • US10841548
    • 2004-05-10
    • Shinji KobayashiNorihisa Koga
    • Shinji KobayashiNorihisa Koga
    • H01L21/302
    • H01L21/6708Y10S134/902Y10T156/1111Y10T156/1928Y10T156/1989
    • A thin film removing device and a thin film removing method are capable of removing straight parts of a thin film formed on a square substrate from corners of the substrate, and of suppressing the formation of mists. An approach stage 20 having flat stage plates 23 capable of being disposed substantially flush with the surface of a substrate M mounted on a support table 22 is positioned close to the substrate M mounted on the support table 22. Removing nozzles 30 jet a solvent toward edge parts of the substrate M and suck a solution produced by dissolving part of the resist in the solvent while the removing nozzles 30 are moved along side edges of the substrate M and the approach stage 20 disposed close to the substrate M. Thus, the removing nozzles 30 jet the solvent uniformly over the edge parts and corners of the substrate M and suck the solution without changing modes of jetting the solvent and sucking the solution. Consequently, straight parts of a thin film formed on the square substrate M can be removed from the corners of the substrate M, and the formation of mists can be suppressed.
    • 薄膜去除装置和薄膜去除方法能够从基板的角部去除在正方形基板上形成的薄膜的直线部分,并且抑制雾的形成。 具有能够与安装在支撑台22上的基板M的表面基本上齐平的平坦台板23的接近台20靠近安装在支撑台22上的基板M定位。 去除喷嘴30将溶剂喷射到基板M的边缘部分,并且吸取通过将抗蚀剂的一部分溶解在溶剂中而产生的溶液,同时移除喷嘴30沿着基板M的侧边缘移动,接近台20靠近 因此,除去喷嘴30将溶剂均匀地喷射在基板M的边缘部分和拐角上,并且吸取溶液而不改变喷射溶剂的方式并吸取溶液。 因此,可以从基板M的角部去除在正方形基板M上形成的薄膜的直线部分,并且可以抑制雾的形成。